Artificial Intelligence - Opportunities, Challenges, Possibilities
Tuesday and Thursday 11:00 – 1:00 p.m. Description:In this 4-hour course, you will learn and be updated on the following topics:
Component-to-System Level Packaging - Addressing Integration Challenges for Automotive & Industrial Applications
Sponsorship Packages are available for the workshop on Component-to-System Level Packaging - Addressing Integration Challenges for Automotive and Industrial Applications.
Advanced Packaging to System Integration – Trends and Challenges
Advanced Packaging to System Integration – Trends and Challenges Speaker:Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC
PCB Design for Military & Aerospace Applications
DescriptionThis course addresses specific challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, altitude, extended operating temperature range, and other desi
IPC WorksAsia-AI & Factory of the Future
AI and IPC standards empower future factories - building a new smart manufacturing ecosystem.
IPC Taiwan Member Appreciation Dinner
IPC Taiwan Member Appreciation Dinner