Description Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates. ... read more

Description Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. ... read more

Description Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. ... read more

Description Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis,especially when a good accuracy is expected. Few base material suppliers’ datasheet show X,Y and Z thermal conductivities. ... read more

Description From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation,the opportunities for electronics to improve our lives are limited only by our imaginations. ... read more

Description In the electronics industry,consumer demand drives a large portion of product innovations. Consumers want greater functionality and power,while maintaining a small footprint. ... read more

Description Water soluble lead-free solder paste is widely used in today’s SMT processes,but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shift in usage of solder paste is driven by an effort to eliminate the water wash process. ... read more

Description As electronic assemblies continue to shrink in size,component population densities are increasing. Design engineers are forced to utilize all available board real estate and continuously push the limits of manufacturability. ... read more

Description Pb-free Ball Grid Arrays (BGA) present unacceptable reliability risks for defense and space programs,but what are the options when SnPb devices are no longer available? BGA manufacturers express concern over the additional reflow cycles necessary for the reballing process. ... read more

Description Growing material regulations compel electronics manufacturers to rethink product compliance. Can a company state with confidence every substance in the final product has been identified,and from where each item was sourced,by all direct and indirect suppliers? ... read more

Description One of the biggest challenges a corporate environmental compliance team faces is to collect complete and accurate material and substance data in a timely manner from suppliers. ... read more

Description In 2012,The European Directive on Reduction of Hazardous Substances was recast. The new version of the directive now requires products to be adequately validated as RoHS compliant in order to be eligible for CE marking and access to the EU market. ... read more

Description With increasing popularity and momentum for wearable and printed electronics,stretchable printed ink has become a hot subject for study and application. ... read more

Description The rules of the game in PCB production are changing with new disruptive technologies. At the company there has been the implementation of a “primary image inkjet-resist” printer for both inner-layer print and etch and outer layer pattern plating processes in full production. ... read more

Description From photo film to digital camera,from letters to emails,from books to e-readers,from vinyl to MP3: the whole world is turning digital. Yet,ironically,the core compound driving the digitization of technologies and products is still being produced using analogue technology. ... read more

Description This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.200” power computing printed circuit boards with OSP and a several different solder alloys. ... read more

Description The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted or are in the process of converting to lead free circuit assembly processing. ... read more

Description IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work that this requirement prevents a solder joint geometry from being optimized for reliability especially un ... read more

Description The world of electronics continues to increase functional densities on products. Many of the miniaturization technologies were developed for the consumer market with the smart phone specifically. ... read more

Description To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and SiP optimization. ... read more

Description Modern consumer electronics are driving the adoption of smaller featured SMT devices such as 0.4 mm or smaller pitch CSP,and 01005’’ / 0402 metric discrete devices. ... read more

Description This paper examines the use of Light Interferometry and the relevant parameters used to measure copper surface roughness before and after oxide alternative. ... read more

Description In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and GPU chipset levels,system operation frequency and a variety of communication bus and cable like PCIexpre ... read more

Description The electronics industry is driven by constant technological changes,which have brought improved innovative products to the marketplace. ... read more

Description The paper will propose to present a technology for the fabrication of Printed Circuit Boards (PCBs),used primarily in high-power RF/millimeter wave applications,which involves the use of a thermally engineering metalized layer with superior thermal characteristics and a ceramic-matched co-efficie ... read more

Description Thermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply,heat can be destructive. ... read more

Description Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. ... read more

Description Many opportunities exist for flexible circuits in high temperature applications (Automotive,Military,Aerospace,Oil and Gas). Flex circuits in these applications have been hindered by a lack of materials that can survive higher temperatures. ... read more

Description The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technology,the industry has changed and captive manufacturing lines are few and far between. ... read more

Description This paper describes the purpose,methodology,and results to date of thermal endurance testing performed at the company. ... read more

Description Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. ... read more

Description As consumers become more reliant on their handheld electronic devices and take them into new environments,devices are increasingly exposed to situations that can cause failure. In response,the electronics industry is making these devices more resistant to environmental exposures. ... read more

Description Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. ... read more

Description In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6,10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas ea ... read more

Description The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). ... read more

Description Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Component warp can contribute significantly to HIP defects. ... read more

Description The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the role of salt residues -with Cl ion-on some metals is known as being promoters of oxidation or corrosion. ... read more

Description For many years,manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. ... read more

Description The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. ... read more

Description The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance rework yield. ... read more

Description Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic applications. ... read more

Description The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. ... read more

Description The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. ... read more

Description No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. ... read more

Description The number one issue identified by the 2009 International Electronics Manufacturing Initiative (iNEMI) Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor industry for use in boundary-scan printed circuit b ... read more

Description As device density continues to maximize the PCB real estate the reflowing of neighboring components or damaging of heat-sensitive components in the rework process continues to cause problems. ... read more

Description In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle time is required to perform ball grid array (BGA) rework. ... read more

Description The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. ... read more

Description Sustainable product design and the task of bringing new,earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. ... read more

Description •Introduction to printed and wearable electronics •Flexibility testing challenges •Proposals for flexibility testing •Validation case studies •Future work ... read more