North American PCB Industry Shipments Down 24.1 Percent in September

IPC releases PCB industry results for September 2024

IPC announced today the September 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08.

Total North American PCB shipments in September 2024 were down 24.1 percent compared to the same month last year. Compared to the preceding month, September shipments were down 23.8 percent.

PCB bookings in September were down 4.4 percent compared to the same month last year. September bookings were down 2.8 percent compared to the preceding month.

“The North American PCB book-to-bill rose notably in September, but this rise masks overall weakness in the sector. The decline is primarily driven by a steep decline in shipments that outpaced a drop in orders,” said Shawn DuBravac, IPC’s chief economist. “Year-to-date trends highlight a negative trajectory in shipments alongside a narrowly positive trend in orders.”

September 2024 PCB book to bill ratio chart
September 2024 PCB book to bill ratio chart 2

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Shipments Up 10.3 Percent in September

IPC releases EMS industry results for September 2024

IPC announced today the September 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.

Total North American EMS shipments in September 2024 were up 10.3 percent compared to the same month last year. Compared to the preceding month, September shipments up 2.0 percent.

EMS bookings in September increased 19.6 percent year-over-year and decreased 10.8 percent from the previous month.

“The North American EMS book-to-bill ratio remains near the midpoint for the year, underscoring stable demand within the sector,” said Shawn DuBravac, IPC’s chief economist. “While September orders reflect a dip from the previous month, they indicate sustained resilience in bookings.”

September 2024 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future

The 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off today with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities. This year's conference has attracted over 400 companies and more than 600 industry professionals, highlighting its influence as a significant gathering in the electronics manufacturing sector.

 

Sydney Xiao, president of IPC Asia, delivered a keynote speech at the opening ceremony, emphasizing the crucial role of the electronics manufacturing industry as a pillar of global economy. She noted that the industry is at a pivotal moment, with profound changes underway, including the reshaping of supply chains, the strategic enhancement of the semiconductor industry, and a growing focus on sustainable development by both society and businesses. The rapid advancement of cutting-edge technologies such as artificial intelligence, 5G/6G communications, the Internet of Things, and new energy sources is also redefining the industry landscape. IPC aims to use this conference as a platform to delve into how innovative concepts can be translated into actionable steps, driving the transformation and upgrade of the electronics manufacturing industry.

 

The two-day conference features keynote speeches and technical forums as the main attractions. Industry experts from both domestic and international fields will provide in-depth analyses of global electronics industry trends, discuss strategies for supply chain evolution, and promote the practical implementation of innovative technologies. During the technical forums, IPC will share the latest research findings and updates on standard development, offering practical solutions for attendees. The conference will also focus on hot topics like advanced packaging, factory of the future, electronic design, and e-mobility, IC substrate and advanced PCB manufacturing, with experts from various fields discussing the integration of industry standardization and technical practices to foster efficient industry growth.

 

A special session on sustainable development strategies and green manufacturing within the industry will delve into how the electronics manufacturing sector can balance the pursuit of economic benefits with social responsibilities, aiming for a win-win outcome.

 

As a leading standardization organization in the global electronics manufacturing industry, IPC will convene several technical group A-Team meetings during the conference, covering critical areas such as SIP system-level packaging, CFX connected factory data exchange, IGBT high-power semiconductors, and ESG management systems. Participants will have the opportunity to gain insights into the latest standards and participate in shaping global standards. Additionally, IPC China's standards, education, automotive electronics, and intelligent manufacturing steering committees will hold their annual meetings, ensuring that IPC initiatives remain responsive to the rapidly changing industry demands.

 

IPC is always committed to promoting innovation and sustainable development in the global electronics industry and has made continuous breakthroughs in standards setting, certification training, and industry intelligence through close cooperation with more than 3000 member companies worldwide. This annual conference is not only a platform for showcasing the latest innovative achievements in the industry but also a bridge for gathering global resources and achieving win-win cooperation. IPC, through its rich agenda, strives to transform advanced technology and development concepts into practical results, promoting technological innovation and upgrading in the electronics industry, helping the electronics manufacturing industry to move towards a more brilliant future.

 

For additional information on IPC CEMAC, 2024, visit https://cemac.ipc.org.cn.

Stable Model-based and Constrained PCB Design

Date
-

Discover how to optimize your PCB design process with rigorous constraint management. Join this webinar to learn about the power of model-based PCB design and the importance of digital twins in creating high-quality, manufacturable boards.

Key Topics:

  • Model-based PCB design engineering: Understand the benefits and techniques of using models to drive your design process.
  • The need for digital twins: Learn how digital twins can provide a comprehensive representation of your PCB, enabling better decision-making and risk mitigation.
  • Winning design constraints: Discover effective strategies for defining and implementing design constraints that ensure manufacturability and yield.
  • Putting it all together: See how to integrate model-based design, digital twins, and constraint management to achieve optimal results.

Leave this webinar with a clear understanding of how to:

  • Create stable and manufacturable PCBs
  • Improve design efficiency and reduce errors
  • Maximize yield and minimize costs

Don't miss this opportunity to gain valuable insights into the future of PCB design.

Speaker Bios

Fil Arzola November 13

Fil Arzola is a Senior PCB Design Engineer and has worked in the Aerospace Design Community for over 30 years. Fil's expertise is with RF and Mixed-Signal board designs and his main focus deals with small complex packaging solutions. He's a firm believer in LC-SwaP, DFM/A, Model-based design engineering and solving puzzles. Fil is a graduate of the University of California, Davis, with a BSEE in Electrical and Computer Engineering. He enjoys mentoring junior engineers and hopes to start a university class on PCB Design Engineering.

 

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

Fall 2024 Issue of IPC Community Now Available

There’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way.

A hand holding a group of colorful people

Description automatically generated

  • Our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.
  • We feature an in-depth conversation with European market researcher Dieter Weiss, who’s giving back to the industry through data research, and you must read about the somewhat unconventional but ultimately satisfying sustainability-driven lifestyle of IPC course instructor Kris Moyer.
  • IPC Chief Economist Shawn DuBravac breaks down inventory costs following the pandemic, while IPC Japan Representative Yusaku Kono gives an update on how Japan’s electronics economy is recovering after the pandemic and the phenomenal growth of IPC standards and certifications in Japan.
  • Regarding sustainability, IPC Community visited with Zhou (Peter) Guoyin, a pioneer in ESG standards. You can also learn more about circularity in electronics from IPC's Lead Sustainability Strategist Kelly Scanlon, and Stanley Merritt, a member of the IPC Sustainability Leadership Council, educates us on supply chain sustainability, particularly in aerospace and defense.
  • We’ve devoted a special section to IEMI, the premier electronics manufacturing trade show sponsored by IPC India, which crossed borders this year to host events in Malaysia and India with great success. Dr. John W. Mitchell, IPC president and CEO attended both events and shares his insights on what it means to host the event in Malaysia.
  • For printed circuit board designers, check out the article highlighting the Pan-European Design Conference in January and learn how to participate in this exciting new opportunity in Vienna.
  • As always, you’ll discover instructor-led courses happening this winter, learn about the latest standards releases, and see what's happening around the world with IPC in our Q4 calendar.

SEE WHAT’S INSIDE