IPC Invites Industry Leaders to Submit Poster Abstracts for ECWC16 and IPC APEX EXPO 2024

IPC invites technical innovators, students engaged in research, academic researchers, and industry leaders to submit abstracts for technical poster presentations for the 16th Electronic Circuits World Convention (ECWC16) at IPC APEX EXPO 2024.

New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem

IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Today, IPC, in collaboration with other industry organizations and representatives from academia and government, celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced P

IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards

Changes address advances in rigid printed board fabrication processes
IPC has released IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards.

John Deere Electronic Solutions Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing Recertification

IPC's Validation Services Program announces that John Deere Electronic Solutions, a manufacturer of custom, integrated electronics components based in Fargo, N.D., has become the first OEM company to be recertified a third time to the IPC J-STD-00

IPC’s PCB Technology Trends Report Details How PCB Manufacturers Meet Current and Future Technology Demands

PCB Technology Trends 2023, IPC’s biennial global study, is now available.

As EU Reviews Risk Assessments of Critical Technologies, IPC Stresses Need for Industrial Policy Approach to Include Complete Electronics Ecosystem

The following is a statement by Alison James, IPC senior director of European government relations: