Description Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for the PWB industry. For example,the ability to locate decoupling capacitors within a couple hundred microns of ... read more

Description The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increased functionality of mobile devices has required the ... read more

Description This article summarises how a copper metallization process for simultaneous via filling and through hole plating was developed on a laboratory scale and the challenges encountered by scale-up to larger industrial like electrolyte volumes. ... read more

Description This paper describes Advanced Filled Via Plating Methodology for stacked via technology. In this paper,via bottom crevice, via bottom land etching and electroless copper plating coverage is focused to achieve filled via plating enhancement. ... read more

Description A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The thermal resistance is 12 K/W. For high ... read more

Description In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous works have showed in detail,the characterization and modeling efforts regarding the impact of dielectric loss in PCBs and ... read more

Description Demand for higher speed digital signal processing is notable today in the electronics industry. To meet this demand,circuit designs that employ coplanar structure,either for both single-end and differential transmission,are increasing. The purpose of ... read more

Description Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and product power consumption are increasing as the silicon densities and signaling frequencies increase. And,the transition to ... read more

Description Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of lead-free electronic products by July 2006 are pushing the industry to evaluate and find lead free solutions soon. There are ... read more

Description Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that many electronics assemblers will be transitioning their soldering processes from traditional tin-lead alloys to lead-free alloys. ... read more

Description In the multilayer PCB industry,the process of making the inner layer is the first step in a number of complex steps that results in the production of a printed wiring board. This imaging manufacturing step comprises of a number of subprocesses ... read more

Description Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs. Circuitization of these substrates uses copper pattern plating followed by differential etching,which is called “semi-additive ... read more

Description This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing high-density package substrates and chip on films (COF). ... read more

Description By using two existing pieces of common printed wiring board manufacturing equipment,embedded resistor manufacturers can obtain laser trim results similar to the trimming obtained using a specialized probe card based laser trimmer. Existing ... read more

Description We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled and filled materials were characterized in regards to performance,reliability and manufacturability. It was demonstrated that ... read more

Description The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component placement. The embedding of the passive components inside the PCB has already been used in the industry. To meet the ... read more

Description The current worldwide market for printed circuit boards is approximately $40 billion,with the multi-layer printed circuit boards (MLB) comprising approximately 40% of the market. One of the most perplexing processing problems is poor ... read more

Description Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes that severely stress the mechanical properties of the board. For sometime,the ... read more

Description The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when more and more power and functionality is being offered in ever smaller packages,the flipchip will become mainstream in ... read more

Description New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However,in the supply chain,the PWB fabricator is often the last link that will learn what is needed in terms of packaging density,hole size, ... read more

Description Fluctuating demand for electronic equipment has led to repetitive “boom and bust” business cycles throughout the electronics “food chain.” Double ordering,inventory building and component outages in expansionary times are followed by ... read more

Description Information Technology has come a long way from the humble payroll accounting system to integrated suite of business applications,ostensibly to assist corporations to manage their businesses more effectively. IT disciplines in some ... read more

Description As PCB computing bus frequencies climb above 1GHz,measurement of the high-frequency properties of PCB materials becomes critical for design modeling. Understanding these properties and their dependence on temperature and humidity will ... read more

Description The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic processes for soldermask patterning on substrate packaging and rigid Printed Circuit Boards (PCB). These constraints have ... read more

Description Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric constant was above 80 at 1 MHz and the specific capacitance was successfully achieved 8 nF/cm2. By use of this ... read more

Description Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National Nanotechnology Initiative is matched by initiatives in Europe and Asia. But what does it mean for existing businesses and ... read more

Description Design for test rules (DFT) for in circuit test (ICT) test pads are well known and have served the industry well for nearly two decades. However,increasing PCB densities continually put pressure on board designers to eliminate ICT testpads. ... read more

Description The design and evaluation of a wide bandwidth (3 dB attenuation bandwidth > 20 GHz),50 S,coaxial probe for the electrical characterization of printed wiring board (PWB) transmission lines is described. The probe made thousands of ... read more

Description In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural faults within highly complex multi-layer PCB designs that offer extremely limited physical test access. ... read more

Description Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding technology. However,the requirement for finer pitch PCB is still increasing with shrinkage of die and wiring. Therefore, ... read more

Description The comparison of the thermal pattern and the deformation pattern both are obtained on the surface of Printed Circuit Board (PCB) was done to understand how both patterns correspond to each other. In the present study,both the FEMLAB simulator ... read more

Description This paper describes part of a research effort currently under way in the field of print defect detection. The techniques described have proven to be robust and particularly well suited for detecting troublesome bridge and bridge-like features that span the gap between pads. ... read more

Description After the world electronic circuit industry finally turned out from the unprecedented recession,the business management of today’s printed circuit industry may possibly have a chance to take a comfortable breather for a while. However,looking into ... read more

Description The world market is changing for the OEM,CEM,and electronic manufacturers. This changing market dictates that as a global industry more focus is placed on reducing the time to market for “New Product Introduction”. The current process has ... read more

Description It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the development of higher density circuits on build-up printed wiring boards. When micro via-holes are repeatedly stacked,via ... read more

Description We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of higher density and more sophisticated function of mobile devices and electronic equipment. Our report shows that there is a ... read more

Description It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen at 260°C decreases with the specimen thickness. A temperature gradient across the thickness of the sample within the furnace ... read more

Description A series of electrical plating processes to build various kinds of micro bump arrays on the organic substrates has been developed for non-permanent connections. Copper bump arrays with nickel/hard gold plating on the organic substrate with small pitches have been required for the non- ... read more

Description With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor devices are required to cope with finer patterning and higher wiring density. The semi-additive wiring process has been ... read more

Description We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as a dielectric material,and interconnect technology with Silicon through-hole. The basis is four-layer structures with copper ... read more

Description A previously developed ball grid array (BGA) solder joint vibration fatigue life prediction model,which was experimentally validated by Test Vehicle One (TV1) test data for the BGAs with and without under-filled materials,has been used to ... read more

Description In this report,the group activity of developing and proposing standard EMC models for numerical EMC simulation is presented. Our group has developed some basic and standard EMC models which contain the essential characteristics of EMC and has discussed about the calculated behaviors. ... read more

Description The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. Since there are exemptions of which product types are mandated to go lead-free,and not all components will ... read more

Description Metal-base printed circuit boards (PCBs),multilayer PCBs and embedded PCBs are constructed with a thin insulation layer. In these PCBs,particularly those used for Power Electronics,the insulation layer is stressed under a high-strength electric ... read more

Description The 2002 International Electronics Manufacturing Initiative (iNEMI) Optoelectronics roadmap anticipated a cross-over in cost-performance whereby a system using optical transmission of high speed signals would have lower overall “cost” than a ... read more

Description This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal Performance Project team. The project focused on the development of a cleanliness specification for single mode connectors. ... read more

Description The concept revealed is a simple architecture for an optical printed circuit board,which permits manufacturing with the materials normally used in printed circuit board fabrication. This concept is that the very short distances of Z travel within a ... read more

Description In order to cope with a rapid increase in information processing speed,additional technical developments of an optical-electrical composite board are required. Generally speaking,it is more difficult to interconnect between optical ... read more

Description The number of PCB manufacturers in Europe declined from 700 in the nineties to 400 early this decade and is forecasted to shrink to the range of 100 by 2010. A share of these companies will not survive the coming years; while the majority are ... read more

Description The dramatic economic downturn of the PWB industry starting in the forth quarter of 2000,which resulted in a reduction of 1/3 of the demand and corresponding supply chain within one year,has changed our industry fundamentally. There is now a ... read more