IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Con

The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection.

IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO®, the industry’s premier conference and exhibition for printed

IPC announced today the July 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program.

IPC announced today the June 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program.

The Trump administration today is recognizing IPC member Calumet Electronics in Calumet, Michigan, for its efforts to expand its skilled workforce.