IPC Conference Paper Archive

With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-cri .. weiterlesen

This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu .. weiterlesen

This paper explores the process of identifying and evaluatingpotential counterfeit parts. The military customer is aware that counterfeit parts are a problem and hascreated Defense Federal Acqu .. weiterlesen

There are numerous techniques to singulate printed circuit boards after assembly including break-out,routing,wheel cutting and now laser cutting. Lasers have several desirable advantages such a .. weiterlesen

The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective .. weiterlesen

This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used .. weiterlesen

Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. Component and component or component and board surfa .. weiterlesen

Silicone thermal interface materials (TIM) are used to bond heatsinks on many critical components in server card assemblies in typical industry systems. Silicone TIMs have excellent high temper .. weiterlesen

Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to “Fill the Void. .. weiterlesen

Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the format .. weiterlesen

Prior to any conformal or chemically vapor deposited coating process,specific areas and components-often called “keep out zones”-on the printed circuit board (PCB) assembly are generally masked .. weiterlesen

Rosin-based no-clean solder pastes are the most widely used solder pastes in the world and dominate consumer electronics assembly. The most common rosin-based no-clean solder paste reflow envir .. weiterlesen

Sixteen simple inorganic salts were separately dissolved in water to a specific concentration,applied to separate Surface Insulation Resistance (SIR) coupons,dried and then the coupons were sub .. weiterlesen

Misregistration of holes is the maximum amount of variation between the centerlines of all terminal pads within one plated through hole in a printed circuit board. The impacts of misregistratio .. weiterlesen

As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has be .. weiterlesen

This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. Design calculations are presented for a test coupon of .. weiterlesen

Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. In this study, the effects of structural fa .. weiterlesen

Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. The complexity of PCB stack up designs,material .. weiterlesen

Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w .. weiterlesen

The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology .. weiterlesen

Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print vo .. weiterlesen

The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrad .. weiterlesen

Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may e .. weiterlesen

Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh .. weiterlesen

A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. The alloy exhibited a melting temperature ra .. weiterlesen

It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically .. weiterlesen

Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S .. weiterlesen

Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. The ERD layer is used to model copper foil rou .. weiterlesen

Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting .. weiterlesen

Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. Many different factors can affect the solder joint reliability,such as pack .. weiterlesen

Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. EN .. weiterlesen

In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can man .. weiterlesen

Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete pro .. weiterlesen

Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These def .. weiterlesen

A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. This discovery develo .. weiterlesen

Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product life .. weiterlesen

During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. Be .. weiterlesen

Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and .. weiterlesen

Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some .. weiterlesen

In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmissi .. weiterlesen

The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) res .. weiterlesen

Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be co .. weiterlesen

Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate betwe .. weiterlesen

Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan .. weiterlesen

Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead .. weiterlesen

A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual r .. weiterlesen

In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. New property de .. weiterlesen

Components are still shrinking in the SMT world and the next evolution of the passive components are the m03015 (009005) and m0201 (008004). Today it is seen that the 01005 component is still r .. weiterlesen

Solder paste is one of the most common materials used in surface mount technology (SMT) processes. Typical methods for applying solder paste to devices are needle dispensing or screen printing, .. weiterlesen

Conformal coating formulators are developing two-component solutions that improve protection,adhesion,and cure speed. Multi-component coatings are not new to the industry. Some of the oldest co .. weiterlesen