IPC Conference Paper Archive

Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el .. leer más

The SMT assembly world,especially within the commercial electronics realm,is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very att .. leer más

Reed relay is widely used in Automatic Test Equipment (ATE) for its high speed,low cost and wide availabilities. However,being mechanical relays,they have their share of limitations and this pa .. leer más

In a typical mechatronic manufacturing functional test setup,actual load simulations are usually done by connecting the DUT outputs to power or ground in order to establish either a high or low .. leer más

As a part of series of studies on X-Ray inspection technology to quantify solder defects in BGA balls,we have conducted inspection of 3 level POP package by using a new AXI that capable of 3D-C .. leer más

Embedding components within the PC board structure is not a new concept. Until recently,however,most embedded component PC board applications adapted only passive elements. The early component .. leer más

The embedding of components in electronic interconnection structures has been carried out for more than 30 years. It is regarded as the “poor men’s silicon device”. Different technologies have .. leer más

Soldering has been a key process step in the manufacture of electronic assemblies since the earliest days of the electronics industry,it is also one of the most challenging processes to control .. leer más

Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassembl .. leer más

Electrical overstress causes damage to sensitive components,including latent damage. A significant source of EOS is high-frequency noise in automated manufacturing equipment. This paper analys .. leer más

Proper assembly of components is critical in the manufacturing industry as it affects functionality and reliability. In a heat sink assembly,a detailed manual process is often utilized. However .. leer más

Although reflow ovens may not have been dramatically changed during the last decade the reflow process changes step by step. With the introduction of lead-free soldering not only operation tem .. leer más

A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for .. leer más

This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry. Mid-chip solder ball .. leer más

This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. .. leer más

Printed Circuit Boards (PCBs) and Printed Electronics (PE) both describe conductor/substrate combinations that makeconnections. Both PCB and PE technologies have been in use for a long time in .. leer más

There is considerable interest in finding and replacing lead based solder alloys in high power environments and for existing high temperature operating environments. The high power electronics .. leer más

The change to lead-free solders in electronic assemblies created a need to replace tin-lead solderable termination finishes with materials such as pure tin or soft gold,on electronic component .. leer más

With the impending deadline for RoHS II and the elimination of exemptions for lead bearing solders in electronics for mission critical electronics,the issue of tin whiskers remains unresolved. .. leer más

With regard to precision cleaning applications within electronics manufacturing,pH neutral product development was a major breakthrough in recent years. The impetus for this development resulte .. leer más

Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposur .. leer más

This paper describes the results of a whisker formation study on SAC305 assemblies,evaluating the effects of cleanliness and lead-frame materials in room temperature/high humidity (25°C/85%RH) .. leer más

This paper discusses a through hole copper filling process for application to high density interconnects constructions and IC substrates. The process consists two acid copper plating cycles. Th .. leer más

Due to the increasing demands placed on acid copper plating solutions to perform via fill plating of blind micro vias it is critical that the plating additives be monitored precisely. This pape .. leer más

The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data ce .. leer más

Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH) .. leer más

How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain e .. leer más

The High Density Packaging (HDP) user group has completed a project to evaluate the majority of viable Dk (Dielectric Constant)/Df (Dissipation Factor) and delay/loss electrical test methods,wi .. leer más

Today's Electronic Industry is changing at a high pace. The root causes are manifold. So world population is growing up to eight billions and gives new challenges in terms of urbanization,mobil .. leer más

Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material,but can be significantly impacted by PCB fabrication .. leer más

Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen .. leer más

The SMT stencil is a key factor in the solder paste printing process. It has been shown repeatedly that print quality has the largest impact on end-of-line quality,and a good print process can .. leer más

The rapid growth of electronic devices across the globe is driving manufacturers to enhance high-speed mass production techniques in the printed circuit board assembly arena. As manufacturers d .. leer más

Today’s wide variety of laminate materials and specialized dielectric choices pose a challenge for process engineering. In particular,smooth surfaces,such as polyimide,flex circuit substrates a .. leer más

What are the Raw Material Risks? -Today PCB Suppliers handle a range of customers with different end use environments -Telecommunications -Automotive -Consumer electronics - .. leer más

Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated inte .. leer más

Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re .. leer más

Sn3.0Ag0.5Cu (SAC305) is currently the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased .. leer más

The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage .. leer más

PCB assembly designs become more complex year-on-year,yet early-stage form/fit compliance verification of all designed-in components to the intended manufacturing processes remains a challenge. .. leer más

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•Introduction to printed and wearable electronics •Flexibility testing challenges •Proposals for flexibility testing •Validation case studies •Future work .. leer más

Sustainable product design and the task of bringing new,earth friendly products to market is a top priority for corporate leaders in the manufacturing industry. By not reaching their compliance .. leer más

The biggest problem with designing rigid-flex hybrid PCBs is making sure everything will fold in the right way,while maintaining good flex-circuit stability and lifespan. The next big problem t .. leer más

In the rework environment,most equipment and procedures are designed for low volume repair/rework process. When a high volume rework is needed,the challenges begin. For example,a long cycle tim .. leer más

As device density continues to maximize the PCB real estate the reflowing of neighboring components or damaging of heat-sensitive components in the rework process continues to cause problems. D .. leer más

The number one issue identified by the 2009 International Electronics Manufacturing Initiative (iNEMI) Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan descr .. leer más

No-Fault-Found (NFF) events occur when a system level test,such as built-in test (BIT),indicates a failure but no such failure is found during repair. With more electronics continuously monitor .. leer más

The world of electronics continues to increase functional densities on products. One of the ways to increase density of a product is to utilize more of the 3 dimensional spaces available. Tradi .. leer más

The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliabi .. leer más