IPC Blog | IPC International, Inc.

U.S. Election Results a Mixed Bag for Electronics Industry

by Ken Schramko, senior director, North American Government Relations

CHIPS Act Implementation Must Be About More than Just Chips

by Chris Mitchell, vice president, global government relations

The U.S. Government Needs to Embrace a Silicon-to-Systems Approach

by Ken Schramko, IPC senior director, North American government relations

International PCB Designer Community Steps Up to Compete

European Commission Publishes Proposal on Prohibiting Products Made with Forced Labour

By Suhani Chitalia, Manager, Environmental Regulatory Affairs

IPC, European Parliament Work to Bolster European Chips Act

Last week, Member of the European Parliament (MEP) Eva Maydell expressed to participants of IPC’s European Executive Forum her commitment to see

Secure your Spot at IPC’s Advanced Packaging Symposium, October 11-12

IPC Analysis Shows Leading Companies Are Intentional About Tracking Environmental and Social Risks

Beyond Moore’s Law – Enabling Heterogeneous Integration and Next Generation Chiplet Architectures

By Tracy Riggan, senior director, business development, Solutions

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