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IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.
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Advocacy

CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say

Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission gathered in Washington, D.C.
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Advocacy

New Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in Advanced Packaging

Stronger IC substrate and OSAT capabilities are needed to realize U.S. semiconductor goals
A new study about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosy
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