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Advocacy

Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies

IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a
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News

New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem

IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Today, IPC, in collaboration with other industry organizations and representatives from academia and government, celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced P
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Events

IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop

IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.
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Advocacy

CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say

Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission gathered in Washington, D.C.
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Advocacy

New Study Finds Semiconductor Supply Chain Will Remain Vulnerable Without Robust Federal Investment in Advanced Packaging

Stronger IC substrate and OSAT capabilities are needed to realize U.S. semiconductor goals
A new study about the current state of advanced packaging in the semiconductor value chain finds that urgent action is required to strengthen domestic packaging ecosy
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