Filter by event type - Optional
Enter a 2 digit country code.

IPC-2951-CFX Future Factory Applications & Real Scene Demonstrations

IPC-2951-CFX Future Factory Applications & Real Scene Demonstrations

Date
-

This event will be organized during 2024 Taiwan Robot and Intelligent Automation Exhibition \ 2024 Taipei International Industrial Automation Exhibition from August 21-24, showcasing the research and experience on industry pain points:

-Introduction of IPC-HERMES-9852 & Basic Architecture & Transmission Mechanism & Interchangeable Messages

-Introduction of IPC-2951-CFX & Basic Architecture & Transmission Mechanism & Basic Specifications (Table 6-1, 6-2) & Interchangeable Messages & Application Scene Introduction & Factory of the Future Applications & Real Scene Demonstrations

- AMR Automated Loading and Unloading (CFX)

- First Station Data & Batch Completion Data & Rework Station PCB Placement & Command Stop Board

- Integration System Manufacturer – Enlight Technology for CFX Equipment Integration

For more information or event sponsorship, please contact Ms. Winny Lin at WinnyLin@ipc.org

Nangang Exhibition Center

No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

Nangang Exhibition Center

Nangang Exhibition Center
No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

IPC Hand Soldering Competition Vietnam 2024

IPC Hand Soldering Competition Vietnam 2024

Date
-

IPC’s hand soldering competitions around the world are highly popular events generating a lot of attention, participation and publicity. The competition attracts the enthusiastic participation of thousands of professionals specializing in high-reliability products within the electronics industry such as defense, aerospace/aviation, rail transportation, automotive electronics, consumer electronics, etc. Operators continuously refine and enhance their skills through participation in IPC Skills Competitions, while participating companies elevate their process standards, reduce product costs, and significantly improve their competitive advantages.

Registration is free of charge. The number of participants is limited!

For more information or event sponsorship, please contact Mr. Henry Ton, HenryTon@ipc.org

I.C.E. Hanoi

91 Tran Hung Dao Street
Hanoi
Hanoi City 111000
Vietnam

I.C.E. Hanoi

I.C.E. Hanoi
91 Tran Hung Dao Street
Hanoi, Hanoi City 111000
Vietnam

IPC Builds-Standards Development Committee Meetings

IPC Builds-Standards Development Committee Meetings

Date
-

 REGISTER | AGENDA | COMMITTEE MEETINGS CONTACT US |  HOTEL & LOCATION

We can’t wait to welcome you to IPC Builds, in-person October 5-10, 2024 at the McKimmon Center in Raleigh, North Carolina.

IPC Builds is all about IPC Standards, welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Newcomers and industry veterans are welcome. Participate and learn more about these critical industry documents.

IPC Standard Development Committees cover a range of topics, including:

  • Assembly and Joining
  • Assembly Equipment
  • Base Materials
  • Cleaning and Coating
  • Electronic Documentation Technology
  • Electronic Product Data Description
  • Embedded Devices
  • Environment, Health and Safety
  • Fabrication Processes
  • Flexible and Rigid-Flex Printed Boards
  • High Speed/High Frequency Interconnection

 

  • Management
  • Packaged Electronic Components
  • Printed Board Design Technology
  • Printed Electronics
  • Process Control
  • Product Assurance
  • Product Reliability
  • Rigid Printed Boards
  • Terms and Definitions
  • Testing
  • Wearable Electronics/E-Textiles

REGISTRATION INFORMATION

Member: $249
Nonmember: $299

Register Now

For questions about registration please contact: 

Kim DiCianni, CEM                                   
Director Tradeshows & Events
KimDiCianni@ipc.org 

AGENDA

Registration Hours
Saturday, October 5-Thursday, October 10 | 7:00 am-5:00 pm

Lunch included Saturday-Thursday

Golden Gnome Awards Dinner
Tuesday, October 8 | 5:00 pm-8:30 pm

Committee Meetings 
Saturday, October 5-Monday, October 7 | 8:00 am-5:00 pm
Tuesday, October 8 | 8:00 am-3:00 pm
Wednesday, October 9-Thursday, October 10 | 8:00 am-5:00 pm

Golden Gnome Award

Committee Meetings Schedule

PRODUCT ASSURANCE

8:00 am-5:00 pm

5-22A and 7-31B IPC-J-STD-001 and IPC-A-610 Task Groups
J-STD-001 and IPC-A-610 revision development for assembly soldering processes and acceptance.

PRODUCT ASSURANCE

8:00 am-5:00 pm

5-22A and 7-31B IPC-J-STD-001 and IPC-A-610 Task Groups
J-STD-001 and IPC-A-610 revision development for assembly soldering processes and acceptance.

D-33A and 7-31A IPC-6012 and IPC-A-600 Task Groups
IPC-6012 and IPC-A-600 revision development for printed board fabrication processes and acceptance.

 

PRODUCT ASSURANCE

8:00 am-10:00 pm

7-31FHV IPC/WHMA-A-620 Task Group
Developing a standard for high voltage cable applications in the electric mobility industry.  

7-32C Electrical Continuity Testing Task Group
IPC-9252 revision development for electrical continuity testing concepts and guidelines.

D-33 Performance Standards Subcommittee
IPC-6011 revision development for printed board performance.

8:00 am-12:00 pm

7-31F IPC/WHMA-A-620 Task Group  
IPC/WHMA-A-620 revision development for cable and harness processes and acceptance.

1:30 am-3:00 pm

4-14F Final Finishes for Printed Boards – ENEPIG Task Group
Discussing development of requirements for ENEPIG finishes for printed boards.

7-31FT IPC/WHMA-A-620 Training Committee
IPC/WHMA-A-620 Certification Program training materials discussion, development, evaluation and revision.

1:30 pm-5:00 pm

7-31J Electronic Box Assemblies Task Group
IPC-A-630 revision development for electronic enclosures (box build).

ASSEMBLY AND JOINING

8:00 am-10:00 am

5-21H Bottom Termination Components (BTC) Task Group
IPC-7093 revision development for design and assembly challenges for implementing Bottom Termination Components (BTCs).

5-23B Component and Wire Solderability Specification Task Group
J-STD-002 revision development for component lead, termination, lug, terminal and wire solderability.

10:15 am-12:00 pm

5-23A Printed Circuit Board Solderability Specifications Task Group
J-STD-003 revision development for printed board solderability.

10:00 am-5:00 pm

7-31BV J-STD-001 and IPC-A-610 Automotive Addendum Task Group
J-STD-001 and IPC-A-610 Automotive Addendum revision development.

BASE MATERIALS

8:00 am-12:00 pm

3-11A IPC-4101 Task Group
IPC-4101 revision development for base materials.

1:30 pm-3:00 pm

3-12D Woven Glass Reinforcement Task Group
IPC-4412 revision development for performance of woven glass fabrics and their effect on laminate and prepreg manufacture.

3:15 pm-5:00 pm

3-12E Base Materials Roundtable Task Group
Generate ideas for task groups involved in printed base materials.

CLEANING AND COATING

8:00 am-12:00 pm

5-32G Residue Assessment Task Group
Discuss methods of evaluation and assessment of residues found on printed boards and printed board assemblies.

ELECTRONIC PRODUCT DATA DESCRIPTION

8:00 am-11:00 am

2-17A and 2-17B IPC-2591 and IPC-HERMES-9852 Joint Task Group
IPC-HERMES-9852 revision development for omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

8:00 am-12:00 pm

2-18 Supplier Declaration Subcommittee
Discuss the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration.

11:00 am-12:00 pm

2-12C Cybersecurity Protection Standard Task Group
IPC-1792 revision activities for cybersecurity management in the manufacturing industry supply chain.

3:15 pm-5:00 pm

2-19A Critical Components Traceability Task Group
IPC-1782 revision development for manufacturing and supply chain traceability of electronic products.

PROCESS CONTROL

8:00 am-12:00 pm

7-31M Fiber Optic Cable Acceptability Task Group
IPC-A-640 and IPC-D-640 revision activity for optical fiber, optical cable and hybrid wiring harness assemblies.

MANAGEMENT

10:00 am-12:00 pm

V-TPAC IPC Training Program Advisory Committee
Advising IPC on the development, maintenance and creation of IPC Certification and Training programs and reviews, supports and aligns the activities of the IPC Certification and Training Committees with IPC strategy.

DATA GENERATION & TRANSFER/DOCUMENTATION

10:15 am-5:00 pm

2-40 Electronic Documentation Technology Committee
Developing strategies and recommendations for the conversion of design and manufacturing information into electronic formats representing final product.

1:30 pm-5:00 pm

2-18A Generic Requirements for Declaration Process Management Task Group
Developing the format and XML characteristics for material and substance declaration.

RIGID PRINTED BOARDS

10:15 am-12:00 pm

D-33-AP Ultra HDI Subcommittee
Developing design and fabrication guidelines for printed board utilizing conductors and spacings below 50 µm and dielectric spacings below 75 µm as Ultra HDI within the Subcommittee) that are manufactured with semi-additive and modified semi-additive processing.

1:30 pm-3:00 pm

EA Roundtable
DoD Executive Agent discussion on printed circuit board & interconnect technology.

3:15 pm-5:00 pm

D-35 Printed Board Storage and Handling Subcommittee
IPC-1601 revision activities printed board handling and storage guidelines.

PRINTED ELECTRONICS

1:30 pm-3:00 pm

D-61B and D-64B Rigid Printed Electronics Design Standard and Printed Electronics on Rigid Substrates Performance Specification Joint Meeting
IPC-2294 and IPC-6904 revision activities for design, qualification and performance of printed electronics on rigid substrates.

TERMS AND DEFINITIONS

1:30 pm-3:00 pm

2-30 Terms and Definitions Committee
IPC-T-50 revision activities for terms and definitions for interconnecting and packaging electronic circuitry.

FABRICATION PROCESSES

3:15 pm-5:00 pm

4-14B Final Finishes for Printed Boards - ENIG Task Group
IPC-4552 revision activities in the development of technical information, guidelines and testing techniques to evaluate electroless nickel / immersion gold (ENIG) as a surface finish for printed boards and interconnecting substrates.

PRODUCT ASSURANCE

8:00 am-10:00 am

7-34 Repairability Subcommittee
IPC-7711/21 revision development for rework, modification and repair.

9:30 am-12:00 pm

7-35 Assembly and Joining Handbook Subcommittee
IPC-AJ-820 revision development for a handbook on assembly and joining.

10:00 am-12:00 pm

7-31BT IPC-A-610 Training Committee
IPC/WHMA-A-610- Certification Program training materials discussion, development, evaluation and revision.

1:30 pm-3:00 pm

7-34T IPC-7711/21 Training Committee
IPC-7711/21- Certification Program training materials discussion, development, evaluation and revision.

ASSEMBLY AND JOINING

1:30 pm-3:00 pm

5-22F IPC-HDBK-001 Task Group
IPC-HDBK-001 revision development for a handbook for J-STD-001.

5-24C Solder Alloy Task Group
J-STD-006 revision development for solder alloys.

BASE MATERIALS

8:00 am-10:00 am

3-12A Metallic Foil Task Group
IPC-4562 revision development for metal foil for printed wiring applications

10:15 am-12:00 pm

3-14A IC Substrate Task Group
Development of IPC-6921 for IC substrates.

CLEANING AND COATING

8:00 am-10:00 am

5-33F Potting and Encapsulation Task Group
IPC-HDBK-850 revision activities for guidelines for design, selection and application of potting materials and encapsulation processes used for printed board assemblies.

10:00 am-12:00 pm

5-33B Solder Mask Performance Task Group
IPC-SM-840 revision activities for qualification and performance of permanent solder mask and flexible cover materials and the associated test methods.

10:00 am-3:00 pm

5-33C Conformal Coating Handbook Task Group
IPC-HDBK-830 revision activities for design, selection and application of conformal coatings guidelines.

ELECTRONIC PRODUCT DATA DESCRIPTION

7:30 am-9:30 am

2-15F Obsolete and Discontinued Product Task Group
J-STD-048 revision activities for product discontinuance throughout the supply chain.

8:00 am-10:00 am

2-12B Model Based Definition (MBD) for Digital Twins Task Group
IPC-2552 revision activity for model-based design (MBD) for digital twin factories.

2-16D IPC-2581 Users Task Group
This IPC-2581 Consortium will continue working on facilitating the use of IPC-2581 in the industry.

1:00 pm-3:00 pm

2-19B Trusted Supplier Task Group
IPC-1791 revision activity for trusted electronic designer, manufacturer and assembler requirements.

1:30 pm-3:00 pm

2-18B Materials Declaration Task Group
IPC-1752 revision activity for materials declaration.

PROCESS CONTROL

10:00 am-12:00 pm

7-24B Printed Board Assembly Process Handbook Task Group
IPC-9111 revision activity for a printed board assembly process handbook providing problems, process causes and possible corrective actions that may be taken.

1:00 pm-3:00 pm

7-24A Printed Board Process Effects Handbook Task Group
IPC-9121 revision activity for a printed board process handbook providing problems, process causes and possible corrective actions that may be taken.

DATA GENERATION & TRANSFER/DOCUMENTATION

1:30 pm-5:00 pm

2-18A Generic Requirements for Declaration Process Management Task Group
Developing the format and XML characteristics for material and substance declaration.

RIGID PRINTED BOARDS

7:30 am-9:30 am

V-ESDS ESDS Control Plan
Developing an ESDS Control Plan for Electrostatic Discharge

8:00 am-12:00 pm

D-31B IPC-2221 2222 Task Group
IPC-2221 and IPC-2222 revision activities for generic printed board design requirements and for rigid organic printed boards.

8-80 Lead Free Electronics Risk Management (PERM) Council
Discussing managing and mitigating the risks of lead-free electronics assemblies.

10:00 am-12:00 pm

2-12D Digital Sustainability Credentials Standard Task Group
Developing IPC-2553 for digital sustainability credentials.

PRINTED ELECTRONICS

1:00 pm-3:00 pm

D-67A Acceptability of Additively Manufactured Electronics Specification and Additively Manufactured Electronics Performance Specification Joint Task Group Meeting
Activity Developing IPC-6905 and IPC-6911 for qualification, performance and acceptability of additively manufactured electronics (AME).

PRODUCT RELIABILITY

10:00 am-12:00 pm

5-32E Conductive Anodic Filament (CAF) Task Group
Exploring Conductive Anodic Filament (CAF) growth and other ECM failure mechanisms within a printed board.

Technology Solutions 
Guiding, managing and producing technical and IPC Technology Solutions white papers for IPC members and/or the entire electronics community.        

1:30 pm-3:00 pm

6-10D SMT Attachment Reliability Test Methods Task Group
IPC-9701 revision activities for maintaining and developing specific test and performance levels for solder attachment of surface mount devices to rigid, flexible and rigid-flex circuit structures.

EMBREDDED DEVICES

1:00 pm-3:00 pm

D-55 and D-55A Embedded Devices Process Implementation Subcommittee and Embedded Circuity and Embedded Devices Process Implementation Subcommittee and Embedded Circuitry Guideline Task Group Joint Meeting
IPC-6017 and IPC-7092 revision activity for embedded circuitry.

PRODUCT ASSURANCE

8:00 am-10:00 am

7-31FS IPC/WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
IPC/WHMA-A-620 Space and Military Addendum revision development for cables and harnesses.

10:15 am-12:00 pm

7-31AT and D-33AT IPC-A-600 and IPC-6012 Training Committee
IPC-A-600 and IPC-6012- Certification Program training materials discussion, development, evaluation and revision.

7-31H and 7-31K Wire Harness Design and Wire Harness Handbook Task Group Meeting
IPC-D-620 and IPC-HDBK-620 revision development for cables and harnesses.

3:15 pm-5:00 pm

7-31N Manual Magnification Aides Task Group
Development of IPC-9904 for manual magnification guidelines.

ASSEMBLY AND JOINING

8:00 am-10:00 am

5-22BT J-STD-001 Training Committee
J-STD-001 Certification Program training materials discussion, development, evaluation and revision.

5-24B Solder Paste Task Group
J-STD-005 revision development for solder paste.

8:00 am-12:00 pm

5-21M and 5-21N Cold Joining/Process-fit Standard and Handbook Joint Task Group
IPC-9797 and IPC-HDBK-9798 revision development for cold joining/press-fit processes and acceptance.

10:00 am-12:00 pm

5-24A Flux Specifications Task Group
J-STD-004 revision development for flux materials.

1:30 pm-3:00 pm

5-22AS J-STD-001 Space and Military Electronic Assemblies Task Group
J-STD-001 Space and Military Addendum revision development for soldered assemblies.

3:00 pm-5:00 pm

5-24G Polymerics Standard Task Group
IPC-5262 revision development for polymeric applications.

BASE MATERIALS

10:15 am-12:00 pm

3-11J Metal Based Laminates for Printed Boards
Development of IPC-4105 for metal based laminates for printed boards.

1:30 pm-5:00 pm

5-33A Conformal Coating Task Group
IPC-CC-830 revising development for qualification and performance of electrical insulating compound for printed board assemblies and the associated test methods.

ELECTRONIC PRODUCT DATA DESCRIPTION

10:15 am-12:00 pm

2-12A Generic Requirements for Digital Twin Task Group
IPC-2551 revision activity for an international standard for digital twin architecture.

2-16 Digital Product Model Exchange (DPMX) Subcommittee
IPC-2581 revision activities requirements for printed board assembly products manufacturing description data and transfer methodology.

1:30 pm-5:00 pm

2-18J Lab Report Declaration Task Group
Development a standardized lab report format for gathering and communicating information on testing data for chemicals and products.

PROCESS CONTROL

1:30 pm-3:00 pm

7-25A Automated Optical Inspection Process Control Standard Task Group
Developing IPC 9716 for requirements for automated optical inspection (AOI) process control for printed board assemblies.

3:15 pm-5:00 pm

7-25B AOI Process Control for IC Substrates Standard Task Group
Developing IPC-9712 for requirements for automated optical inspection (AOI) process control for integrated chip substrates.

DATA GENERATION & TRANSFER/DOCUMENTATION

1:30 pm-3:00 pm

6-10J Design Guidelines for IoT-Based Products Task Group
Developing IPC-2232 for guidelines for printed board design and manufacturing of IOT products.

HIGH SPEED/HIGH FREQUENCY INTERCONNECTIONS

8:00 am-10:00 am

D-22 High Speed High Frequency Board Performance Subcommittee
IPC-6018 revision activity for qualification and performance for high frequency (microwave) printed boards.

1:30 pm-3:00 pm

D-23 High Speed High Frequency Base Materials Subcommittee
IPC-4103 revision activity for high speed high frequency base materials.

FLEXIBLE AND RIGID PRINTED BOARDS

10:15 am-12:00 am

D-12 Flexible Circuits Specifications Subcommittee
IPC-6103 revision activities for flexible and rigid flexible printed boards.

1:30 pm-3:00 pm

D-11 Flexible Circuits Design Subcommittee
IPC-2223 revision activities for design of flexible and rigid flexible printed boards.

3:15 pm-5:00 pm

D-13 Flexible Circuits Base Materials Subcommittee 
IPC-4202, IPC-4203, IPC-4204 and IPC-FC-234 revision activities.         

TESTING

12:00 pm-3:00 pm

7-12 Microsection Subcommittee
Test Method 2.1.1 discussion on maintenance and development of concepts, guidelines and tutorials for manual and automated microsection preparation used to evaluate printed board and assembly quality.

PRINTED BOARD DESIGN TECHNOLOGY

1:30 pm-3:00 pm

1-14 DFX Standards Subcommittee
Developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.

ELECTRONIC PACKAGING DESIGN

3:15 pm-5:00 pm

1-13 Land Pattern Subcommittee
IPC-7352 revision activity for land pattern design concepts.

PACKAGED ELECTRONIC COMPONENTS

3:15 pm-5:00 pm

B-10A Plastic Chip Carrier Cracking Task Group
J-STD-020 revision activities for handling moisture sensitive plastic IC packages.

PRODUCT ASSURANCE

1:30 pm-5:00 pm

7-31J Electronic Box Assemblies Task Group
IPC-A-630 revision development for electronic enclosures (box build).

ELECTRONIC PRODUCT DATA DESCRIPTION

8:00 am-10:00 am

2-10 Electronic Product Data Description Committee 
Developing standards and guidelines in computer data format standardization.

1:30 pm-5:00 pm

2-18J Lab Report Declaration Task Group
Development a standardized lab report format for gathering and communicating information on testing data for chemicals and products.

2-18H Conflict Minerals Data Exchange Task Group
Developing a standard supporting the electronic exchange of data.

PRODUCT RELIABILITY

8:00 am-10:00 am

3-11G Corrosion of Metal Finishes Task Group
Gathering data on corrosion of metals used in electronic assemblies with the intent to establish a long-term predictive test method and model.

CONTACT US

Technical Staff

David Bergman 
Vice President, Standards & Technology
DavidBergman@ipc.org 

Chris Jorgensen
Director, Technology Transfer
ChrisJorgensen@ipc.org

Patrick Crawford
Manager, Design Standards and Related Industry Programs
PatrickCrawford@ipc.org 

Doug Sober
Director, Materials & IEC Engagement
DougSober@ipc.org

Teresa Rowe
Senior Director, Assembly & Standards Technology
TeresaRowe@ipc.org 

John Perry 
Director, Printed Board Standards & Technology
JohnPerry@ipc.org

Debora Obitz
Manager, Technical Programs
DeboraObitz@ipc.org

Registration

Kim DiCianni, CEM
Director Tradeshows & Events
KimDiCianni@ipc.org

Hotel and Location

Kristin Schueler, CMP 
Director of Meetings and Events
KristinSchueler@ipc.org

HOTEL INFORMATION & LOCATION

Embassy Suites Hotel Raleigh-Crabtree
4700 Creedmoor Road
Raleigh, NC
Rate of $189 until September 13, 2024 or until all rooms are booked
Call 919-881-0000 or use the booking link below

RESERVE YOUR ROOM

Marriott Raleigh Crabtree Valley
4500 Marriott Drive
Raleigh, NC
Rate of $189 until September 13, 2024 or until all rooms are booked
Call 919-781-7000 or us the booking link below
Book your group rate for IPC Committee Meeting

Candlewood Suites Raleigh Crabtree
4433 Lead Mine Road
Raleigh, NC
Rate of $105 until September 23rd or until all rooms are booked
Call 919-789-4840 or use the booking link below

RESERVE YOUR ROOM

Traveling to the Hotel

A shuttle will be available Saturday - Thursday to/from the McKimmon Center and the IPC contracted hotels only.

Pickup Time:
Embassy Suites Crabtree: 7:30 am
Marriott Raleigh Crabtree: 7:35 am
Candlewood Suites Crabtree: 7:40 am

Dropoff Time:
The shuttle will be leaving at 5:15 pm from the McKimmon Center Saturday-Thursday to take attendees back to our contracted hotel block only.

*There will be an additional shuttle for those attending the Gnome Awards

McKimmon Center

1101 Gorman St
Raleigh, NC 27606
United States

McKimmon Center

McKimmon Center
1101 Gorman St
Raleigh, NC 27606
United States

IPC High Reliability Forum

IPC High Reliability Forum

Date
-

Join us for the IPC High Reliability Forum October 9-10, 2024, at the McKimmon Center in Raleigh, North Carolina. If you manufacture, design or test electronics for applications with unique safety, reliability, and lifetime requirements, you don’t want to miss this event! 

This event provides a unique opportunity to learn about the latest advancements in electronics, participate in industry discussions, and network with this respected community of professionals focused on electronics with high reliability requirements. 

Presentation topics will include:

  • Safety critical electronics considerations
  • Military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements
  • Well-rounded, industry-curated content covering many different topics related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods

MEET THE SPEAKERS

Dr. Denis Barbini

Dr. Denis Barbini
Technical Solutions Manager
Zestron

Presentation: Ensuring Reliability in High Voltage Electronics

Designing electronic assemblies for high voltage (HV) applications (800-1200V) in electric vehicle (EV) units presents unique reliability challenges. Recalls by EV Original Equipment Manufacturers (OEMs) have often been linked to particle-induced electrical breakdowns and moisture ingress in OCB/DC/DC units, leading to contamination and increased failure risks. The absence of standards like IEC 60664, which covers electrochemical migration (ECM), further complicates the design landscape for engineers, making it difficult to ensure proper insulation in the HV range.

In addition to common failure mechanisms under humidity, such as ECM and creep corrosion, emerging issues like Anodic Migration Phenomenon (AMP) due to insulation material aging pose further challenges. These failures can manifest later, causing short circuits, while particles can lead to arc discharges and thermal incidents. Addressing these risks is crucial in design Failure Mode and Effects Analysis (FMEA).

A new analytical approach to isolation coordination addresses these challenges by considering the assembly's conductivity under environmental influences. This method allows for deriving limits for ionic, filmic, and particulate contamination, as well as the insulation materials to be used, based on HV reliability tests.

The presentation will cover the use of ion chromatography, CoRe-/iodine vapor tests, and fritt-voltage analysis, illustrating their application through examples. Implementing these analytical techniques in the electronic assembly process can lead to significant cost savings while meeting increased reliability requirements. This approach is essential for next-generation powertrain (PT) units to enhance the acceptance and safety of EVs.

Bio

Dr. Denis Barbini is an esteemed electronics manufacturing and assembly professional. Formerly the Associate Director of the A.R.E.A. Consortium, he led the identification of critical needs in emerging technologies and assembly processes. With extensive hands-on experience, Denis has provided invaluable guidance and solutions to companies worldwide. His expertise lies in implementing cost-effective, reliable, and robust processes for electronic devices. Recently, he transitioned to the role of ZESTRON's Technical Solutions Manager, leveraging his 25 years of experience to drive the development of critical projects and explore new industry sectors.

Norbert Holle Headshot

Dr. Norbert Holle
Development Engineer
Robert Bosch GmbH 

Presentation: Voids in Solder Joints: The Past, the Present and the Future

A certain level of voiding both in surface-mount as well as through-hole solder joints generally has no negative impact on assembly reliability under thermo-mechanical or mechanical loads. Yet, concerns that excessive voiding may affect assembly reliability exist among various stakeholders in the supply chain, from Tier2 to OEMs. This calls for: (i) Common requirements for voiding levels for different solder-joint geometries; (ii) Non-destructive methods for the quantitative assessment of voiding.

This works summarizes previous work on the impact of voiding on assembly reliability and explains how standards have been updated in the light of the existing data.

It also provides an assessment of the current opportunities and challenges in assessing voiding levels non-destructively by X-ray inspection: Typical X-ray inspection systems used nowadays do not generally satisfy common requirements on gauge repeatability and reproducibility (gauge R&R) when employed to assess voiding in solder joints. An outlook towards the use of artificial intelligence, which can provide an opportunity to overcome weaknesses of traditional image analyses approaches, will also be given.

Bio

Norbert Holle got his diploma in process technology at RWTH Aachen, Germany with diploma thesis at NTH Trondheim. In 2000 he received a PhD on “Investigations on the technical implementation of photobiological hydrogen production” at RWTH Aachen. In 1999 he started at Robert Bosch GmbH, Stuttgart as a research engineer with a focus on thermal high temperature processes for metals and ceramics. Since 2008 Norbert is working as a development engineer for assembly and interconnect technology. His main fields of experience are solder paste, SMT and reflow process topics, soldering defects (esp. voiding) and interactions of process - materials - PCB. 

Bob Neves Headshot

Bob Neves
Founder and Chairman/CTO
Microtek Laboratories & Reliability Assessment Solutions

Presentation: Advances in Assessing Via Structures for Soldering Process Survivability, Reliability and Robustness

Since the first via structures made with eyelets, the Electronics Industry has used microsections after thermal stress to evaluate quality after exposure to a simulated component attachment process.  As via structures have become increasingly complex and the component attachment processes more demanding, the thermal stress microsection has shown its inability to adequately meet the needs of the industry in determining via structure quality.  Over the last decade there has been a concerted effort to find a reasonable alternative the Thermal Stress microsection and to include a reliability aspect to the evaluation that is not as costly and time consuming as dual chamber thermal shock.  This presentation will touch on these efforts, test methods and set expectations for the latest methodologies that evaluate Solder Process Survivability, Reliability and Robustness of via structures.

Bio

Bob Neves is founder and Chairman/CTO of Microtek Laboratories & Reliability Assessment Solutions. He served as IPC Board Chair, and earned IPC Hall of Fame, IPC Presidents & Dieter Bergman IPC Fellow awards. He served as Chairman of IPC's TAEC, Rigid Board General Committee, HDI General Committee, Rigid Board Test Method Task Group, IEC TC91 Working Group 10 PCB Test Methods. He has participated on more than 50 IPC Technical Committees & has published dozens of articles and technical papers about Reliability, Testing, Test Methods & Failure Analysis & is the author of the PCB Acceptability section in Coombs “Printed Circuit Handbook” Sixth Edition.

Udo Welzel headshot

Dr. Udo Welzel
Senior Manager
Robert Bosch GmbH

Presentation: Voids in Solder Joints: The Past, the Present and the Future

A certain level of voiding both in surface-mount as well as through-hole solder joints generally has no negative impact on assembly reliability under thermo-mechanical or mechanical loads. Yet, concerns that excessive voiding may affect assembly reliability exist among various stakeholders in the supply chain, from Tier2 to OEMs. This calls for: (i) Common requirements for voiding levels for different solder-joint geometries; (ii) Non-destructive methods for the quantitative assessment of voiding.

This works summarizes previous work on the impact of voiding on assembly reliability and explains how standards have been updated in the light of the existing data.

It also provides an assessment of the current opportunities and challenges in assessing voiding levels non-destructively by X-ray inspection: Typical X-ray inspection systems used nowadays do not generally satisfy common requirements on gauge repeatability and reproducibility (gauge R&R) when employed to assess voiding in solder joints. An outlook towards the use of artificial intelligence, which can provide an opportunity to overcome weaknesses of traditional image analyses approaches, will also be given.

Bio

With a Diploma in Physics (University of Bayreuth, Germany) and a Doctoral degree in Chemistry (University of Stuttgart, Germany, 2002), Udo has profound knowledge in materials science and technology. He joined the Mobility Electronics Division of the Robert Bosch GmbH in 2012, where he now is responsible for Printed Circuit Board Technology Development. He is co-author of more than 90 scientific and technical papers and has given various invited lectures during scientific and technical conferences.

Steven Dirkes Headshot

Steven Dirkes
Quality Assurance Specialist
Department of the Army

Presentation

More information coming soon!

Bio

Steven Dirkes, a Quality Assurance Specialist, plays a crucial role in assessing and evaluating service quality and also implements initiatives to enhance service delivery, contributing to better health outcomes and safer communities. 

Kenny Kakutani

Takenori “Kenny” Kakutani
Business Development Specialist
Taiyo Ink Manufacturing 

Presentation: Screen Printable Ink on PCBs and its Thermal Curing Type Coating Film That Exhibits Excellent Thermal Conductivity and High Insulation Properties

Printed circuit boards (PCBs) for automotive ECUs and communication modules are becoming smaller, higher density components, and embedded component technology is progressing. Components mounted on these PCBs generate heat, mostly transferred from the components to the PCBs. Therefore, it is necessary that not only the heat on the component surfaces be dissipated into the atmosphere or into the heat sink, but also the heat within the PCB, and the thermal design of mounted PCB has become more significant in recent years. In addition, to ensure high reliability and safety of PCBs, insulation materials for PCBs that can handle high voltages of 1,000 Volt or more are required.

Conventional heat-dissipating materials include TIM sheets and heat-dissipating grease, which are relay materials used to dissipate heat from the component surface to the heat sink, not the PCB, and have thermal conductivity but no insulation properties for consideration.

Based on our intensive study, we have developed a new material that has excellent thermal conductivity to dissipate heat from PCBs and high insulation properties, and can be easily printed on PCBs. This material is a uniformly dispersed ink consisting mainly of thermal curable resin and thermally conductive filler. It can be applied by general silk screen printing (like legend ink) as listed in the IPC standard, and is a permanent, fully cured coating (Tg:190℃), which is different from TIM sheets and grease that contain volatile components and change state. The cured film has a thermal conductivity of 3.3 W/mK and a dielectric breakdown voltage of 6,600 Volt per 100 μm film thickness. The appearance of the coating film is glossy, with a surface roughness (Ra) of less than 1.0 μm. The test using the coating film and an LED-mounted PCB has demonstrated that it effectively dissipates the heat from the PCB.

Bio

Takenori Kakutani is Business Development Leader of Taiyo Ink Mfg. Japan. Since 2005, he joined the Taiyo Ink, where he has been engaged in the R&D and the application of solder resist and various insulating materials for PCBs. He worked as a visiting engineer at the 3-D Packaging Research Center, Georgia Tech, Atlanta, US, from 2019 to 2021. He is currently involved in research marketing and product proposals of PCBs and IC packaging for automotive applications. He is a member of the Japan Institute of Electronics Packaging (JIEP) and the IPC standards.

Tim Pearson Headshot

Tim Pearson
Principal Materials and Process Engineer
Collins Aerospace

Presentation: Overview of using X-ray Inspection in Assessing Solder Joint Quality

X-ray inspection has become an increasingly common process control methodology in the past decade of electronics manufacturing. This has led to questions of how solder joint voiding impacts solder joint reliability. A significant amount of investigative work has been done to add to the industry knowledge, but there is still work to be done. This paper will review the IPC-J-STD-001 requirements concerning X-ray methodologies, the X-ray recommendations in Appendix C, the reliability papers for surface mount joints, and the practical application of X-ray inspection in a typical factory environment. This paper explains the intent of the J-STD-001 teams’ inclusion of their X-ray applications, the history of why there are voiding requirements for BGAs and BTCs, and the future of other voiding requirements that need to be addressed.

Bio

Tim Pearson is a Materials and Process Engineer in the Advanced Operations Engineering department of Collins Aerospace in Cedar Rapids, Iowa. Mr. Pearson graduated from Iowa State University with a BS in Materials Science and Engineering. Tim began his career as a Thin Films Engineer at Texas Instruments in a 300mm wafer fab. Tim has been working for Collins Aerospace (formerly Rockwell Collins) since 2015. In his current role, he helps develop new manufacturing processes, troubleshoots production issues, and does root cause analysis of failures related to soldering. He is a member of SMTA and IPC.

Ben Gumpert Headshot

Ben Gumpert
MSME, Manufacturing Engineer
Lockheed Martin

Presentation: BTC Assembly and X-Ray Challenges

Electronics component packages have changed dramatically over the last 20 years in the drive for smaller, more capable electronics products. While much of that development was evolutionary, with similar packages offered in smaller formats, manufacturers have more recently created a multitude of unique package styles, particularly in the group of Bottom Termination Components. Industry documentation has struggled to keep up with the development of the component manufacturers, so it is often left to the assembler to decide how best to install these package styles. Changes to solder alloys and component finishes have increased voiding in general, and these new packages present challenges to the electronics assembler to ensure low voiding and robust solder connections that also provide an adequate thermal path. This presentation will discuss the challenges of assembly and solder joint evaluation and will present potential options for assembly improvement.

Bio

Ben has worked in the electronics industry for 23 years and is currently a Fellow at Lockheed Martin. He has experience in a variety of manufacturing assembly processes, with a prime focus on circuit card assembly. He has led numerous internal research projects related to soldering and solder joint reliability, as well as participating in several industry round robin studies. Ben is an active participant on several industry standard committees and is currently the Chair of IPC's Pb-free Electronics Risk Management (PERM) council.

Tony Lentz Headshot

Tony Lentz
MBS Chemistry, Field Application Engineer
FCT Assembly

Presentation: Reliability of Electronics from a Solder and Flux Perspective

What is electronic reliability, and how is it measured?  How do solder alloys and fluxes affect reliability?  This presentation addresses these questions from a solder and flux perspective.  High reliability alloys are used to improve the lifespan of electronics in “harsh environments.”  Low temperature alloys (peak reflow < 200 °C) are used to reduce heat related defects during manufacturing.  No clean solder pastes and fluxes are formulated to optimize soldering performance and leave residues that are “high reliability.” 

High reliability and low temperature solder alloys include elements to increase strength, improve compliance, and control melting point.  No clean solder pastes and fluxes are formulated to enhance solder joint creation and to be “safe” to leave on the printed circuit board assembly (PCBA).   These materials will be discussed, and reliability data presented.  The goal is to give an overview of solder alloy and flux contribution to reliability of electronics. 

Bio

Tony Lentz began his career in the electronics industry in 1994 as an engineer at a PCB manufacturer for 5 years. From 1999 to 2012, he worked for FCT Companies as a laboratory manager and facility manager. Since 2013, Tony has focused on field application and R&D for FCT Assembly solder and stencil products. He has written and presented many papers at industry events. Tony is the chair of the IPC J-STD-004 task group and vice-chair of the IPC J-STD-005 task group. He is a speaker of distinction with SMTA and holds B.S. and M.B.S. degrees in Chemistry.

Erin Tillery headshot

Erin Tillery
Graduate Student, Ph.D. Candidate
Textile Technology Management, Wilson College of Textiles, NC State University

Presentation: Ruggedness Test of a New Standardized Test Method for Abrasion Resistance of E-Textiles

Standard test methods provide product developers with information regarding materials' suitability for different purposes. Typically, current standards are suitable for determining the mechanical properties of new materials. However, in the case of electronic textiles (E-Textiles) and wearable technology (wearables), adding conductive components with added functionality makes utilizing textile standards difficult, and these standards will not provide information on mechanical and electrical properties of conductive elements. New standards for E-Textile and wearables testing are needed to ensure product developers can obtain the information necessary to make informed decisions about new products. Standards organizations such as the American Society for Testing and Materials (ASTM) and the Institute for Printed Circuits (IPC) are working on new methods for testing E-Textiles and wearables but must ensure the tests are rugged before publication and industry adoption. This study focuses on performing a ruggedness test for a new IPC test method for abrasion resistance of E-Textiles.

Bio

Erin Tillery is a graduate student at the NC State University Wilson College of Textiles working towards a Ph.D. in Textile Technology Management. Her research is focused on technology transfer in the textile industry, and she is currently working on projects related to E-Textiles and wearable technology. Her former work at Mississippi State University during her undergraduate and master's degrees includes work with new test methods for E-Textiles, creation of new wearable technology products, and wearables for human performance monitoring.

AGENDA

Wednesday, October 9, 2024
The Old and The New Come Together (Voiding and Other Challenges)

The Old and The New Come Together (Voiding and Other Challenges)

Speakers: 

  • Tony Lentz, FCT Solder: Reliability of Electronics from a Solder and Flux Perspective
  • Udo Welzel, Robert Bosch: Voids in Solder Joints: The Past, the Present and the Future
  • Ben Gumpert, Lockheed Martin: BTC Assembly and X-Ray Challenges
  • Tim Pearson, Collins Aerospace: Overview of using X-ray Inspection in Assessing Solder Joint Quality
  • Panel Discussion: What Math is Required to Assess 75% Hole Fill?
THE KEYNOTE and MORE

THE KEYNOTE and MORE

More information coming soon!

Is it High Voltage?

Is it High Voltage?

Speakers:

  • Denis Barbini, Zestron USA
  • Steven Dirkes, United States Department of the Army
  • Takenori “Kenny” Kakutani, Taiyo Ink

 

What’s New Now? - E-Textiles/Advanced Technology/Design

What’s New Now?  - E-Textiles/Advanced Technology/Design 

Speaker:

  • Erin Parker Tillery, Ph.D. Student, Textile Technology Management
Thursday, October 10, 2024
Here Comes the Testing and Related Challenges

Here Comes the Testing and Related Challenges

  • Panel Discussion: ROSE Testing
  • Discussion: EE and an Industry Expert discussion on 80 year old test methods and 40 year old data - How do they play in todays industry?

 

What Now? The Future is Calling

What Now? The Future is Calling

  • Wrap Up Panel: What action do we take to preserve the industry?
12:00 PM | Networking Lunch

Networking Lunch Buffet

Thank you for participating in the event! 

**Schedule Subject to Change

REGISTRATION INFORMATION

Pricing Details
Registration Member Nonmember
Conference Registration  $695.00  $875.00
Cancellation Policy

Cancellation Policy:
If you are unable to attend, you may send a coworker in your place. Please notify us of name changes as soon as possible. If you need to cancel, please e-mail KimDiCianni@ipc.org.
 
Note, all cancellations must be a written notice. Please note the cancellation policy below:

Attendees who cancel in writing by September 22, 2023 will incur a $100 cancellation fee. Cancellations received after September 22, 2023 will be responsible for the full fee.

Register now

Discounted Group Registration
Bring your colleagues and save 20%! Register five or more colleagues from the same company and receive 20% off each attendee's registration. If you would like to take advantage of this group discount, please reach out to KimDiCianni@ipc.org.

EXHIBIT & SPONSORSHIPS

Promote Your Company Today!

Order Now

Cancellations will be accepted up to 15 days prior to the event. $100 cancellation fee will apply. No refunds will be given for notice less than 15 days prior to the event.

EXHIBITOR INFORMATION

Tabletop Exhibits

Tabletop Exhibits
$2,000 Member | $2,500 Nonmember   
Benefits include:

  • One 6' draped table
  • Two side chairs
  • One 6' draped table
  • One standard electrical outlet
  • Contact list of consented registered attendees
  • Logo on promotional materials, electronic and printed
  • One complimentary Conference registration for your exhibit staff, includes complimentary registration to IPC Builds (IPC committee meetings)

SPONSORSHIP OPPORTUNITIES 

Welcome Reception (exclusive, Wednesday evening)

$3,500  Member | $4,375 Nonmember

Benefits include:

  • Exclusive opportunity to deliver welcome address to attendees (3 minutes maximum)
  • One 6’ draped tabletop exhibit with two side chairs and one standard electrical outlet
  • Acknowledgement with sponsor logo on all printed conference materials
  • Acknowledgement with sponsor logo on all pre-conference electronic promotions
  • Signage at the event with sponsor name and logo
  • Opportunity to display sponsor promotional literature at the reception
  • Contact list of consented registered attendees
  • One complimentary Conference registration, includes complimentary registration to IPC Builds (IPC committee meetings)
Event Luncheon (exclusive, Wednesday)

$3,500 Member | $4,375 Nonmember

Benefits include:                                                           

  • One 6’ draped tabletop exhibit with two side chairs  and one standard electrical outlet
  • Tent cards with sponsor logo placed at each table
  • Acknowledgement with sponsor logo on printed conference materials
  • Acknowledgement with sponsor logo on pre-conference electronic promotions
  • Signage at the event with sponsor name and logo
  • Opportunity to display sponsor promotional literature
  • Contact list of consented registered attendees
  • One complimentary Conference registration, includes complimentary registration to IPC Builds (IPC committee meetings)
Event Refreshment Breaks (exclusive, Wednesday and Thursday)

$3,000 Member | $3,750 Nonmember

Benefits include:                                                           

  • One 6’ draped tabletop exhibit with one standard electrical outlet
  • Acknowledgement with sponsor logo on printed conference materials
  • Acknowledgement with sponsor logo on pre-conference electronic promotions
  • Signage at the event with sponsor name and logo
  • Opportunity to display sponsor promotional literature
  • Contact list of consented registered attendees
  • One complimentary Conference registration, includes complimentary registration to IPC Builds (IPC committee meetings)
Badge Lanyards, exclusive (sponsor provided)

$2,000 Member | $2,500 Nonmember

Benefits include:

Opportunity to distribute company branded badge lanyards to both High Reliability Forum and IPC Builds (IPC committee meeting) attendees. Benefits Include:

  • Acknowledgement with sponsor logo on printed conference materials
  • Acknowledgement with sponsor logo on pre-conference electronic promotions
  • Signage at the event with sponsor name and logo
  • Opportunity to display sponsor promotional literature
  • Contact list of consented registered attendees
  • One complimentary Conference registration, includes complimentary registration to IPC Builds (IPC committee meetings)
Attendee Giveaway (sponsor provided)

$2,000 Member | $2,500 Nonmember

Benefits include:

Opportunity to distribute company branded gift to both High Reliability Forum and IPC Builds (IPC committee meeting) attendees. Benefits include:

  • Acknowledgement with sponsor logo on printed conference materials
  • Acknowledgement with sponsor logo on pre-conference electronic promotions
  • Signage at the event with sponsor name and logo
  • Opportunity to display sponsor promotional literature
  • Contact list of consented registered attendees
  • One complimentary Conference registration, includes complimentary registration to IPC Builds (IPC committee meetings)

EXHIBITORS & SPONSORS

HOTEL AND LOCATION

Embassy Suites Hotel Raleigh-Crabtree
4700 Creedmoor Road
Raleigh, NC
Rate of $189 until September 13, 2024 or until all rooms are booked
Call 919-881-0000 or use the booking link below

RESERVE YOUR ROOM

Marriott Raleigh Crabtree Valley
4500 Marriott Drive
Raleigh, NC
Rate of $189 until September 13, 2024 or until all rooms are booked
Call 919-781-7000 or us the booking link below
Book your group rate for IPC Committee Meeting

Candlewood Suites Raleigh Crabtree
4433 Lead Mine Road
Raleigh, NC
Rate of $105 until September 23rd or until all rooms are booked
Call 919-789-4840 or use the booking link below

RESERVE YOUR ROOM

Traveling to the Hotel

A shuttle will be available Saturday - Thursday to/from the McKimmon Center and the IPC contracted hotels only.

Pickup Time:
Embassy Suites Crabtree: 7:30 am
Marriott Raleigh Crabtree: 7:35 am
Candlewood Suites Crabtree: 7:40 am

Dropoff Time:
The shuttle will be leaving at 5:15 pm from the McKimmon Center Saturday-Thursday to take attendees back to our contracted hotel block only.

*There will be an additional shuttle for those attending the Gnome Awards

CONTACT US 

Speaker and General Event Information

Julia Flynn 
Coordinator, Professional Development
JuliaFlynn@ipc.org

Exhibit and Sponsorship Sales Information

Kim DiCianni, CEM
Director, Trade Shows and Events
KimDiCianni@ipc.org 

Alicia Balonek, CEM
Senior Director of Trade Shows and Events
AliciaBalonek@ipc.org 

Registration Information

Kim DiCianni, CEM
Director, Trade Shows and Events
KimDiCianni@ipc.org 

Hotel and Location Information

Kristin Schueler, CMP
Director of Meetings and Events
KristinSchueler@ipc.org

Remote video URL
About IPC

IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000+ member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

McKimmon Center

1101 Gorman St
Raleigh, NC 27606
United States

McKimmon Center

McKimmon Center
1101 Gorman St
Raleigh, NC 27606
United States

IPC Hand Soldering Competition 2024 Regional Qualification – Estonia

IPC Hand Soldering Competition 2024 Regional Qualification – Estonia

Date
-

Save the date for the Estonian Regional Qualification for the IPC Hand Soldering Competition (HSC) to be held at Instrutec – Estonian Fairs Centre in Tallinn on 12-14 October 2024.

Skilled soldering experts (F/M) will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, earn a cash prize and a coveted spot at the IPC Hand Soldering World Championship (HSC World Final to take place on 14-15 November 2024 at electronica in Munich, Germany).

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes in accordance with IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality of the assembly as well as the speed at which the assembly was produced.

Prizes for Professionals

Cash prizes will be awarded to the professionals: the winner and two runners-up.

  • 1st place – 300€

  • 2nd place – 200€

  • 3rd place – 100€

IPC Hand Soldering World Championship: The winner at Instrutec will be invited by IPC (all expenses covered by IPC) to take part in the HSC World Final in November at electronica in Munich, Germany.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

The competition setup is supplied by organizers, no need to bring any equipment except your ESD cloths (with or without corporate branding).

How to register?

Registration form will be available shortly.

 

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org), or Arno Kolk, Estonian Electronics Industries Association (arno.kolk@estonianelectronics.eu).

 

Instrutec Tallinn

Pirita tee 28
12011 Tallinn Estonia
Estonia

Instrutec Tallinn

Instrutec Tallinn
Pirita tee 28
Tallinn, Estonia 12011
Estonia

IPC Hand Soldering Competition (HSC) 2024 in Japan

IPC Hand Soldering Competition (HSC) 2024 in Japan

Date
-

This competition is for choosing the Japanese champion to dispatch the world final 2024 with the cooperation of Japan Unix Co., Ltd. Preliminary details (mid-July & August) will be announced around June in their website. And then, only who pass the preliminary is invited to the final at NEPCON NAGOYA (Oct. 23 - 25).

For more information or event sponsorship, please contact Mr. Yusaku Kono at YusakuKono@ipc.org

Port Messe Nagoya, Japan

2-2, Kinjofuto
Nagoya Minato-ku, Aichi
455-0848
Japan

Port Messe Nagoya, Japan

Port Messe Nagoya, Japan
2-2, Kinjofuto
Nagoya Minato-ku, Aichi 455-0848
Japan

NEPCON NAGOYA / IPC HSC 2024 Japan Final

NEPCON NAGOYA / IPC HSC 2024 Japan Final

Date
-

NEPCON NAGOYA is the exhibition held in the center of the manufacturing industry of Japan. Nagoya is a capital city of Aichi prefecture which has Japan's largest automotive-related manufacturing industry cluster. IPC Japan will have its booth and have Japan regional final of IPC hand soldering competition 2024.

For more information or event sponsorship, please contact Mr. Yusaku Kono at YusakuKono@ipc.org

Port Messe Nagoya, Japan

2-2, Kinjofuto
Nagoya Minato-ku, Aichi
455-0848
Japan

Port Messe Nagoya, Japan

Port Messe Nagoya, Japan
2-2, Kinjofuto
Nagoya Minato-ku, Aichi 455-0848
Japan

Electric Vehicle and Smart Car Technology Workshop

Electric Vehicle and Smart Car Technology Workshop

Date
-

Electric vehicles and smart cars have become one of the fastest-growing markets in the electronics industry. With demands for automation, electrification, connectivity, and safety, vehicles are not only integrating more electronic products from various industries, but their quality and reliability must also be enhanced.

This workshop encourages attendees to interact, discuss, and share research and experiences related to the following topics:

• Material and technology trends in electric vehicles

• Reliability issues of electronic equipment in electric vehicles, including PCBs, solder joints, components, and assemblies

• Electronic component characteristics, failure analysis, reliability modeling, standards, and specifications

• Knowledge gaps and collaborative opportunities to address common issues faced by the supply chain of materials and parts for electric vehicles

This workshop will be organized during TPCA SHOW from October 23-25, 2024.

For more information or event sponsorship, please contact Ms. Winny Lin at WinnyLin@ipc.org

Nangang Exhibition Center

No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

Nangang Exhibition Center

Nangang Exhibition Center
No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

IPC Hand Soldering Competition - Regional & World Championship - electronica 2024

IPC Hand Soldering Competition - Regional & World Championship - electronica 2024

Date
-

Save the date for the Regional Qualification for the IPC Hand Soldering Competition (HSC) being held at electronica – Munich, Germany - Hall #A4, IPC Booth #A4-502 - on 12-13 November 2024.

Skilled soldering experts (F/M) will be competing for 60 minutes on a complex circuit board assembly in the regional competition (12-13 November 2024) to win the 2024 Regional title, earn a cash prize , and a coveted spot at the IPC Hand Soldering World Championship.  (HSC World Final to take place on 14-15 November 2024 at electronica in Munich, Germany).

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes in accordance with IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality of the assembly as well as the speed at which the assembly was produced.

Prizes for Professionals

Cash prizes will be awarded to the professionals: the winner and two runners-up.

  • 1st place – 300€
  • 2nd place – 200€
  • 3rd place – 100€

IPC Hand Soldering World Championship: The winner of the regional competition at electronica will be invited to take part in the HSC World Finals, 14-15 November 2024, IPC booth #A4-502.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

The competition setup is supplied by organizers, no need to bring any equipment except your ESD cloths (with or without corporate branding).

How to register?

Registration form will be available shortly.

 

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org)

Messe München

Am Messesee 2
81829 Munich
Germany

Messe München

Messe München
Am Messesee 2
Munich, 81829
Germany

IPC APEX EXPO 2025

IPC APEX EXPO 2025

Date
-

Discover the newest innovations and hear from the best minds in the electronics manufacturing industry. IPC APEX EXPO 2025 will be our industry’s largest event in North America featuring a world-class trade show, professional development courses taught by industry experts, non-stop networking and more! Join us in Anaheim, California, March 15-20, 2025.

Anaheim Convention Center

800 W Katella Ave
Anaheim, CA 92802
United States

Anaheim Convention Center

Anaheim Convention Center
800 W Katella Ave
Anaheim, CA 92802
United States