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IPC Hand Soldering Competition 2025 Regional Qualification - Italy

IPC Hand Soldering Competition 2025 Regional Qualification - Italy

Date
- (2:00 - 10:00am CDT)

Join the Regional Qualification Italy for the IPC Hand Soldering Competition (HSC) at Vincenza Expo Centre, Italy 21-22 May 2025.

Skilled soldering experts (F/M) will compete for 60 minutes on a complex circuit board assembly to win the 2025 National title, earn a cash prize, and compete for a coveted spot at the IPC Hand Soldering World Championship later this year.

Competition for Professionals

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes under IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality, and the speed at which the assembly was produced.

Prizes for Professionals

The professionals will receive cash prizes: the winner and two runners-up.

  • 1st place – 300 €
  • 2nd place – 200 €
  • 3rd place – 100 €

IPC Hand Soldering World Championship: The winner will be invited by IPC (all expenses covered by IPC) to compete in the HSC World Final in November at productronica tradeshow in Munich, Germany.

Hand Soldering Best Company Team Award: This year again, nominate a team to win the Hand Soldering Best Company Team Award. For any company enlisting 2 or 3 competitors, the highest combined scores of competitors from the same company will determine which company will receive the HSC Best Company Team Award.

Registration is free of charge.

You do not need to be an IPC member to take part.

You do not need to be IPC-certified to take part.

How to register?

Fill in the registration form and book your competition slot.

The registration deadline is Thursday 15 May 2025.

You will receive a confirmation email specifying your date and time to compete.

For more information, please contact Philippe Léonard, IPC Europe director (PhilippeLeonard@ipc.org).

Vicenza Expo Centre

Vicenza Expo Centre – Pad. 1
Via Oreficeria, 16
36100 Vicenza VI
Italy

Vicenza Expo Centre

Vicenza Expo Centre
Vicenza Expo Centre – Pad. 1
Vicenza, VI 36100
Italy

Components to Systems: Integration Needs, Gaps, Challenges, and Solutions

Components to Systems: Integration Needs, Gaps, Challenges, and Solutions

Date
-

HIR Session with Joint Participation by IPC at 75th Electronic Components and Technology Conference (ECTC) 
May 27, 2025 - 3:30pm – 5:00pm
Room: Texas D
Gaylord Texan Resort & Convention Center
Dallas, Texas

Moderated by industry leaders:

  • Dr. William Chen (ASE)
  • Dr. Ravi Mahajan (Intel)
  • Dr. Devan Iyer (IPC)

Featuring expert speakers and panelists from:
Google • AMD • ASE • Siemens EDA • IME • KNS
 

Topics Include: 

  • Co-design strategies
  • Thermal management
  • Materials and assembly
  • Reliability considerations
  • R&D prototyping capabilities  

This session will explore the critical technologies and collaborations driving successful Component-to-System Integration in today’s advanced electronics landscape.

See you at #ECTC2025! ECTC | IEEE Electronic Components and Technology Conference

Gaylord Texan Resort & Convention Center

1501 Gaylord Trail
Grapevine, TX 76051
United States

Gaylord Texan Resort & Convention Center

Gaylord Texan Resort & Convention Center
1501 Gaylord Trail
Grapevine, TX 76051
United States

IPC Day Mil-Aero Toulouse

IPC Day Mil-Aero Toulouse

Date
-

IPC Day Mil-Aero Toulouse – 4-5 June 2025

Wednesday 4 June 13:00-17:00 and Thursday 5 June 9:00-13:00

 

Day 1 (afternoon session) – Wednesday 4 June 

Welcome Address : 
•    Airbus DS - Pierre-Emmanuel Goutorbe, & IPC – Sanjay Huprikar

Keynote
·      Alison James – Update advocacy
·      Airbus DS-Defense & Space - Oscar Vazquez Chiclana

Session 1 – Connectors & High-speed Connectivity
A technical session where industry leaders and experts will dive into the latest innovations, challenges, and design strategies for connectors-to-board, including high-speed connectivity technology.

Presentations will cover common use cases in aerospace/automotive areas addressing technical challenges and solutions, e.g., signal integrity and mechanical reliability. Industry experts are going to address best design practices, such as those applicable to printed board and wire harness design in relation to connector selection. 

Q&A sessions will be held after each technical session to enhance discussion on industry challenges and needs in standardization.

Confirmed speakers include : Airbus Patrick Rainjonneau, ODU Jonathan Milteau,  Considered speakers may include Thales, Amphenol, AXON, C&K, Radiall, FCI, Smith Interconnect, Positronic, Glenair France... 

Networking Dinner

Day 2 (morning session) – Thursday 5 June (9-13)

Session 2 – Press-fit Technologies Deep Dive
A team of industry experts with multi decade experience in designing, materials, manufacturing, process quality and acceptability, reliability of the interconnection, as well as the fundamental physical mechanisms will draw a holistic picture of press-fit technology.

The presentations include the Press-fit pin itself, PCB and PCBA, as well as the connector part. Quality and reliability will be discussed with an extensive automotive background. Following the presentation part, the speakers are happy to discuss questions around space requirements, surface finishes, and any other topics around the press-fit interconnection. Basis for the session will be the IPC-9797A standard and the IPC-HDBK-9798 handbook. The A version of the handbook will include a rework section.

Confirmed speakers include : Continental François Le Rest, Bosch Philippe Jaeckle, Uibel consulting Frank Uibel, EPT Hermann Eicher  

Hotel room in Toulouse for IPC Day participants

Toulouse is under quite high hotel room pressure during this period and IPC is holding a roomblock of 15 rooms available for IPC Day participants at Aparthotel Adagio Toulouse Centre Ramblas (located nearby the conference venue). 

These rooms are available for checkin 4 June and checkout 5 June at the price of 196 EUR per night (excluding. breakfast). They are to be paid onsite at checkin time and need to be attributed to participants by Thursday 29 May at the very latest. 

In case you would like to get one of these rooms for your own use, please send a written request including guest first name, last name and checkin/checkout date to philipeleonard@ipc.org

Upon receipt, a confirmation will be returned to you to confirm that the room is yours. Please note that any cancellation received after 29 May will bear 100% cost. 
 

Region
First Name Toulouse (formerly Pullman Toulouse Centre Ramblas)

84 All. Jean Jaurès
31000 Toulouse
France

First Name Toulouse (formerly Pullman Toulouse Centre Ramblas)

First Name Toulouse (formerly Pullman Toulouse Centre Ramblas)
84 All. Jean Jaurès
Toulouse, 31000
France

Component-to-System Level Packaging - Addressing Integration Challenges for Automotive & Industrial Applications

Component-to-System Level Packaging - Addressing Integration Challenges for Automotive & Industrial Applications

Date
- (4:00 - 9:00am CDT)

Sponsorship Packages are available for the workshop on Component-to-System Level Packaging - Addressing Integration Challenges for Automotive and Industrial Applications.

Registration is now open to attend the workshop. Be Part of the Solution - The workshop is intended to bring together industry experts presenting and discussing CLP and SLP trends, requirements, challenges, solutions, and the needs for guidelines/standards desired for design, assembly, test, reliability, and manufacturing solutions (EMS) perspective.

Region
Mercure Hotel MOA Berlin

Stephanstrabe 41
10559 Berlin
Germany

Mercure Hotel MOA Berlin

Mercure Hotel MOA Berlin
Stephanstrabe 41
Berlin, 10559
Germany

Advanced Packaging to System Integration – Trends and Challenges

Advanced Packaging to System Integration – Trends and Challenges

Date
- (9:30 - 10:15am CDT)

Advanced Packaging to System Integration – Trends and Challenges
 

Speaker:
Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC
 

Date & Time:
Tuesday, July 9, 2025
8:30 AM – 9:15 AM (Mountain Time)
 

Location:
3D-PEIM 2025
Golden, Colorado

The future of electronics isn’t just about smaller chips—it’s about smarter integration. In this keynote plenary, Dr. Devan Iyer will explore how advanced packaging technologies such as 2.5D/3D, fan-out, and heterogeneous integration are enabling next-generation applications in data centers, 5G/6G, autonomous systems, IoT, and AR/VR.
The session will also address critical challenges in chip-package-PCB co-design and highlight the materials, processes, and integration strategies shaping the systems of tomorrow.


More Information & Registration:
https://www.3d-peim.org/
 

Sheraton Denver West Hotel

360 Union Blvd
Lakewood, CO 80228
United States

Sheraton Denver West Hotel

Sheraton Denver West Hotel
360 Union Blvd
Lakewood, CO 80228
United States

IPC WorksAsia-AI & Factory of the Future

IPC WorksAsia-AI & Factory of the Future

Date
- (12:00 - 4:00am CDT)

AI and IPC standards empower future factories - building a new smart manufacturing ecosystem.

Nangang Exhibition Center

No. 1, Jingmao 2nd Road
Nangang District, Taipei City 11568
Taiwan

Nangang Exhibition Center

Nangang Exhibition Center
No. 1, Jingmao 2nd Road
Nangang District, TPE 11568
Taiwan

IPC Taiwan Member Appreciation Dinner

IPC Taiwan Member Appreciation Dinner

Date
- (5:00 - 7:30am CDT)

IPC Taiwan Member Appreciation Dinner

Courtyard by Marriott

NO.359, Sec. 7, ZhongXiao E. Rd.
Nangang District, Taipei City 11568
Taiwan

Courtyard by Marriott

Courtyard by Marriott
NO.359, Sec. 7, ZhongXiao E. Rd.
Nangang District, TPE 11568
Taiwan

IPC Builds-Standards Development Committee Meetings

IPC Builds-Standards Development Committee Meetings

Date
-

We can’t wait to welcome you to IPC Builds, September 13-18, 2025 at the Embassy Suites by Hilton Denton Convention Center in Denton, Texas.

 REGISTER | AGENDA | COMMITTEE MEETINGS CONTACT US | HOTEL & LOCATION

IPC Builds is all about IPC Standards, welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Newcomers and industry veterans are welcome. Participate and learn more about these critical industry documents.

IPC Standard Development Committees cover a range of topics, including:

  • Assembly and Joining
  • Assembly Equipment
  • Base Materials
  • Cleaning and Coating
  • Electronic Documentation Technology
  • Electronic Product Data Description
  • Embedded Devices
  • Environment, Health and Safety
  • Fabrication Processes
  • Flexible and Rigid-Flex Printed Boards
  • High Speed/High Frequency Interconnection

 

  • Management
  • Packaged Electronic Components
  • Printed Board Design Technology
  • Printed Electronics
  • Process Control
  • Product Assurance
  • Product Reliability
  • Rigid Printed Boards
  • Terms and Definitions
  • Testing
  • Wearable Electronics/E-Textiles

REGISTRATION INFORMATION

Member: $299
Nonmember: $349

REGISTER NOW >

For questions about registration please contact: 

Kim DiCianni, CEM                                   
Director Tradeshows & Events
KimDiCianni@ipc.org 

AGENDA

Registration Hours
Saturday, September 13-Thursday, September 18 | 7:00 am-5:00 pm

Lunch included on Monday

Golden Gnome Awards Dinner
Tuesday, September 16 | 5:00 pm-8:30 pm

Committee Meetings 
Saturday, September 13-Monday, September 15 | 8:00 am-5:00 pm
Tuesday, September 16 | 8:00 am-3:00 pm
Wednesday, September 17-Thursday, September 18 | 8:00 am-5:00 pm

Golden Gnome Awards

CONTACT US

Technical Staff

David Bergman 
Vice President, Standards & Technology
DavidBergman@ipc.org 

Chris Jorgensen
Director, Technology Transfer
ChrisJorgensen@ipc.org

Doug Sober
Director, Materials & IEC Engagement
DougSober@ipc.org

Teresa Rowe
Senior Director, Assembly & Standards Technology
TeresaRowe@ipc.org 

John Perry 
Director, Printed Board Standards & Technology
JohnPerry@ipc.org

Debora Obitz
Manager, Technical Programs
DeboraObitz@ipc.org

Registration

Kim DiCianni, CEM
Director Tradeshows & Events
KimDiCianni@ipc.org

Hotel and Location

Kristin Schueler, CMP 
Director of Meetings and Events
KristinSchueler@ipc.org

HOTEL INFORMATION & LOCATION

Hotel: 
Embassy Suites by Hilton Denton Convention Center
3100 Town Center Tr., Denton TX

IPC is offering a rate of $160 per night. The room rate is available until August 29, or until all rooms are booked. 

Booking Link: IPC Builds

Room Rate includes the following:

  • Complimentary Breakfast Buffet for overnight guests
  • Complimentary Evening Reception for overnight guests
  • Complimentary guestroom Wi-Fi for Hilton Honor members
  • Complimentary use of fitness center, and pools/splash pad
  • Complimentary use of business center
  • Complimentary self-parking
  • No resort, porterage fees 
Embassy Hilton
Embassy Suites by Hilton Denton Convention Center

3100 Town Center Tr
Denton, TX 76201
United States

Embassy Suites by Hilton Denton Convention Center

Embassy Suites by Hilton Denton Convention Center
3100 Town Center Tr
Denton, TX 76201
United States

IPC CEMAC 2025

IPC CEMAC 2025

Date
- (Sep 24, 2025 | 8:00pm - Sep 26, 2025 | 7:00am CDT)

The IPC CEMAC (China Electronics Manufacturing Annual Conference), an exclusive event for IPC members, is dedicated to advancing the development and collaboration of the electronics industry. The conference focuses on promoting the adoption and dissemination of quality and technical standards in electronics manufacturing while serving as a high-value, professional, and efficient platform for international exchange built around IPC’s global industry standards.

To enhance international collaboration and drive sustainable development in electronics manufacturing, IPC CEMAC 2025 will center on the theme "Shaping a Sustainable Future." The event invites participants to explore ways to achieve sustainability through technological innovation, efficient resource utilization, and improved production processes. It seeks to promote green, smart manufacturing and effective supply chain management while embedding sustainability into all aspects of electronics manufacturing, supporting the industry’s long-term, healthy growth.

Crowne Plaza Shanghai Jinxiu

No.399 Jinzun Road
Pudong Xinqu
Shanghai Shi, 200125
China

Crowne Plaza Shanghai Jinxiu

Crowne Plaza Shanghai Jinxiu
No.399 Jinzun Road
Pudong Xinqu, SH 200125
China

IPC Hand Soldering Competition (HSC) 2025 in Japan

IPC Hand Soldering Competition (HSC) 2025 in Japan

Date
-

This competition is for choosing the Japanese champion to dispatch the world final 2025 with the cooperation of Japan Unix Co., Ltd. Preliminary details (mid-July & August) will be announced around June in their website. And then, only who pass the preliminary is invited to the final at NEPCON NAGOYA (Oct. 29 - 31).

Port Messe Nagoya, Japan

2-2, Kinjofuto
Nagoya Minato-ku, Aichi
455-0848
Japan

Port Messe Nagoya, Japan

Port Messe Nagoya, Japan
2-2, Kinjofuto
Nagoya Minato-ku, 23 455-0848
Japan

NEPCON NAGOYA / IPC HSC 2025 Japan Final

NEPCON NAGOYA / IPC HSC 2025 Japan Final

Date
- (Oct 28, 2025 | 8:00pm - Oct 31, 2025 | 3:00am CDT)

NEPCON NAGOYA is the exhibition held in the center of the manufacturing industry of Japan. Nagoya is a capital city of Aichi prefecture which has Japan's largest automotive-related manufacturing industry cluster. IPC Japan will have its booth and have Japan regional final of IPC hand soldering competition 2024.

Port Messe Nagoya, Japan

2-2, Kinjofuto
Nagoya Minato-ku, Aichi
455-0848
Japan

Port Messe Nagoya, Japan

Port Messe Nagoya, Japan
2-2, Kinjofuto
Nagoya Minato-ku, 23 455-0848
Japan