IPC’s Annual High Reliability Forum Adds Microvia Summit to Conference Lineup

Event to discuss solutions to microvia challenges and reliability concerns for Class 3 electronics
IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.

IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products

The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products.