IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test. Poster presentations are scheduled for Wednesday, February 5, 2020, and will be displayed throughout the event, offering additional visibility.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment and test, especially:

An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by Friday, November 15, 2019, to https://ipcapexexpo2020.ipc.org/secure/CFPosters.aspx.

For more information about poster participation or other opportunities to participate in IPC APEX EXPO, contact Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org. Or Brook Sandy-Smith, IPC technical education program manager, at BrookSandy@ipc.org

Today, IPC announced Shawn DuBravac, Ph.D., CFA, will serve as the association’s chief economist. In this role, DuBravac will expand IPC’s research program and provide insights on the biggest issues facing the $2 trillion global electronics industry, including supply chain resiliency/uncertainty, trade wars, skilled workforce shortage, and the expanding role of electronics in the global economy.

“The electronics industry is at the heart of thousands of essential products and services, as well as millions of jobs across the globe,” said DuBravac. “I look forward to working with the leaders and members of IPC to uncover actionable insights about the most pressing issues impacting the health of the electronics industry.”  

For more than a dozen years, DuBravac served as chief economist for the Consumer Technology Association, a U.S. trade association representing more than 2,000 consumer tech companies. More recently, he has provided consulting, research, and advisory services to clients on topics including digital transformation, business model disruptions, and global supply chains. He is also the author of the New York Times best seller, “Digital Destiny: How the New Age of Data Will Transform the Way We Work, Live, and Communicate,” and has appeared in Bloomberg, Wall Street Journal, New York Times, Financial Times, Washington Post and more. DuBravac is a member of the National Association of Business Economists and currently serves as the president of the Conference of Business Economists.

“Shawn’s expertise in providing insightful analysis on the technological and economic trends shaping our world is perfectly aligned with IPC’s role as a trusted source of industry information,” said Chris Mitchell, IPC’s vice president of global government relations. “He will be an asset to IPC and our members as we look to expand our research, education, and advocacy efforts.” 

IPC E-Textiles Europe 2019, a two-day technical education conference for innovators, technologists and brands/OEMs, will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles technologies and products. Developed by the e-textiles industry for the e-textiles industry, IPC E-Textiles Europe 2019 will also provide technical insights of interest to myriad market segments, including fashion design, health monitoring, medical, automotive, aerospace and military. The conference will take place in Munich, Germany, November 12-13, 2019.

Presentation highlights of the technical conference agenda include:

• Design and Fabrication Techniques of Textile-Based Embroidered RFID Tags for Apparels
• Reliability and Washability of Textile-Based Circuit Boards
• Warp Knitted Solutions for E-Textile Applications
• Conductive Patterns on Textiles by Laser Welding
• Printed Electronics – Electrifying Textiles for Smart Applications
• The New Drug Delivery frontier – Textiles
• Wearable Sensors for Your Favorite Sports
• E-Textiles as an Enabling Technology to Create More Discreet and Desirable Assistive Technology for Older Adults
• Advanced Inkjet Printed E-Textiles for Health Monitoring in Military Applications
• Design in Confidence in E-Textiles

“Smart textiles, encompassing electronics combined with textiles (e-textiles) have a very promising realm in science and technology,” said Vladan Koncar, ENSAIT, GEMTEXT, University of Lille and IPC E-Textiles Committee Europe chair. “Numerous materials, systems and devices are available for e-textiles applications, but there are challenges to making these materials, systems and devices compatible as a full e-textiles product. As a conference where scientists and people from the industry can meet and exchange experiences and knowledge, IPC E-Textiles 2019 is, therefore, tremendous.”

Unique to any other e-textiles event in Europe, IPC E-Textiles Europe 2019 will also include an IPC E-Textiles Committee in Europe meeting, where participants will be able to collaborate on IPC international standards for e-textiles.

For questions about the conference or joining the IPC E-Textiles Committee in Europe meeting or any other IPC international e-textiles standards activities, contact Chris Jorgensen, director, technology transfer, at ChrisJorgensen@ipc.org or visit www.ipc.org/E-Textiles-EU19.

With electronic systems expected to reach 50 percent of the total car cost by 2030, electronics companies are of critical importance in the automotive supply chain as a driver of quality and supporting OEM development goals.                                  

To reinforce the importance of quality in process and manufacturing, standardization for supply chain effectiveness and industry advancement, IPC and the Automotive Industry Action Group (AIAG) renewed their cooperative agreement. As part of the agreement, IPC and AIAG agreed to work closely in the areas of thought leadership, quality and supply chain best practices, and community awareness building. Together, the industry associations will educate the automotive supply chain on compliance requirements, evaluate how IPC standards and AIAG guidelines align and impact both industries, and work together to identify training that builds on professional standards.

“Today’s automobiles contain multiple electronics systems that control or monitor all aspects of the vehicle, and the quality and security of vehicle software and electronics are key requirements to guarantee safety,” said Tracy Riggan, senior director, Solutions, IPC. “The partnership of IPC and AIAG will enable both organizations to share, support and develop standards and education, and participate in industry research.”

“We maintain very close working relationships with industry associations that serve the needs of the automotive industry, and believe IPC will be a key partner in representing the electronics supplier segment,” explained AIAG vice president of member services, Dave Lalain. “We’ve already invited IPC to support our Electronics Advisory Board and are looking forward to their involvement in bringing electronics supplier issues to the forefront.”

Part of the IPC AIAG partnership includes an opportunity for complimentary AIAG membership for direct suppliers to the automotive industry. To complement the supplier tools shared by IPC and AIAG and to help the supply base improve, any direct suppliers with under $20 million in global annual sales are eligible.

To apply for AIAG membership and find out if you qualify for the IPC-sponsored membership, go to http://go.aiag.org/joinipc. Additionally, AIAG members are invited to join IPC and all new members receive 50 percent off the first year’s membership. To apply or learn more, www.ipc.org/membership.

More than 200 representatives from companies such as Huawei, CRRC, NASA, Foxconn, Vayo and JWI Software gathered in Shenzhen, China for IPC CEMAC 2019. This year’s theme, “Intelligent Future Driven by Data,” provided attendees insight into Industry 4.0, the Internet of Things (IoT), electronic component 3D digital design, the use of data to drive intelligent manufacturing and the demand for high quality/highly reliable products.

Peter Chiang, vice president, IPC Greater China, opened the annual members-only event, with an introduction to the implementation of Industry 4.0 and release of IPC-2591, IPC’s connected factory exchange standard. Huang Chunguang, Huawei Technologies, Co. Ltd., discussed the important role of 3D digitalization of electronics components during his presentation, “Software Defines Manufacturing, Data Drives the Future.” Luo Jiapeng, Foxconn, introduced Foxconn’s SMT Industrial Internet blueprint and framework during his presentation, “Data -- the Foundation of Intelligent Manufacturing.”

In addition, presentations were given by: Bhanu Sood, Ph.D., NASA Goddard Space Flight Center; Chen Zhiman, CRRC Times Electric; Johnsson Per Anders, JWI Software; Liu Fengshou, Vayo; and Du Yunliang, Mentor Graphics – a subsidiary of Siemens. The event provided ample time for professionals from various industries including aerospace, railway, telecommunication and electronics manufacturing to network with speakers.

“China accounts for up to 38 percent of the global electronics industry production capacity of nearly 2 trillion USD,” said David Bergman, IPC vice president, standards and training. “The rapidly growing Chinese electronics industry market share creates opportunities and challenges for domestic electronics-related enterprises. As a global electronics industry association, IPC is committed to the promotion of technical exchanges and providing enterprises with the latest technical standards and training to drive further development of the industry. IPC’s annual CEMAC event provides the perfect backdrop for these technical exchanges.”

Next year’s IPC CEMAC will be located in Shanghai. For more information about this event or other IPC-sponsored events in Asia Pacific, visit  www.ipc.org.cn.  

IPC announced today the July 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program. Sales growth in July turned negative, following order growth into negative territory. The book-to-bill ratio remained at parity (1.00).

Total North American PCB shipments in July 2019 were down 5.3 percent compared to the same month last year. Year-to-date sales growth as of July remained positive at 8.3 percent. Compared to the preceding month, July shipments decreased 23.1 percent.

PCB bookings in July decreased 4.3 percent year-over-year, bringing year-to-date order growth down to a positive 1.2 percent. Bookings in July were down 17.8 percent from the previous month.

“Year-on-year declines in orders in seven of the last 12 months are taking a toll on sales growth in the North American PCB industry,” said Sharon Starr, IPC’s director of market research. “Sales growth has slowed in recent months and dipped into negative territory in July. The slowdown is reflected in the book-to-bill ratio, which has hovered around 1.00 in the last five months. This indicates the probability of flattening sales growth in the second half of the year.”

Note: The January 2019 ratio has been revised since its original publication due to updated data from statistical program participants.


Note: The November 2018, January 2019 and June 2019 growth rates have been revised since their original publication due to updated data from statistical program participants.

View Chart in PDF

Detailed Data Available

The third-quarter 2019 edition of IPC’s North American PCB Market Report, containing detailed data from IPC’s PCB Statistical Program, will be published by mid-November. The quarterly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. PCB companies that are IPC members doing business in North America are invited to contact marketresearch@ipc.org for information about participating. More information about this report can be found at www.ipc.org/market-research-reports.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio at the end of each month. Statistics for the current month are normally available in the last week of the following month.

Elaine Larsen, 2014 and 2015 IHRA Jet Dragster World Champion and driver of the Florida Institute of Technology Florida's Space Coast Jet Dragster, will speak at the IPC APEX EXPO Women in Electronics reception on Tuesday, February 4, 2020, 6:00-7:30 p.m.

Larsen’s keynote, “A Chance Behind the Wheel in a Male-Dominated Industry” will focus on her entrée into the world of motorsports, a far cry from her Mennonite farming community upbringing. Now, with more than 20 years of drag racing experience, Larsen has found her home racing jet dragsters. With her current focus on mentoring the next generation of high-performance vehicle specialists, Elaine has never let being a female in the male-dominated racing industry affect her. "Drag racing is the equalizer, on any given day, I have the same chance as anyone to win, it just has to be my day,” Larsen has said.

In 2014, Larsen Motor Sports (LMS) launched its STEM initiative, and Larsen and her team work with students that have their eyes on the finish line. LMS has full fabrication capabilities, from composites, engines, and fabrication to the day-to-day operation of a multi car turbine powered race team; this is where students get the opportunity to jump right in and learn what it takes to put the dragsters down the racetrack. The company’s affiliation with Florida Institute of Technology has opened the door for internships, which led the LMS team to research many different avenues from biofuels to human centered design.

The Women in Electronics reception invites women in the electronics industry to join their colleagues across the supply chain to network, share ideas, discuss career experiences and engage with a woman who has made a name for herself in a male-dominated field.

“We are thrilled to welcome Elaine to IPC APEX EXPO 2020,” said Alicia Balonek, senior director, trade shows and events. “We are eager to learn her insights on expanding women’s leadership roles and to share our experiences ‘blazing our own trails’ within the electronics industry.”

The Women in Electronics reception and other special events as well as access to the exhibit hall are free to those who register in advance, a savings of $40 on-site. Attendees who register by December 19 will save 20 percent off registration fees. In addition, attendees who register for the All-Access Package will receive a significant percentage off a la carte options. Details, including dates, time and complete registration options, are available at www.IPCAPEXEXPO.org.

IPC's Study of Quality Benchmarks for Electronics Assembly 2019 is now available. This global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.

The quality control measurements covered by the study include first-pass and final yields, internal yields of key processes, defect rates, and DPMO and yield targets, as well as the average cost of poor quality as percentages of sales for rework and scrap, and percentages of OEMs that accept reworked boards. The study also reports on the use of various tests and quality control methods.

Customer satisfaction and supplier performance measurements are covered in the study, including rates of customer returns and returns due to product failure, and rates of on-time delivery. The industry's adoption of major quality certifications is also reported.

The data — in averages, medians and percentiles — are segmented by company size tier, by region, and by type of production including rigid PCBs, flexible circuits, finished end products, mechanical assembly, cable and harness, and discrete wiring terminal and connectors. The aggregate data represent 57 electronics assembly companies of all sizes — both OEMs and contract electronics manufacturers (EMS companies) — worldwide.

The 148-page report is available for sale to IPC members for $675 and to nonmembers for $1,350. For more information or to purchase the report, visit the IPC Online Store or contact IPC's market research department at marketresearch@ipc.org. For information on other IPC market research programs, visit www.ipc.org/IndustryData.

IPC E-Textiles 2019, a two-day technical education workshop for innovators, technologists and OEMs/brands to learn about the latest developments, designs and manufacturing concepts in the converging industries of textiles and electronics, will feature 14 technical presentations, tours of the Drexel Center for Functional Fabrics, a special interactive session and an IPC D-70 E-Textiles Committee Standards meeting. IPC E-Textiles will take place at the Drexel University Center for Functional Fabrics in Philadelphia, Pa., September 10-11.

Highlights of the agenda include:

• Advanced inkjet printed e-textiles for health monitoring in military applications
• E-textiles systems for military personal area networks
• Addressing challenges for e-textiles in automotive conditions
• Wearable e-textiles for telemedicine and energy storage
• Smart garment production
• Latest advancements in e-textile fabrics, fibers, yarns and printed materials, and much more

IPC E-Textiles 2019 will provide a platform for education and collaboration among a diverse group of professionals interested in producing e-textiles as well as to attract a myriad market segments, including fashion design, health monitoring, medical, automotive and military/aerospace. Unique to any other e-textiles conference you will attend in the US this year, this event will also kick off with an IPC D-70 E-Textiles Committee meeting, where industry can collaborate on and influence e-textiles standards being developed by the committee.

“Interdisciplinary collaborations are necessary to launch e-textile products” said Stephanie Rodgers, Apex Mills and IPC E-Textiles 2019 program committee chair. “I’m looking forward to seeing the innovators, designers, material suppliers, integrators, electrical, mechanical and textile engineers along with members of academia in the same room, working together to discuss solutions to the issues we face in this industry. All disciplines will be engaged in the development and testing of electronic integrated textiles. Additionally, the tour of the PA-Fabric Discovery Center will tempt the maker in all of us.”

Of particular interest to attendees will be the tours of the Drexel University Center for Functional Fabrics (CFF), which gained national and international recognition for its groundbreaking functional fabrics research. Its methodology is defined by an integrated “design thinking and doing” approach that combines human-centered design with fabrication, from prototyping and making of a product to full system integration. 

The CFF houses the Pennsylvania Fabric Discovery Center (PA FDC), which serves as a regional hub that facilitates advanced textile manufacturing in Pennsylvania and the Mid-Atlantic Region (New York, New Jersey, Pennsylvania, Delaware, and Maryland). 

For more information on or to register for IPC E-Textiles 2019, visit www.ipc.org/E-Textiles-2019. For more information on the D-70 E-Textiles Committee, contact Chris Jorgensen, IPC director of technology transfer, at ChrisJorgensen@ipc.org.

IPC's Validation Services Program has awarded and renewed an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to ALPHA-electronik A/S, an ISO9001 and ISO13485 certified EMS-based company in Denmark. Following an IPC audit, Alpha-electronics became the first European company to successfully renew and complete an intensive audit, based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.

For many years, ALPHA-electronik A/S utilized both IPC J-STD-001 and IPC-A-610 for specification of materials, processes and requirements. Moving forward with the QML certification allowed ALPHA-electronik A/S to tighten up their processes and products. Their quality management system was reviewed and updated accordingly to ensure traceability from relevant operational procedures to requirements in J-STD-001.

ALPHA-electronik A/S met or exceeded the requirements for the electronics industry's most rigorous classification, Class 3, which is intended for high-performance electronics assemblies. As a result, the company maintains their listing as an IPC-trusted source capable of manufacturing in accordance with industry best practices. ALPHA-electronik A/S and other trusted sources of supply can be found on IPC's QML/QPL (Qualified Product Listing) database at www.ipcvalidation.org.

Claus Molgaard, quality manager, said “Alpha-electronik A/S renewed the IPC QML as it provides us with an advantage when approaching new customers especially new medical device customers.” “We also experienced easier audits as the QML and ISO-13485 were recognized and acknowledged to have added value through better process performance by our customers,” added Molgaard.

IPC's Validation Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and certification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to re-confirm the QML for ALPHA-electronik A/S and maintaining their membership in the IPC's network of trusted QML suppliers."

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.