Description #NAME? ... read more

Description PCB assembly designs become more complex year-on-year,yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge. ... read more

Description The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage during SMT reflow. ... read more

Description Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased driving a desire for lower silver alloy alternatives. ... read more

Description Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave rework,BGA and CSP solder balls,and,more recently,solder pastes for mass reflow. ... read more

Description Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated interconnect. ... read more

Description What are the Raw Material Risks? -Today PCB Suppliers handle a range of customers with different end use environments -Telecommunications -Automotive -Consumer electronics -Medical -Industrial,others... ... read more

Description Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. ... read more

Description The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the printed circuit board assembly arena. ... read more

Description The SMT stencil is a key factor in the solder paste printing process. It has been shown repeatedly that print quality has the largest impact on end-of-line quality,and a good print process can make or break the profitability of building a PCB assembly. ... read more

Description Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. ... read more

Description Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication practices. ... read more

Description Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobility and connectivity. ... read more

Description The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,with a focus on the methods used for speeds above 2 GHz. ... read more

Description How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain extent end customers. ... read more

Description Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH) of the particulate matter. ... read more

Description The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data center total cost of ownership. ... read more

Description Due to the increasing demands placed on acid copper plating solutions to perform via fill plating of blind micro vias it is critical that the plating additives be monitored precisely. This paper presents electrochemical techniques for analyzing additives commonly used in via fill plating baths. ... read more

Description This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. ... read more

Description This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH). ... read more

Description Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. ... read more

Description With regard to precision cleaning applications within electronics manufacturing,pH neutral product development was a major breakthrough in recent years. The impetus for this development resulted from changes with regard to solder paste formulations and resulting assembly processes. ... read more

Description With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved. ... read more

Description The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic components and substrates. ... read more

Description There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics market requires alloys that do not contain lead but perform equally as well. ... read more

Description Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that makeconnections. ... read more

Description This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. ... read more

Description This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry. ... read more

Description A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for unremoved flux with cleaning agent residue for parts in a silicone oil filled environment. ... read more

Description Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. ... read more

Description Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However,an automated fixture is used whenever applicable. ... read more

Description Electrical overstress causes damage to sensitive components,including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analyses sources of such noise,how it affects components and how to mitigate this problem. ... read more

Description Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors. ... read more

Description Soldering has been a key process step in the manufacture of electronic assemblies since the earliest days of the electronics industry,it is also one of the most challenging processes to control and predict and a major source of defects and failure. ... read more

Description The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. ... read more

Description Embedding components within the PC board structure is not a new concept. Until recently,however,most embedded component PC board applications adapted only passive elements. ... read more

Description As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-CT imaging. The new results are compared with the results of earlier AXI measurements. ... read more

Description In a typical mechatronic manufacturing functional test setup,actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low side driver. ... read more

Description Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. ... read more

Description The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. ... read more

Description Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for electronic assemblers. ... read more

Description The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder material formulationdue to the high soldering temperature and high alloy surface tension. ... read more

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Description What’s the Future of Interposers for Semiconductor IC Packaging? ... read more

Description In today’s world it is important that a product has sufficient accreditation that it can be enter many different market places. While accreditation can be a costly process,it is prudent to know that your product is fit for purpose before going for accreditation. ... read more

Description To find defects of solder joint in printed wiring board assembly,quite a few test methods have been developed so far. Capacitance method and IEEE 1149.1 or boundary scan method are often used to find opens between component leads and ... read more

Description This paper proposes an integrated design and test strategy which uses functional design blocks common to both designs and test fixtures,with the aim of saving time and money. ... read more

Description Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. ... read more

Description Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. ... read more