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PCB Design for Extreme Environments

PCB Design for Extreme Environments

Date
Jan 25, 2021 | 12:00 - 2:00pm EST (12:00 - 2:00pm EST)

Every Monday and Wednesday  1/25/2021 - 3/3/2021

This course addresses specific challenges encountered in the design of products for service in severe conditions. These include the effects of abrasive particles, positive and negative temperatures, pressure, moisture, and corrosives such as salt water, acids, and bases. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

PCB Design for Military & Aerospace Applications

PCB Design for Military & Aerospace Applications

Date
Jan 25, 2021 | 6:30 - 8:30pm EST (6:30 - 8:30pm EST)

Every Monday and Wednesday 1/25/2021-3/3/2021

This course addresses specific design challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, and altitude, extended operating temperature range, and other design considerations for high reliability applications. PCB Design for Military & Aerospace Applications also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Introduction to PCB Design I

Introduction to PCB Design I

Date
Feb 9, 2021 | 6:30 - 8:30pm EST (6:30 - 8:30pm EST)

Every Tuesday and Thursday 2/9/2021-3/5/2021

Taught by an IPC-certified industry expert with more than 25 years of experience in the field, this 6-week online program introduces participants to the concepts and skills required to create realworld designs that comply with IPC standards. This introductory course will focus on front-end design concepts such as schematic capture, library parts creation, basic electrical engineering concepts, and documentation.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

28th Annual WHMA Wire Harness Conference

28th Annual WHMA Wire Harness Conference

Date
Feb 15, 2021 | 7:00pm - Feb 18, 2021 | 6:59pm EST

Due to concerns with COVID-19, this event has been cancelled. New dates for 2022 coming soon.

Over the past 28 years, the WHMA Annual Wire Harness Conference has become one of few investments that give an opportunity to learn, grow, share, and discover new approaches to many aspects of the wire harness industry. The conference features a number of timely presentations on topics important to wire harness manufacturers, OEMs and suppliers. It also includes peer-to-peer networking, best-practices roundtables and a tradeshow with industry leading suppliers. It’s a conference you do not want to miss!

Westin La Paloma Resort & Spa

3800 E Sunrise Dr
Tucson, AZ 85718
United States

Westin La Paloma Resort & Spa

Westin La Paloma Resort & Spa
3800 E Sunrise Dr
Tucson, AZ 85718
United States

Certified Electronics Program Manager (CEPM) Training Program and Certification Exam Bundle

Certified Electronics Program Manager (CEPM) Training Program and Certification Exam Bundle

Date
Feb 16, 2021 | 6:30 - 8:30pm EST (6:30 - 8:30pm EST)

Every Tuesday and Thursday 2/16/2021-3/25/2021

In the highly competitive electronics industry, the knowledge and skills of staff directly responsible for client services and program management can make or break the bottom line. The IPC Certified Electronics Program Manager (CEPM) Training and Certification course is designed to ensure that your team has the tools and training they need to provide the type of service that ensures clients for life. This new, instructor-led online course combines the educational benefits of live instruction and group discussions with the flexibility and cost-savings of e-learning. Taught by an IPC-certified industry expert with 30 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded training, job-specific exercises, and team projects to facilitate mastery of the key business and technical concepts required of program managers in the electronics industry.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

IPC APEX EXPO 2021

IPC APEX EXPO 2021

Date
Mar 6 - 11, 2021 | All day (All day)

IPC APEX EXPO is the largest event for electronics manufacturing in North America attracting more than 9,000 professionals from 45 countries. From the industry’s leading technical conference and application-focused professional development courses, to the innovation-driven exhibit floor, year after year IPC APEX EXPO is packed with far-reaching ideas and insights.

San Diego Convention Center

111 W Harbor Dr
San Diego, CA 92101
United States

San Diego Convention Center

San Diego Convention Center
111 W Harbor Dr
San Diego, CA 92101
United States

PCB Troubleshooting and Defect Analysis

PCB Troubleshooting and Defect Analysis

Date
Mar 22, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

Every Monday and Wednesday 3/21/2021-04/14/2021

Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program is designed to provide the knowledge and skills necessary to identify printed circuit board defects and determine corrective action.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

PCB Design for Advanced Packaging

PCB Design for Advanced Packaging

Date
Mar 22, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

Every Monday and Wednesday 3/22/2021-4/28/2021

In this course, participants learn to effectively implement designs requiring advanced packaging, complex geometry, circuit size reduction, high density, and advanced routing. The course also focuses on how these complexities impact manufacturing and assembly techniques, documentation, and manufacturing file generation.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Introduction to PCB Design II

Introduction to PCB Design II

Date
Mar 23, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

Every Tuesday and Thursday 3/23/2021-5/13/2021

In this course, participants employ the lessons learned in Introduction to PCB Design I to effectively implement their designs using techniques such as multi-layer routing, signal integrity, transmission lines, and more. The course also focuses on how manufacturing and assembly techniques impact design, documentation and manufacturing file generation.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Contracting with the Customer

Contracting with the Customer

Date
Apr 12, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

Every Monday and Wednesday 4/12/2021-4/28/2021

Without a doubt, negotiating with OEMs and other customers is one of the biggest challenges facing the electronic manufacturing services (“EMS”) manager/executive. What needs to be covered in the contract? How should risk be allocated and balanced with pricing? Are there proper allocations of risk and limitations of liability for warranty, intellectual property, sourcing, and product content provisions? Is our company properly protected? What terms represent industry standards in allocation of risk and responsibility? What should we do if there is a dispute? What are current best practices? This unique program addresses the specific issues EMS companies face while contracting with a customer.

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States

Electrical Wire Processing Technology Expo

Electrical Wire Processing Technology Expo

Date
May 10, 2021 | 8:00pm - May 13, 2021 | 7:59pm EDT

Over the past 19 years, the National Electrical Wire Processing Technology Expo has grown into a comprehensive industry resource! As the exclusive showcase for the electrical wire harness, wire and cable processing industries, the Expo connects buyers with local, national, and international manufacturers and distributors. It’s the only event where the industry meets as a whole to present and access new technologies, innovative products and services, as well as solutions for challenging wire problems. By bringing together buyers and manufacturers, this Expo presents the ideal venue to find new opportunities and generate new business.

Wisconsin Center

400 W Wisconsin Ave
Milwaukee, WI 53203
United States

Wisconsin Center

Wisconsin Center
400 W Wisconsin Ave
Milwaukee, WI 53203
United States

High Reliability Forum

High Reliability Forum

Date
May 11, 2021 | 1:00am - May 14, 2021 | 12:59am EDT

*POSTPONED DUE TO COVID-19*
High Reliability Forum has been rescheduled for May 11-13, 2021.

IPC has partnered with ANSYS for the High Reliability Forum.
 
The High Reliability Forum provides a great opportunity to learn about the latest advancements in electronics, participate in industry discussions, and network with this respected community of professionals focused on electronics with high reliability requirements. This event includes keynote, technical presentations, professional development courses, tabletop exhibits and panel discussions.
 
Expert speakers will cover:

  • Class 3 electronics considerations
  • Military, aerospace, automotive and other applications with specialized reliability requirements
  • Well-rounded, industry-curated content covering many different topics related to PCB design, laminate reliability, PCB assembly #reliability, PCBA surface reliability, mitigation strategies and test methods

If you manufacture, design or test Class 3 electronics for applications with unique safety, reliability and lifetime requirements, you should not miss High Reliability Forum.

Registration Details

Pricing Details
Registration Member Nonmember
Technical Conference Package (Includes one full day workshop OR two half-day tutorials PLUS the conference - Tuesday, Wednesday, and Thursday)  $845.00  $1,112.00
*One full-day workshop or two half-day tutorials (Tuesday only)  $350.00  $440.00
Conference (Wednesday and Thursday)  $695.00  $875.00

*One full-day workshop or two half-day tutorials, running concurrently.

Registration opening soon

Cancellation Policy

Cancellation Policy:
If you are unable to attend, you may send a coworker in your place. Please notify us of name changes as soon as possible. If you need to cancel, please e-mail AndreaKeefe@ipc.org.
 
Note, all cancellations must be a written notice. Please note the cancellation policy below:

Attendees who cancel in writing by May 4, 2021 will incur a $100 cancellation fee. Cancellations received after May 4, 2021 will be responsible for the full fee.
 
Exhibitors and/or Sponsors who cancel in writing by April 27, 2021 will incur a $100 cancellation fee. Please be advised that no refund will be issued for any cancellations after April 27, 2021.

BECOME A SPEAKER

Call for Participation

Join us in High Reliability Forum as a presenter or instructor and share your expertise on electronics with high reliability requirements.  

IPC and ANSYS invite engineers, researchers, academics, technical experts and industry leaders to submit abstracts for High Reliability Forum to be held May 11-13, 2021 in Baltimore, MD.

With a focus on electronics subjected to harsh use environments, we are seeking speakers to discuss technology drivers leading industry advancements today.
 
Additional topics include:

  • Connector failure modes and reliability
  • Design and simulation approaches to avoid EMI/EMC and ESD/EOS failures
  • Design for Reliability
  • Design Rules for Spacing and Staggered Vias
  • Device level reliability, including transistor aging and wear-out
  • Failure Modes Effects Analysis (FMEA)
  • Fatigue behavior and reliability testing for Solder Joints using next gen solder alloys
  • Harsh Environment Reliability and Testing
  • HDI Reliability
  • Materials Compatibility
  • Vibration and shock Test Methods for predicting reliability
  • Microvia Concerns and Test Methods
  • Microvia reliability and design rules
  • 3D Package level reliability
  • Reliability assurance and prediction workflows
  • Robustness of interposers and new first level connection methodologies
  • Solder fatigue and the role of underfill, mirroring, and housing
  • System-level effects on Solder Joint Reliability
  • PDBA Surface Reliability (including cleaning, testing and coating strategies)
  • Thermal Mitigation
  • Thermal Stress Test Methods
  • Use of simulation in the design process

Abstracts summarizing original and previously unpublished work must be submitted for consideration to present. Presentations should be non-commercial and describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. Presenting at High Reliability Forum provides visibility for you and your organization.
 
The time to plan your participation is now! Presenting at High Reliability Forum provides visibility for you and your organization.
 
Submit your abstract by February 12, 2021 by emailing Debora Obitz at DeboraObitz@ipc.org, IPC technical conference program manager.
 
For information on sponsorship or table-top exhibitor opportunities please contact AliciaBalonek@ipc.org, IPC senior director, tradeshows & events.

SCHEDULE

Tuesday, May 11, 2021
8:30 AM - 12:00 PM | PD Course #1: TBD

1/2 day tutorial in the morning

8:30 AM - 4:30 PM | Full-Day Workshop on Implementing End-to-End Electronics Reliability Workflow: Presented by ANSYS

The success of every major technology trend, including 5G, Electrification and Autonomous depends on electronics reliability. A PCB forms the backbone of every electronic product and ensuring electrical, thermal and mechanical reliability of a PCB should be at the core of the electronics design process.    
 
Every successful electronics company must ensure power and signal integrity, predict shock and vibration failure, eliminate EMI, and design effective cooling systems, all before the product is built.  
 
This workshop will address end-to-end electronics reliability workflow, discuss common challenges to electronics reliability and available solutions. Attendees will walk away with a clear solution to electronics reliability.
 
8:30 am to 9:00 am Introductions
Why is End-to-End Electronics Reliability Important?
Speaker: Craig Hillman
9:00 to 9:45 Picking the Right Parts: Component Reliability
Speaker: Joao Geada / Ashok Alagappan
9:45 to 10:00 Identifying and Eliminating EMI/EMC at Design
Speaker: Juliano Mologni
10:00 to 10:15 Break
10:15 to 11:00 Signal and Power Integrity: True Multi-Physics Analysis
Speaker: Wade Smith
11:00 to 11:45 Sherlock and Icepak: A Match Made in Heaven
Speaker: Carlos Gomez / Gil Sharon
11:45 to 12:45 Lunch
12:45 to 1:30 Best Practices in ECAD to MCAE (You Can’t Fix What You Can’t Solve)
Speaker: Kelly Morgan / Nathan Blattau
1:30 to 2:15Solving System-Level Solder Fatigue (When Your Box is Bad)
Speaker: David Dang (Sherlock to Icepak to Mechanical to Sherlock)
2:15 to 2:30 Break
2:30 to 3:15 Using Optimization to Predict Drop Performance
Speaker: Siddharth Shah (Sherlock to Mechanical to LS-Dyna to OptiSlang)
3:15 to 4:00 Battery Reliability Guaranteed Through Simulation and Test
Xiao Hu / Vidyu Challa
4:00 to 4:30 Ensuring Compliance to ISO26262
Speaker: Ed Dodd (Sherlock to Medini)

12:00 PM  -  1:00 PM | Boxed Lunch

Included with either workshop or tutorial registration, or the technical conference package registration.

1:00 PM - 4:30 PM | 1/2 Day Tutorial: Role and Selection Criteria of Surface Finish for Next Generation PCB Technologies - 5G, HDI, RF-Microwave, High Frequencies

The advent and ongoing evolution of internet-enabled mobile devices has continued to drive innovation in the manufacturing and design of technology capable of high-frequency/high-density electronic signal transfer. The combined requirements for both fast, always-on data transmission, and small geometric form-factors can be difficult to satisfy without compromised performance and signal loss.
 
Among the primary factors affecting the integrity of high frequency signals is the surface finish applied on PCB copper pads – a need commonly met by technology manufacturers through the electroless nickel immersion gold process, ENIG. However, a well-documented limitation of ENIG is its insertion loss due to the inferior conductivity of nickel over copper, leading to higher conductor losses. Additionally, nickel’s ferromagnetic properties adversely affect circuit performance. The result is an overall reduced performance in high-frequency data transfer rate for ENIG-applied electronics, compared to bare copper.
 
The selection criteria of surface finish for 5G, high frequency, high density application involves minimal insertion loss, long shelf life, cost-effective and high reliability. There are few options (Immersion Sn, Immersion Ag, OSP, EPIG, EPAG, DIG, etc.) available in the market and their pros and cons will be discussed. Moreover, details will be discussed on an innovative nickel-less approach involving a proprietary nano-engineered barrier designed to coat copper contacts, finished with an outermost gold layer which has shown superior benefits over contemporaries.

Instructor: Kunal Shah, Ph.D.     
 

Wednesday, May 12, 2021
8:30 AM - 8:45 AM | Welcome
Steering Committee: Martin Goetz
    8:45 AM - 10:00 AM | Keynote

    Description coming soon

    10:30 AM - 11:15 AM | Semiconductor Reliability from the Manufacturer's Perspective

    This presentation will explore and highlight the current reliability space from the perspective of the semiconductor supplier. Reliability testing methods as applied by semiconductor manufacturers will be discussed. Reliability tests continue to evolve with new product designs, and new process and packaging technologies. Semiconductor components and ICs have generally had good reliability lifetimes, and manufacturers are still driven in their relentless efforts to eliminate defects to improve yield and reliability. Reliability test and qualifications costs, schedule, and effectiveness are continually being scrutinized due to increasing customer expectations and more stringent industry standards. Semiconductor reliability improvements are typically made by “guardbanding” or tightening process or test limits, not through a fundamental improvement that eliminates the “physics of failure”. Field returns data is important, but often difficult to obtain, and is clouded with processing by the sequence of customers after the semiconductor Final Test. The concepts of Design for “X” are easier said than done in the supplier’s cost- and schedule-constrained environment. The risks of previously unknown or untested “physics of failure” mechanisms increase as devices continue to shrink, new processes are introduced, and integration escalates with 3-D packaging.

    Speaker: Stevan Hunter     
     

    11:15 AM - 12:00 PM | Predicting Electronic Component Wear Out Due to Ionizing Radiation in Earth Orbit

    The reliability of electronic devices embedded in satellites is largely dependent on the Total Ionizing Dose (TID) of radiation they are exposed to during orbit. TID varies significantly depending on the orbital altitude, inclination and shape; some orbits which pass through the Van Allen belts represent very harsh environments with elevated concentrations of charged particles, while others which avoid these regions are much less severe.
     
    The primary effect of TID on MOSFET-based devices is to generate trapped charge in oxide material, the effect of which alters critical performance parametrics such as threshold voltage, sub-threshold swing, transconductance and On / Off currents. This effect is cumulative, increasing parametric degradation with time in orbit to the point where discrete transistors can no longer function as designed with respect to gate control, saturation current and timing.
     
    In this work, we evaluate the effect of orbit-specific TID on fundamental MOSFET devices which comprise the functional building blocks of critical devices in satellites. Parametric degradation as a function of TID is evaluated across technology nodes both by simulation and through evaluation of test data of physical devices. Reliability of fundamental devices is evaluated based on degree of parametric shift relative to specification and also by statistical Weibull analysis of parametric degradation due to their orbit-specific exposure. Ultimately, a failure rate or characteristic life for specific devices types and orbital exposure is provided.

    Speakers: Ken Symonds, Ashok Alagappan, Mike Howard 

    1:00 PM - 1:45 PM | Next Generation Materials: High Speed, RF and HDI Designs Design for Solvability, Design for Performance and Design for Manufacturing

    With this presentation, attendees will learn how in the “5G-World” materials matter. From rigid laminates, copper styles and properties, flex materials, sintered paste “OrMet” for any-layer vias. All these play a part of the design, manufacturing and performance of our products.

    Attendees will receive a good understanding of basic EM Theory with a strong emphasis placed on material selection. This will cover aspects affecting interconnections and their respective EM fields. The design flow is from the start of the layout cycle, all the way to the generation of deliverables and then into manufacturing. Emphasis is on the role that materials play to make your circuit cost-effective, perform well and be a reliable high-yield product. We will touch on all types of circuit technologies in many market segments.
     
    Focus is on integration between design and manufacturing early in the development cycle, to build a high reliability product that is correct-by-construction and performs on Revision-1.
     
    We will cover a wide range of topics, including:

    • High Speed material selection for Rigid and Flex
    • Rationale for considering HDI – Solvability, Performance and Reliable Manufacturability
    • Power Delivery, High Power
    • Compatible materials effecting manufacturing process and long-term reliability Students will learn what it takes to successfully implement these concerns:
      • Complex Solvability
      • High-speed, RF and Thermal Performance
      • High Yield and Reliable Manufacturability

    Speaker: Michael Creeden CID+ MIT 

    1:45 PM - 2:15 PM | Evaluating Rigid-Flex Printed Circuit Board (PCB) Technology

    Rigid-flex technology has been a key development in printed circuit board (PCBs) technology, enabling the design of more compact and non-standard form factors of electronics. This ability to bend and shape portions of the PCB has enabled applications that may otherwise not have been possible. The flex portion of the board conducts electrical signal without constraining the boards to each other.  When dealing with rigid flex designs, the main concerns are often centered around manufacturability. This includes the design of the copper traces within the flex region of the PCB, the geometry & shape of the bend, and the design of the board in the neighboring region of the flex. Certain standards, such as IPC-2223, provide design guidance for these rigid flex designs.
     
    The bend region of the flexible portion of the PCB has copper on both sides and polyimide in the middle. The copper traces will undergo plastic deformation when a bend radius is created. At very small bend radii, the copper can fracture. The manufacturing process itself is critical to minimizing strains in the bend region that can lead to latent defects or poor manufacturing yields. Following a brief background on rigid-flex technology and associated reliability/manufacturability issues, this presentation will focus on a workflow that PCBA designers and manufacturing engineers can use to parametrically evaluate multiple factors affecting the stress and deformation in the flex region to optimize design time and manufacturing yield.

    Speaker: Josh Akman     

    2:15 PM - 2:45 PM | Resolving Thermal Challenges to the Reliability of Electronics in Design

    Thermal effects are one of the most common modes of failure in electronics designs. These effects can include, PCB warpage, solder ball fatigue, component failure, and temperature-dependent drifting of electrical performance. The ever-increasing complexity, density, and integration of electronics, as well as the coupled nature of electromagnetic, thermal, and mechanical physics in determining their performance, makes accounting for these failure modes challenging for many electronics design teams. This presentation addresses current advanced techniques designers can leverage to quickly identify and mitigate the impact of thermal issues.
     
    In particular, a comprehensive approach to thermal simulation of PCB assemblies is presented, including methods for dealing with the complexity of geometric detail, chip-level electro-thermal effects, and the effects of multiple coupled physics phenomena. The approach helps designers more accurately account for thermal coupling between all these physical scales in an assembly and reduce the risk of test and field failures early in the design phase of a product. Applications of the approach are demonstrated for complex transient case studies and system-level simulations through relevant examples.

    Speaker: Dave Rolando 

    3:45 PM - 4:15 PM | Flux Residue: Key Factors Causing Electronics Failures

    As circuit designs shrink and become more complex, flux residues are more likely to cause electronics failure. Chemistry of the residue, application of flux, design and coatings are all factors in determining the risk of failure. Companies spend significant resources and time to ensure that a printed circuit board can be manufactured to the intended design standards. One of the most basic keys to meeting the design intent is getting the soldering process right. Process designers will focus on the solder, the metallurgy and thickness of critical plating, and the details of the temperature profile but selection of the correct flux and proper qualification of the process is just as important. The wrong flux for the application or improper application, cleaning, and cleanliness verification can lead to unexpected field failures due to metal migration, leakage currents, corrosion, and other damage accumulation mechanisms.
     
    This presentation reviews the chemical composition and risks associated with the most common fluxes, best-practice application techniques for specific manufacturing challenges, and the pros and cons of process cleanliness verification techniques.

    Speaker: Seth Binfield     

    4:15 PM - 4:45 PM | Statistical Measure of the Process Capability that Results in Acceptable Levels of Flux and Other Residues

    Highly dense interconnections require increased functionality, reduced power consumption, and low cost. Electronic hardware requires more complex component technology. These miniaturized components place new challenges on the reliability of the electronic assembly. Improved test methods are needed to qualify and validate electronic hardware. Once the process is qualified, SPC methods are needed to define the process design limits and process capability from which assemblers can develop process control indices.
     
    Designing hardware for electrochemical reliability is paramount due to the need for devices to perform on demand. Along with these technological challenges, electronic systems are increasingly exposed to harsh environments. The reduction of the component pad to pad gap distances reduces the insulation resistance between exposed metal, which requires closer scrutiny of the circuit design for trapping process residues.
     
    The purpose of this research is to develop improved methods for performing process capability analyses. The methodology considers the product design, assembly process, process design limits, process capability study, and statistical measures of process capability.

    Speaker: Mike Bixenman     

    Thursday, May 13, 2021
    8:30 AM - 9:30 AM | Test Plan Development, Acceleration Factors, and Life Predictions

    Electronic product test plans are critical to the success of a new product or technology. Preparing a viable test plan involves several steps to properly identify the requirements for these tests. Acceleration factors (AF) are key to designing an effective accelerated life test (ALT).

    This presentation will specifically address acceleration factors and their impact on test protocols. We will discuss several formulas of failure models, reliability parameters and reliability metrics. The attendees will walk away with knowledge of implementing test protocols and successfully setting accelerated life tests (ALT).

    Key Takeaways:

    • A methodology for determining acceleration factors and life predictions
    • Properly identifying the correct activation energy for integrated circuits
    • Developing a test protocol to facilitate accelerated testing
    Speaker: Greg Caswell
      10:30 AM - 11:00 AM | We Experienced a Microvia Failure. Now, What Do We Do?

      With all the publicity around weak microvia interfaces and the horrible functional failures caused by them, it is easy to become overwhelmed by their notoriety and the complexity of the problem.
       
      Effective action needs to be taken to understand and mitigate risk, but where does one start? This presentation will provide a framework for the failure analysis, variables to the related risk, corrective actions, and quality assurance to limit and quantify the risk.

      Speaker: Chris Mahanna     

      11:00 AM - 11:30 AM | Performance Based Microvia Reliability Testing - What You Need to Know

      This presentation discusses an implementation of a performance-based reliability test methodology which performs:

      Convection reflow assembly simulation per IPC TM-650 2.6.27B

      Air-to-air thermal shock per IPC TM-650 2.6.7.2C Both test methods are examined in detail with respect to the requirements of test system:

      • Control and performance
      • Data acquisition
      • Documentation and reporting

      Speaker: Lance Auer     

      1:00 PM - 1:30 PM | Reliability of Microvia

      Use of Micro vias have increased multi fold over last few years and reliability of Microvia has become a major concern in PCB industry. Over the year a lot has been done to improve the reliability of microvia but still we are far from totally understanding the root causes for failures. Different papers have been presented on this subject. This paper/presentation will address some of the findings from our previous findings and will add to it our recent DoE findings. Paper will address various contributing factors causing microvias to fail and what has been done to make microvias more reliable. We will also be addressing one level microvia and stacked microvia reliability in our presentation. All our testing was done after 6X pre-conditioning at 2600C prior to thermal cycling from ambient to 150°C followed by 250 cycles @190°C for microvias.

      Speakers: Hardeep Heer, Bill Birch     

      2:00 PM - 2:30 PM | Microvias: Have you Designed for Reliability?

      How to detect weak microvias and avoid costly assembly defects and customer field failures?
       
      As component pin densities get tighter with each passing year, Designers have been pushed to the use of HDI with more microvias and blind/buried via structures. As a result, tighter via densities and signal integrity requirements in printed boards have revealed reliability concerns with microvia structures in high performance products. Avoiding post fabrication microvia failures is critical to the success of your products and there are things that designers need to know.
       
      Gerry’s presentation will review concerns and reliability testing of microvias. He will provide an overview of the HDI processes and present the use of current test methods and the superiority of testing with IPC-D-coupon and IPC-TM-650 test methods 2.6.7.2 and 2.6.27. He will discuss the warning statement in the forthcoming IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.

      Speaker: Gerry Partida     

      3:30 PM | Adjourn

      Thank you for participating in the event! 

      CONTRIBUTORS

      Josh Akman

      Josh Akman | Speaker
      Senior Consulting Engineer | ANSYS, Inc.

      Ashok Alagappan

      Ashok Alagappan | Speaker
      Lead Consulting Engineer | ANSYS
      Ashok has 15 years of experience in semiconductor design and manufacturing, managing products through a range of activities from design to qualification. He has worked with customers in a variety of high-reliability applications from aerospace to telecommunications to provide expert analysis and recommendations for defining and improving reliability of electronics products and IC components. Ashok has developed tools to predict the lifetime of IC components due to intrinsic wearout failure mechanisms that are featured in Sherlock Automated Design Analysis software.

      Norman Armendariz

      Norman Armendariz | Steering Committee
      Ph.D. Engineering Fellow  Raytheon
      Dr. Armendariz is an Engineering Fellow at Raytheon responsible for materials engineering design, materials analysis, process equipment development, and production support associated with the manufacturing of CCA- circuit card assemblies used in missiles, smart munitions, ground based radars, and mobile sensors across multiple US and international sites. Norm has over 20 years of industrial experience, having worked for Lockheed/NASA, Motorola, TI and Intel, and as Director of Labs / Asst. Engr. Prof. at American University. He holds an interdisciplinary PhD in Chemical Engr. from New Mexico State University, MS in Materials Science Engr. from the University of Illinois at Urbana-Champaign, and BS Metallurgical Engr. from Colorado State University, with 9 US patents and 27 peer-reviewed publications.

      Lance Auer | Speaker
      Engineering Fellow | Conductor Analysis Technologies, Inc.
      Lance Auer graduated from the University of Arizona in 1975 with a Bachelor of Science in Chemistry. He joined CAT after a 30 year career with Raytheon, last serving as the Missile Systems PWB Technical Lead. During his career with Raytheon, he was directly involved in circuit board Quality, manufacturing, and design. Lance has also been involved with many IPC standards committees for more than 20 years and currently serves as the chair of the D-22 committee, which is responsible for IPC-6018, Performance Specification for High Frequency (Microwave) Circuit Boards.

      Jim Barry

      Jim Barry | Steering Committee
      Sales & Marketing Manager | PCB Technologies
      Jim Barry is sales & marketing manager and technical liaison at PCB Technologies, a fabricator of rigid, rigid-flex and flex PCBs for high-rel applications. Jim has been in the PCB industry since the 1970s, and has prior experience with flex fabricators like Parlex and Eltek and EMS companies including Bull Technologies. 

      Seth Binfield | Speaker
      Leading Consulting Engineer | ANSYS, Inc. 

      Bill Birch

      Bill Birch | Speaker
      President | PWB Interconnection Solutions Inc.
      Bill has been involved the PWB manufacturing industry for over 30 years. He has been responsible for developing the principles of Interconnect Stress Testing (IST) for the past 20 years, receiving multiple patents and worked diligently to establish IST technology as the industry standard for the assessment of PWB substrate reliability. IST equipment is now installed at every major PWB manufacturer throughout North America and Asia and is a recognized tool for measuring both process capability and product reliability.

      Mike Bixenman

      Mike Bixenman | Speaker
      V.P. CEO | Magnalytix (Subsidiary of Kyzen Corp.)
      Dr. Michael Bixenman, Chief Technology Officer (CTO) and cofounder of KYZEN, has over 30 years of experience in the design of electronic assembly cleaning materials and process integration. Sharing his research, knowledge and experience is Mike’s passion as he is the author and co-author of over 100 technical papers and presentations presented all over the world. He believes in the power of collaboration, by working with others to solve problems quickly. An active member of several industry associations, he has chaired and led many committees, symposiums, and task groups that are committed to understanding the cleaning and reliability challenges of today’s ever-changing electronics industry. Dr. Bixenman holds four earned degrees, including a Doctorate in Business Administration (DBA). Although he travels extensively, Dr. Bixenman primary works from KYZEN’s headquarters in Nashville, Tennessee and can be reached by email at mikeb@kyzen.com or by phone at +1 615-831-0888.

      Greg Caswell

      Greg Caswell | Speaker
      Lead Consulting Engineer | ANSYS, Inc. 

      Mike Creeden

      Michael Creeden CID+ MIT | Speaker
      Technical Director Design Education | Insulectro
      Mike has over 43 years of industry experience: as an Educator, PCB designer, applications engineer and business owner.

      • Insulectro - Technical Director Design Education; helping OEM’s & fabricators to achieve design success for best material utilization
      • Master Instructor CID+ IPC Designer Certification program
      • Primary Contributor for the CID+ curriculum
      • Currently teaching IPC-CID/CID+ curriculum with EPTAC
      • Founder of San Diego PCB Designs (Nationally recognized design center)

      Don Dupriest | Steering Committee
      Lockheed Martin

      Gary Ferrari

      Gary Ferrari | Steering Committee
      FTG Corp.
      Gary Ferrari has more than 35 years of experience in the printed circuit board industry. During this time he was Executive Director and co-founder of the IPC Designer's Council, and Chairman of the IPC Technical Activities Executive Committee. He spearheaded the printed circuit board designer certification program. Since 2006, Gary has worked at FTG as Director, Technical Support. In this role, he led FTG's effort to support customers in design-for-manufacture activities, providing technical advice, and training their designers.

      Dennis Fritz 150

      Dennis Fritz | Steering Committee
      IPC Hall of Famer
      Dennis Fritz was a 20-year direct employee of MacDermid Inc. and is retired after 12 years as a senior engineer at (SAIC) supporting the Naval Surface Warfare Center in Crane, Indiana. He was elected to the IPC Hall of Fame in 2012.

      Martin Goetz

      Martin Goetz | Steering Committee Chair
      Subsystems Manager, Test Design Solutions | Northrop Grumman Corporation
      Martin has been in the electronics industry for over 30 years, from high tech start-ups to giants like IBM, HP and Alcoa. He currently manages the Test Design Solutions organization within Northrop Grumman Mission Systems outside Baltimore, MD and is involved in developing solutions from under seas to outer space. He is a former U.S. Air Force Strategic Air Command Security Police Specialist, and has degrees in both engineering and business. He holds multiple patents in the fields of electronics and materials, and has published and presented his work extensively throughout his career.

      Craig Hillman

      Craig Hillman | Steering Committee
      ANSYS, Inc. 
      Craig Hillman is a director of software development at Ansys. He served as the CEO and managing partner of DfR Solutions prior to its acquisition by Ansys. Hillman holds a Ph.D. in materials science from the University of California – Santa Barbara and a B.S. in metallurgical engineering and materials science from Carnegie Mellon. He has expertise in design for reliability (DfR) best practices, lead-free (Pb-free) transition strategies, commodity/engineered products supplier qualification, passive component technology and printed board failure mechanisms.

      Hardeep Heer

      Hardeep Heer | Speaker
      Vice President Engineering & Chief Technology Officer | FTG Circuits
      Hardeep Heer holds a degree in Mechanical Engineering. Mr. Heer has been in the Printed Circuit Board industry since the early 1980s. Prior to joining FTG as Vice President Engineering & Chief Technology Officer, he has held senior positions with major Printed Circuit Board manufacturing companies in the U.S. and Canada. His over 30+ years of experience in this industry includes setting up of two advanced Printed Circuit Board manufacturing shops. In his present position, Mr. Heer is responsible for development / introduction of new technologies to FTG.

      Mike Howard | Speaker
      ANSYS, Inc. 

      Stevan Hunter

      Stevan Hunter | Speaker
      Reliability Engineer | ON Semiconductor
      Stevan Hunter, PhD, is a Member of Technical Staff at ON Semiconductor in Phoenix, Arizona, USA, working as Reliability Engineer, ESD Control Champion, and Lean Six Sigma Instructor, with 40 years’ experience in semiconductor engineering. He holds certifications as Lean Six Sigma Blackbelt, Reliability Engineer, and ESD Factory Control Manager. Stevan is also a Faculty Associate at Arizona State University, BYU-Idaho and University of Maryland CALCE. He is a Senior Member of IEEE and ASQ, and member of IMAPS, SRE, AVS, ASEE and ATD.

      Chris Mahanna

      Chris Mahanna | Speaker
      President/Technical Director | Robisan Laboratory Inc.

      Gerry Partida

      Gerry Partida | Speaker
      Director of Engineering | Summit Interconnect - Anaheim
      Gerry Partida, Senior Field Application Engineer at Summit Interconnect Technologies, a world class PCB Fabricator. Gerry began his career in the Printed Board industry in 1984 at Everett Charles Test Equipment, and joined Optrotech/Orbotech in 1986. He was a member of the team that introduced CAM automation, net list compare, AOI Cad Reference to industry. His current position is focused on cutting edge high density interconnect, high speed digital, Flex/Rigid Flex and RF/microwave printed circuit board fabrication for the military and commercial industries. He has been a certified IPC trainer, and a member of the IPC-6012 and IPC-6018 review committees.

       Dave Rolando

       Dave Rolando | Speaker
      Senior Application Engineer | ANSYS, Inc.

      Kunal Shah

      Kunal Shah, Ph.D. | Instructor
      President  LiloTree
      Kunal Shah, PhD. is a President and chief Scientist at LiloTree. Dr. Shah leads efforts of advanced engineered materials development and product improvement solutions at LiloTree for electronics industry including aviation-aerospace, medical electronics, semiconductors, etc. He has been the key member in development of proprietary innovative novel ENIG (ENIG-Premium), award-winning Ni-less surface finish (Ni-less ENIG-Premium) and other plating- surface finish solutions for better reliability of electronic assemblies. Previously, Dr. Shah worked as a Sr. Research Scientist at Intel Corporation and Pacific Northwest National Lab (PNNL). At Intel, he developed polymer interlayer, dielectric and passivation material that led to the design, adoption and integration of polymer passivation materials in Intel IC products in 2008. He has authored several scientific papers and issued/pending patents over two decades.

       Ken Symonds

      Ken Symonds | Speaker
      ANSYS, Inc. 

      EXHIBIT & SPONSORSHIPS

      Please note ALL attending representatives must be registered for the conference.

      Cancellations will be accepted up to 15 days prior to the event. $100 cancellation fee will apply. No refunds will be given for notice less than 15 days prior to the event.

      Promote Your Company Today!
      Tabletop Exhibit

      IPC Member: $1,500 | Nonmember: $1,875
      Benefits include:

      • One 6-foot draped table
      • One standard electrical outlet
      • Contact list of consenting registered attendees
      • One complimentary conference registration for your exhibit staff, additional registrations at 25% discount
      • Company logo included on conference website and promotional materials, electronic and printed
      Welcome Reception Sponsor, exclusive | Date: May 11, 2021

      IPC Member: $2,500 | Nonmember: $3,125
      Benefits include:

      • One 6’ draped tabletop exhibit with one standard electrical outlet
      • Acknowledgement of sponsorship with company logo on conference website
      • Acknowledgement of sponsorship with company logo on conference promotional materials, electronic & printed
      • Social Media Spotlight: Acknowledgement of sponsorship through posts on IPC’s social media channels: Facebook, LinkedIn and Twitter  
      • Acknowledgement of sponsorship with company logo on printed conference materials
      • Acknowledgement of sponsorship with company logo on signage during the reception
      • Opportunity to display promotional literature during the reception
      • Contact list of consented registered attendees
      • Two complimentary Conference registrations; additional registrations at 25% discount
      Luncheon Sponsor, exclusive for all event days

      IPC Member: $3,000 | Nonmember: $3,750
      Benefits include:

      • One 6’ draped tabletop exhibit with one standard electrical outlet
      • Acknowledgement of sponsorship with company logo on conference website
      • Acknowledgement of sponsorship with company logo on conference promotional materials, electronic & printed
      • Social Media Spotlight: Acknowledgement of sponsorship through posts on IPC’s social media channels: Facebook, LinkedIn and Twitter  
      • Acknowledgement of sponsorship with company logo on printed conference materials
      • Acknowledgement of sponsorship with company logo on signage placed at each table during the luncheons
      • Opportunity to place promotional literature on tables/chairs during the luncheons
      • Contact list of consented registered attendees
      • Two complimentary Conference registrations; additional registrations at 25% discount
      Refreshment Break Sponsor, exclusive for all event days

      IPC Member: $3,000 | Nonmember: $3,750
      Benefits include:

      • One 6’ draped tabletop exhibit with one standard electrical outlet
      • Acknowledgement of sponsorship with company logo on conference website
      • Acknowledgement of sponsorship with company logo on conference promotional materials, electronic & printed
      • Social Media Spotlight: Acknowledgement of sponsorship through posts on IPC’s social media channels: Facebook, LinkedIn and Twitter
      • Acknowledgement of sponsorship with company logo on printed conference materials
      • Acknowledgement of sponsorship with company logo on signage during refreshment breaks
      • Opportunity to display promotional literature during refreshment breaks
      • Contact list of consented registered attendees
      • Two complimentary Conference registrations; additional registrations at 25% discount
      Badge Lanyards (sponsor provided), exclusive

      IPC Member: $1,000 | Nonmember: $1,250
      Benefits include:

      • Opportunity to distribute company branded badge lanyard to conference attendees
      • Opportunity to distribute promotional literature at registration counter
      Attendee Giveaway (sponsor provided), exclusive

      IPC Member: $1,000 | Nonmember: $1,200
      Benefits include:

      • Opportunity to distribute company branded item to conference attendees
      • Opportunity to distribute promotional literature at registration counter
      Conference Pens (sponsor provided), exclusive

      IPC Member: $1,000 | Nonmember: $1,250
      Benefits include:

      • Pens branded with your company logo placed on tables in conference room
      • Pens will be used by attendees at the event as well as back at the office providing ongoing, maximum marketing impact for your brand
      Conference Notepads (sponsor provided), exclusive

      IPC Member: $1,000 | Nonmember: $1,250
      Benefits include:

      • Note pads branded with your company logo placed on tables in conference room
      • Note pads will be used by attendees at the event as well as back at the office providing ongoing, maximum marketing impact for your brand

      CONTACT US

      Questions about registration? Contact Andrea Keefe at AndreaKeefe@ipc.org or call +1 847-597-2879

      Interested in speaking at the Event? Contact Debora Obitz at DeboraObitz@ipc.org or +1 847-597-2848

      Interested in Exhibiting or Sponsoring at this Event? Contact Alicia Balonek with IPC at AliciaBalonek@ipc.org or +1 847-597-2898

      About IPC

      IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000+ member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

      About ANSYS

      If you've ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge or put on wearable technology, chances are you've used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and create products limited only by imagination.

      The Westin Baltimore Washington Airport-BWI

      1110 Old Elkridge Landing Rd
      Baltimore (Linthicum), MD 21090
      United States

      The Westin Baltimore Washington Airport-BWI

      The Westin Baltimore Washington Airport-BWI
      1110 Old Elkridge Landing Rd
      Baltimore (Linthicum), MD 21090
      United States

      PCB Design for Rigid-Flex Boards

      PCB Design for Rigid-Flex Boards

      Date
      May 25, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Tuesday and Thursday 5/25/2021-7/1/2021

      This course provides the skills necessary to effectively implement designs requiring flex and rigidflex circuits in accordance with product requirements. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation. 

      Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design flex and  rigid-flex boards.

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      PCB Design for Extreme Environments

      PCB Design for Extreme Environments

      Date
      Jul 5, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Monday and Wednesday 7/5/2021-8/11/2021

      This course addresses specific challenges encountered in the design of products for service in severe conditions. These include the effects of abrasive particles, positive and negative temperatures, pressure, moisture, and corrosives such as salt water, acids, and bases. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.

      Taught by an IPC-certified industry expert with 25+ years of experience in the field, this six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required by circuit board designers.

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      Introduction to PCB Design I

      Introduction to PCB Design I

      Date
      Jul 6, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Tuesday and Thursday 7/6/2021-8/12/2021

      Taught by an IPC-certified industry expert with more than 25 years of experience in the field, this 6-week online program introduces participants to the concepts and skills required to create realworld designs that comply with IPC standards. This introductory course will focus on front-end design concepts such as schematic capture, library parts creation, basic electrical engineering concepts, and documentation.

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      PCB Troubleshooting & Defect Analysis

      PCB Troubleshooting & Defect Analysis

      Date
      Aug 24, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Tuesday and Thursday 8/24/2021-9/16/2021

      Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program is designed to provide the knowledge and skills necessary to identify printed circuit board defects and determine corrective action.

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      PCB Design for Military & Aerospace Applications

      PCB Design for Military & Aerospace Applications

      Date
      Aug 30, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Monday and Wednesday 8/30/2021-10/6/2021

      This course addresses specific challenges encountered in military and aerospace applications, including  the effects of vibration, shock, radiation, and altitude, extended operating temperature range, and other design considerations for high reliability applications. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation.  
      Taught by an IPC-certified industry expert with 25+ years of experience in the field, the eight week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design boards for military and aerospace applications. 

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      PCB Design for Rigid-Flex Boards

      PCB Design for Rigid-Flex Boards

      Date
      Aug 30, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Monday and Wednesday 8/30/2021-10/6/2021

      This course provides the skills necessary to effectively implement designs requiring flex and rigidflex circuits in accordance with product requirements. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation. 

      Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design flex and  rigid-flex boards. 

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      Introduction to PCB Design II

      Introduction to PCB Design II

      Date
      Aug 31, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Tuesday and Thursday 8/31/2021-10/21/2021

      In this course, participants employ the lessons learned in Introduction to PCB Design I to effectively implement their designs using techniques such as multi-layer routing, signal integrity, transmission lines, and more. The course also focuses on how manufacturing and assembly techniques impact design, documentation and manufacturing file generation.

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      Certified Electronics Program Manager (CEPM) Training Program and Certification Exam Bundle

      Certified Electronics Program Manager (CEPM) Training Program and Certification Exam Bundle

      Date
      Sep 21, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Tuesday and Thursday 9/21/2021-10/28/2021

      In the highly competitive electronics industry, the knowledge and skills of staff directly responsible for client services and program management can make or break the bottom line. The IPC Certified Electronics Program Manager (CEPM) Training and Certification course is designed to ensure that your team has the tools and training they need to provide the type of service that ensures clients for life. This new, instructor-led online course combines the educational benefits of live instruction and group discussions with the flexibility and cost-savings of e-learning. Taught by an IPC-certified industry expert with 30 years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded training, job-specific exercises, and team projects to facilitate mastery of the key business and technical concepts required of program managers in the electronics industry.

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      PCB Troubleshooting & Defect Analysis

      PCB Troubleshooting & Defect Analysis

      Date
      Oct 26, 2021 | 2:30 - 4:30pm EDT

      Every Tuesday and Thursday 10/26/2021-11/18/2021

      Taught by an IPC-certified industry expert with more than 30 years of experience in the field, this 6-week online program is designed to provide the knowledge and skills necessary to identify printed circuit board defects and determine corrective action.

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      Contracting with the Customer

      Contracting with the Customer

      Date
      Nov 1, 2021 | 6:30 - 8:30pm EDT (6:30 - 8:30pm EDT)

      Every Monday and Wednesday 11/1/2021-11/17/2021

      Without a doubt, negotiating with OEMs and other customers is one of the biggest challenges facing the electronic manufacturing services (“EMS”) manager/executive. What needs to be covered in the contract? How should risk be allocated and balanced with pricing? Are there proper allocations of risk and limitations of liability for warranty, intellectual property, sourcing, and product content provisions? Is our company properly protected? What terms represent industry standards in allocation of risk and responsibility? What should we do if there is a dispute? What are current best practices? This unique program addresses the specific issues EMS companies face while contracting with a customer. This course allows participants to experience major contractual aspects of dealing with a theoretical customer at an EMS company, beginning with receipt of a non-disclosure agreement, and continuing through review of a bid package or scope of work, the negotiation and execution of a manufacturing services agreement, receipt of a bid package or scope of work, and a dispute with the customer. The Instructors are EMS subject matter experts with 40+ years of experience providing legal services to EMS companies worldwide, including drafting and negotiating customer and supply chain related agreements, assisting in the acquisition and divestiture of facilities, and advising on compliance, human resources, and dispute resolution, including representations in mediations, arbitrations, and litigation.

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States

      PCB Design for Advanced Packaging

      PCB Design for Advanced Packaging

      Date
      Nov 8, 2021 | 6:30 - 8:30pm EST (6:30 - 8:30pm EST)

      Every Monday and Wednesday 11/8/2021-12/15/2021

      This course provides the skills necessary to create PWB/PBA designs that require advanced or complex packaging. These include boards with limited board area that must comply with IPC standards and require non-orthogonal placement and routing, non-standard board outline geometry, non-standard board mounting, and advanced board materials.  

      Online Event

      3000 Lakeside Dr.
      Suite 105N
      Bannockburn, IL 60015
      United States

      Online Event

      Online Event
      3000 Lakeside Dr.
      Bannockburn, IL 60015
      United States