IPC Conference Paper Archive

The current worldwide market for printed circuit boards is approximately $40 billion,with the multi-layer printed circuit boards (MLB) comprising approximately 40% of the market. One of the mos .. weiterlesen

The miniaturization of the electronics continues and requires the utilization of inner space of a PCB for component placement. The embedding of the passive components inside the PCB has already .. weiterlesen

We have previously published our work on developing thin substrates for use as embedded capacitor layers. Both unfilled and filled materials were characterized in regards to performance,reliabi .. weiterlesen

By using two existing pieces of common printed wiring board manufacturing equipment,embedded resistor manufacturers can obtain laser trim results similar to the trimming obtained using a specia .. weiterlesen

This paper describes the performance of several types of the most advanced Dry Film photo Resist (DFR),for producing high-density package substrates and chip on films (COF). 1) High resolution .. weiterlesen

Next generation IC substrate designs will feature higher interconnect density and faster signal speed than current designs. Circuitization of these substrates uses copper pattern plating follow .. weiterlesen

In the multilayer PCB industry,the process of making the inner layer is the first step in a number of complex steps that results in the production of a printed wiring board. This imaging manufa .. weiterlesen

Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. 2005 will be the year that many electronics assemblers will be transitioning their soldering proces .. weiterlesen

Lead products are no longer an option if you want to export to the EU market. RoHS regulations requiring the manufacture of lead-free electronic products by July 2006 are pushing the industry t .. weiterlesen

Electronic products are being stressed by increasing operating temperatures and higher assembly temperatures. Silicon and product power consumption are increasing as the silicon densities and s .. weiterlesen

Demand for higher speed digital signal processing is notable today in the electronics industry. To meet this demand,circuit designs that employ coplanar structure,either for both single-end and .. weiterlesen

In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous works have showed in detail,the characterization and modeling effort .. weiterlesen

A high-power-SMD-LED (HL-LED) outline 3,3 x 2,9 mm² was developed,with chip-size up to 1 mm² and power dissipation up to 1.500 mW (400 mA for UV-InGaN) in a corresponding thermal ambient. The t .. weiterlesen

This paper describes Advanced Filled Via Plating Methodology for stacked via technology. In this paper,via bottom crevice, via bottom land etching and electroless copper plating coverage is foc .. weiterlesen

This article summarises how a copper metallization process for simultaneous via filling and through hole plating was developed on a laboratory scale and the challenges encountered by scale-up t .. weiterlesen

The miniaturization of mobile electronic devices continues,market trends toward lighter and thinner printed circuit boards (PWB) have been accelerating. At the same time,the demand for increase .. weiterlesen

Embedding discrete capacitors right into printed circuit boards (PWB),although not new,is part of a pivotal technology for the PWB industry. For example,the ability to locate decoupling capacit .. weiterlesen

In this study,we developed the thin film embedded decoupling capacitors and experimentally investigated its electrical behavior in terms of power-ground impedance and simultaneous switching noi .. weiterlesen

We have developed a new resin-coated-foil (RCF) material named MCF-HD-45 to be embedded in PWBs to constitute capacitors. The material is composed of a thermosetting resin and a high dielectric .. weiterlesen

In order to satisfy the ever-increasing demand for smaller and lighter electronic devices,a drastic miniaturization is making rapid progresses for even circuit features on printed wiring boards .. weiterlesen

For the purpose of mask-less manufacturing for Printed Circuit Board (PCB),a new process using electrophotography technology,principle of copy machines,has been proposed and evaluated. Wiring p .. weiterlesen

There are compelling reasons to study the relationship between oxidation and the topography of solder powder; these include the following: ?? Customer requirements to reflow SAC-based (SnAgCu) .. weiterlesen

While the Ni-stabilized Sn-0.7Cu alloy is now well established as a viable lead-free solder in large scale commercial printed circuit board assembly the effect of Ni is not yet fully understood .. weiterlesen

Lead free implementation will present new challenges for PCB manufacturers from a design,soldering process,and QC standpoint. The higher reflow process temperatures will cause greater thermal s .. weiterlesen

OEE (Overall Equipment Effectiveness) is commonly used in a wide range of businesses when it comes to measuring and monitoring manufacturing performance. Even though OEE has been applied in var .. weiterlesen

A tier one supplier to the automotive industry has determined that a key to staying competitive in the electronics manufacturing industry is to adopt open standards for the exchange of data. Sp .. weiterlesen

Factory simulation has been used extensively to optimize and reduce costs across many manufacturing disciplines. Unfortunately,general purpose factory simulators do not effectively model the sp .. weiterlesen

In the past the use of filling pastes in PCB production was largely limited to via hole fillers. These materials with a solids content of 100% are still successfully employed today to close via .. weiterlesen

PTFE-FR4 hybrid laminated multi-layer PCB technology is being applied more and more widely. This technology requires blind via fabrication in a PTFE core. This paper gives a picture of the manu .. weiterlesen

In order to get excellent signal Integrity,half PTH holes will be a new trend in high frequency backpanel designing. Backdrilling is necessary for this application. This paper explores the appl .. weiterlesen

In this study,the DIG process (Direct Immersion Gold),is investigated. DIG is a process in which gold is plated directly on copper as a surface finish for printed circuit board and package appl .. weiterlesen

Microvoids are tiny voids in solder joints and differ from the more well known solder joint voiding in their individual size and location. The microvoids discussed herein are described as an ab .. weiterlesen

Manufacturers of electronic devices,from home audio equipment to automotive keyless entry systems,are increasingly seeking a reliable,cost effective method for uniquely identifying and tracking .. weiterlesen

Conductive inks and polymers based on metals were originally envisaged for quick repairs to Printed Circuit Boards (PCBs) and semiconductor chips. Increasingly these materials are being used to .. weiterlesen

In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave soldering,and rework),for different component types,different PCB sizes and fi .. weiterlesen

This study is focused on using different assembly options such as dip fluxing,flux jetting and reflow encapsulate for 200- 250um pitch lead-free (SnAgCu) flip chips on FR4 substrates. The impac .. weiterlesen

We have developed a thin,high-density device-mounting,multilayer flexible printed circuit (hereinafter flexible printed circuit is referred to as FPC) “SBic” (stands for Solder Bump Interconnec .. weiterlesen

Due to the worldwide increase in demand for flex and flex-rigid panels as well as the shift in the required designs of panels there is an extreme need for improved PTH processing. There are sev .. weiterlesen

The frequencies used to communicate and process information have been extended beyond the GHz band to the microwave band to handle the growing volume of data. Moreover,increasing global interes .. weiterlesen

A new multi-layer PCB (printed circuit board) having low transmission loss and low thermal expansion that meets up-coming further high speed and high volume data transmission demands was develo .. weiterlesen

For four decades,the semiconductor industry has distinguished itself by the rapid pace of improvement in its products. The principal categories of improvement trends are shown in Table 1 with e .. weiterlesen

System in package (SiP) technology has grown significantly in the past several years. It was barely mentioned in the National Electronics Manufacturing Initiative’s (NEMI’s) 2000 roadmap,but by .. weiterlesen

The upcoming European Union RoHS and WEEE directives are driving new requirements for the management and exchange of information,both across the extended electronics manufacturing value chain,a .. weiterlesen

Two important aspects concerning optimum performance of a (reverse) pulse plating line are (i) the uniform and correct pulse shapes anywhere on the PCB and (ii) the uniformity of the plating cu .. weiterlesen

Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern plating. This article analyzes and reviews the crystal structure,throwi .. weiterlesen

The copper plating process is one of the most critical steps in the high end PCB manufacturing process. Although the deposition inside through holes and blind holes is the key factor for reduci .. weiterlesen

Traditional reflow profiles for lead-free soldering typically require longer processing times due to elevated peak temperatures and flux activation times defined by solder paste suppliers. Thes .. weiterlesen

As lead free assembly is ramping up,wetting of lead free solder pastes is surfacing as the major paste performance tradeoff. Global efforts to significantly increase lead free wetting chemicall .. weiterlesen

As more electronic assemblers move to lead free SMT production,concerns are raised over reflow cooling slopes and effects on solder joints. Due to the higher peak temperatures,cooling slopes ar .. weiterlesen

Nowadays there are two major ways to achieve the conducting function of HDI Blind Hole One is to employ conducting metal paste to fill in the blind holes after laser drilling. The other is to f .. weiterlesen