IPC Status of Standardization

Contribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend On

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry. Find out more about IPC committees on our committee home pages and about the documents currently in development in our status of standardization. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Harry Han.

If you’re ready to help out, please send an e-mail to Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

This report shows the status of IPC documents under development. To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like to obtain a copy of a particular draft, please contact the IPC technical staff at answers@ipc.org.

Once published, the documents are available from our Online Store.

Each IPC member site/location receives one complimentary digital copy of any new or revised standard following the month of release.
NOTE: Translations, amendments, addendums, incorporations, or supplements are not part of the one complimentary copy of each new or revised standard program.

Status of Standardization

Published Standards
IPC-2223E January 2020 Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2591 Version 1.1 January 2020 Connected Factory Exchange (CFX)
IPC-A-610GC January 2020 Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
IPC/WHMA-A-620D January 2020 Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-8921 October 2019 Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires
IPC-9121 Am 2 September 2019 Troubleshooting for Printed Board Fabrication Processes - Amendment 2
IPC-7095D-WAM1 August 2019 Design and Assembly Process Implementation for Ball Grid Arrays (BGAs), with Amendment 1

J-STD-001GS-DE January 2020 Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001G Anforderungen an gelötete elektrische und elektronische Baugruppen (German language)
IPC-7092-CN January 2020 埋入式元器件设计和组装工艺的实施 (Chinese language)
IPC-HERMES-9852-CN January 2020 表面贴装技术组装中机器对机器通信的全球标准 (Chinese language)
J-STD-004B-WAM1-JP January 2020 はんだ付用フラックスに関する要求事項 (Japanese language)
J-STD-006C-JP January 2020 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項 (Japanese language)
IPC-2226A-JP January 2020 分野別設計基準:高密度配線(HDI)プリント基板の設計 (Japanese language)
IPC-6017-CN January 2020 含埋入无源器件印制板的鉴定及性能规范 (Chinese language)
IPC-2221B-JP September 2019 プリント基板設計に関する共通基準 (Japanese language)
IPC-2591-FR September 2019 Échanges au sein d’une usine connectée (CFX) (French language)
IPC-7095D-WAM1-CN September 2019 BGA设计与组装工艺的实施 (Chinese language)
IPC-9703-CN September 2019 焊点可靠性的机械冲击测试指南 (Chinese language)
IPC-2591-JP September 2019 Connected Factory Exchange (CFX) (Japanese language)
IPC-DRM-18J CN September 2019 元器件识别 培训和参考指南 (Chinese language)
IPC-2591-CN September 2019 互联工厂数据交换(CFX)(Chinese language)
IPC-2591-SP September 2019 Intercambio en fábricas conectadas (CFX) (Spanish language)
IPC-6018CS-CN September 2019 6018C高频(微波)印制板的鉴定及性能规范航天和军事航空电子应用补充标准 (Chinese language)
IPC-A-600J-ZH August 2019 印製板的可接受性 (Chinese (Zhōngwén) Language)
IPC-2591-DE August 2019 Datenaustausch in der vernetzten Fabrik (CFX) (German language)
IPC-4202B-CN August 2019 挠性印制板用挠性基底电介质 (Chinese language)
IPC-6012DS-PL August 2019 Dodatek do Aplikacji Kosmicznych i Awioniki Wojskowej dla dokumentu IPC-6012D - Specyfikacji Zdolności i Osiągów dla Sztywnych Płyt Drukowanych (Polish language)
IPC-6012D-PL August 2019 Specyfikacja Zdolności i Osiągów dla Sztywnych Płyt Drukowanych (Polish language)

Proposed Standard for Ballot
IPC-1755A Responsible Sourcing of Minerals Data Exchange Standard - Revision A
IPC-2222B Sectional Design Standard for Rigid Organic Printed Boards
IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
IPC-7526A Stencil and Misprinted Board Cleaning Handbook

Final Draft for Industry Review
IPC-A-600K Acceptability of Printed Boards
IPC-1752B Materials Declaration Management
IPC-1754 Am2 Materials Declaration Standard for Aerospace and Defense
IPC-6012EM Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

Working Draft
J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-A-610H Acceptability of Electronic Assemblies
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC/SGIA-5222 Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6017A Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7991 Process Guideline for 3D Printed Electronics
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-9709A Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC-9797 Press-fit Standard for Automotive Requirements and other high-reliability applications

Project Approved
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
IPC/WHMA-A-620DS Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D.
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4101E WAM1 Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-4412B Am 3 Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards - Amendment 3
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes


Test Method Proposals

SECTION 2.1 - 2.1 Visual Test Methods
TM Determining a Weave as Spread Glass

SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM Solder Powder Particle Size Distribution - Measuring Microscope Method
TM Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight

SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning

SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test

SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

SECTION 2.6 - 2.6 Environmental Test Methods
TM Surface Insulation Resistance - Fluxes - Telecommunications
TM Surface Insulation Resistance
TM Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux

Test Methods Approved

TechNetFacebookYouTubeLinkedInTwitterFlickrGoogle+IPC BlogRSS Feeds