Understanding PCB Microsection Preparation and Analysis 101
Microsectional evaluation is a critical tool in determining the acceptability of printed c
Component-to-System Level Packaging - Addressing Integration Challenges for Automotive & Industrial Applications
Sponsorship Packages are available for the workshop on Component-to-System Level Packaging - Addressing Integration Challenges for Automotive and Industrial Applications.
Halfway Through, Heading Where? The Midyear Economic Check-In
At the midpoint of 2025, the global economy remains caught between resilience and risk. Inflation is elevated but hasn’t spiked as sharply as some feared following the latest round of tariffs, at least not yet.
Advanced Packaging to System Integration – Trends and Challenges
Advanced Packaging to System Integration – Trends and Challenges Speaker:Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC
Road to Reliability: Design for Manufacturing - a Technology Solutions Webinar Series for e-Mobility Electronics Hardware Reliability
We are delighted to welcome Adrian Harea of Schaeffler and Michael Schleicher of Semikron-Danfoss to lead a discussion on DfM for EV's high-voltage / high-power applications.
PCB Design for Military & Aerospace Applications
DescriptionThis course addresses specific challenges encountered in military and aerospace applications, including the effects of vibration, shock, radiation, altitude, extended operating temperature range, and other desi