The third annual M-EXPO Wire Processing Technology event held in Ciudad Juárez, México at the Cuatro Siglos Convention Center on October 9-11, 2019, exceeded expectations. This event was co-located with the ninth annual EXPO-MRO.

The 2019 IPC Hand Soldering Competition Japan concluded at NEPCON Japan in Nagoya September 20, celebrating the outstanding skills and professional achievements of talented manufacturing floor workers.

IPC, in conjunction with What’s New in Electronics Live and ART-- Advanced Rework Technology Ltd., conducted the IPC Hand Soldering Competition in Warwickshire, United Kingdom, on September 18-19, 2019.

Exhibitor booth space at the third annual M-EXPO Wire Processing Technology 2019 in Ciudad Juárez, México, is sold out and wait-list applications are being accepted.

IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Con

The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection.