IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.

CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say

Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission gathered in Washington, D.C.

New Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in Advanced Packaging

Stronger IC substrate and OSAT capabilities are needed to realize U.S. semiconductor goals
A new study about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosy