IPC Conference Paper Archive

Wave soldering of pin through hole devices has been around for a very long time. It is a process that everyone says will go away and each year it is still being used. In the industry,wave solde .. leer más

Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resis .. leer más

The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux depos .. leer más

Thermo-electric coolers (TEC's) are becoming increasingly popular in the medical device industry,where design space is limited and high heat transfer capacity is needed. For a Computed Tomograp .. leer más

Determining the root cause of a failure in a complex system is a demanding task that requires a structured and disciplined approach. From engaging the appropriate subject-matter experts,to veri .. leer más

Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test l .. leer más

Plated Though Hole (PTH) vias are common in the PCB industry,however their impact on electrical performance can sometimes be unclear. The confusion can be due to several different issues. Some .. leer más

Whilst many companies invest time,effort and cost into up front work to fix snags which would lead to issues with yield during production,this paper shows the efforts of the company who looks t .. leer más

The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. A nearly inexhaustible multi .. leer más

In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar .. leer más

In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect boar .. leer más

Sustaining the results of any continuous improvement effort can be challenging. With Lean improvement,constant monitoring,coaching and tweaking is often required to keep the "old ways" from cre .. leer más

In this rapidly moving electronics market,fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. Little (ADL) [1] re .. leer más

The selection of a liquid flux for use in wave soldering operations is extremely critical to both the manufacturing assembly process and the long term reliability of electronic assemblies. As i .. leer más

Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a .. leer más

The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly .. leer más

With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. In .. leer más

While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for .. leer más

The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make fact .. leer más

With technology these days,we often find solutions without a problem,rather than the other way around. The concept of the “Internet of Manufacturing” (IoM),combined with the evolution toward au .. leer más

Traceability has grown from being a specialized need for certain safety critical segments of the industry,to now being a recognized value-add tool for the industry as a whole. The perception of .. leer más

The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electroni .. leer más

Portable electronics demand that inductors and transformers be implemented in low profile surface mount packages. In communication systems,magnetic components are used for impedance matching,vo .. leer más

Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages .. leer más

As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with .. leer más

Certain types of nano-coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These nano-coatings also refine the solder paste brick shape giving imp .. leer más

Ever since there has been a widespread usage of surface mount parts,the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework .. leer más

The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. In order to take f .. leer más

Wetting balance testing has been an industry standard for evaluating the solderability of final finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as .. leer más

Additive Manufacturing has recently been brought into the spotlight as an alternative manufacturing method. While there are many different additive manufacturing technologies,the two that will .. leer más

Over fifteen years has passed since North America and Europe ceased being the center of worldwide PCB fabrication,and were supplanted by a Far East market with low cost labor,more relaxed envir .. leer más

With the wide breadth of component types used in complex electronic equipment,implementation of the European Union Restriction of Hazardous Substances 2011/65/EU/ (RoHS) is a challenge. A low v .. leer más

PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components .. leer más

Due to the ongoing trend towards miniaturization of power components,the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore,the .. leer más

While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. For .. leer más

The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metal .. leer más

The electronic industry is currently very interested in low temperature soldering processes,such as using Sn/Bi alloy,to improve process yield,eliminate the head-in-pillow effect,and enhance re .. leer más

When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the .. leer más

No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder p .. leer más

Flux consumption for wave soldering tends to decrease,mainly due to its gradual replacement by reflow soldering methods (i.e. pin-in-paste) in many electronics applications. However,in several .. leer más

The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described [1] an approach to very .. leer más

•Nano-electronics potential •Barriers to entry – and opportunities •Examples –Nano-solder –Capacitor materials –Graphene •Opportunities for rapid commercialization? .. leer más

An ever-increasing number of electronics assembly applications are using flip chip packages that require large volume underfill. Large volume underfill is typically defined as being for a die s .. leer más

As consumer products continue to reduce in price,pressure is placed upon the manufacturing of sub-components for improving cost. Back in the mid-1990s,jet valves for fluid dispensing in electro .. leer más

Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts,tin whiskers,and corrosion a .. leer más

In a global market,it is often difficult to determine the best PCB suppliers for your technology needs,while also achieving the lowest costs for your products. Considering each PCB supplier has .. leer más

Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. This mechanism has been seen at small solder mask openings near circuit traces on printed circuit .. leer más

Conformal coatings are applied to protect electronic assemblies from adventitious environmental factors,which include,for example,corrosive gases,corrosive fluids and high humidity. Whenever th .. leer más

Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. Or,some printed circuit board (PCB) manu .. leer más

The transition from eutectic tin-lead to lead-free soldering in electronic assembly,mandatedby the RoHS legislation, has brought great pressure and challenge to solder mater .. leer más