8:00 am-8:45 am | Morning Keynote Session, Port Vell Room Networking Area
9:00 am-10:15 am
5-21H: Bottom Termination Components (BTC) Task Group
The 5-21H task group is maintaining IPC-7093, a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body.
2-12A: Generic Requirements for Digital Twin Task Group
The 2-12A task group is responsible for maintaining IPC-2551, International Standard for Digital Twin Architecture, which stipulates and defines Digital Twin properties, types, complexities and readiness levels.
9:00 am-12:00 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting
The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.
The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.
Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. A visit to EURECAT's plastronics pilot plant is planned as an afternoon activity.
7-25A: Automated Optical Inspection Process Control Standard Task Group
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.
9:00 am-5:30 pm
E-31 Supplier Declaration Subcommittee
The E-31 establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.
10:30 am–12:00 pm
2-12B: Model Based Definition (MBD) for Digital Twins Task Group
The 2-12B task group is responsible for maintaining IPC/DAC -2552, General Electronic Components Model Based Definition (MBD) Standard, a set of specification elements for components and parts as part of a digital model-based standard for digital design of board-level assemblies and to support virtual manufacturing.
10:30 am–5:30 pm
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group
This Task Group is responsible for maintaining an addendum to J-STD-001 and IPC-A-610 to enable users to specify a standardized set of acceptance criteria unique to assemblies used in the automotive industry.
12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area
1:30 pm–3:00 pm
5-22AS: Space and Military Electronic Assemblies Task Group
The 5-22AS Task Group is responsible for maintaining an addendum to J-STD-001 to enable users to specify a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.
1:30 pm–3:15 pm
D-31B: IPC-2221/2222 Task Group
This task group is responsible for the development/update of IPC-2221, Generic Standard on Printed Board Design, and IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards.
2-12C: Cybersecurity Protection Standard Task Group
The 2-12C task group is responsible for maintaining IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain, which establishes requirements to provide assurance that products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to cybersecurity incidents.
1:30 pm–5:30 pm
5-33A: Conformal Coating Task Group
The 5-33A task group is responsible for maintaining IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies and the associated test methods.
3:15 pm–4:15 pm
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
The 7-31FS Task Group is responsible for maintaining an addendum to IPC/WHMA-A-620 to enable users to specify a standardized set of acceptance criteria unique to cable and wire harness assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.
3:30 pm-5:30 pm
D-33-AP: Ultra HDI Subcommittee
The D-33-AP Subcommittee is responsible for developing design and fabrication guidelines for printed boards utilizing conductors and spacings below 50 µm and dielectric spacings below 75 µm (defined as Ultra HDI within the Subcommittee) that are manufactured with semi-additive and modified semi-additive processing.
2-12D: Digital Sustainability Credentials Standard Task Group
The 2-12D task group is responsible for developing IPC-2553 Global Standard for Digital Sustainability Credentials, which establishes the framework, content definition and secure interoperability mechanism that provides the needed ability to exchange factors that influence environmental sustainability, without the risk of IP leakage, in a way that scales from the original source of materials, through to the final product.
4:30 pm–5:30 pm
7-34: Repairability Subcommittee
The 7-34 subcommittee is responsible for the maintenance of IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies.