IPC Conference Paper Archive

A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the board. This can lead to difficulties in forming the external circuitry. Typical .. weiterlesen

Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis and PWB simulation become nowadays very pressing and key issues. Taking into a .. weiterlesen

Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings some interesting new solutions to age-old signal integrity (SI) concerns,and .. weiterlesen

In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be contained in smaller circuit areas requires that some of the passive components (re .. weiterlesen

Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1 currently dominating over photo defined,plasma etched and mechanically drilled m .. weiterlesen

Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper ions into the vias. This mass transport limitation is demonstrated by a rough .. weiterlesen

Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with improved dielectric properties. This paper focuses on new laminate materials with po .. weiterlesen

The electronics market demands for smaller,faster,more reliable and less costly products continues to fuel major changes in printed wiring board designs. Higher layer counts,increasing circuit .. weiterlesen

The combination of high speed and accuracy laser beam deflection,the know-how on wet chemical processes for Printed Circuit Boards (PCB’s),as well as CAD/CAM implementation for Laser direct Str .. weiterlesen

There is a contingent in the industry that feels reinforced substrates are needed to meet the performance requirements of HDI microvia technology. Concerns that non-reinforced resin coated foil .. weiterlesen

There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integr .. weiterlesen

Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities for very high speed applications. The challenge of opto-electronics and integration of ph .. weiterlesen

A new thermosetting resin system with modified cyanate ester resins having a loose cross-linked structure and alloyed with polymers was developed to provide low dielectric constant (Dk) and low .. weiterlesen

With the printed circuit board becoming increasingly complex,there is an ever-growing need to implement manufacturing standards that ensure high productivity at even higher yields. Factors such .. weiterlesen

??Machine Technology designed for the manufacture of Ultra Fine Line product ??Machine design provides clean production environment ??Latest State of the Art,Horizontal Wet Processing Equipment .. weiterlesen

Polyimides have proven their performance in electronic applications demanding high strength,increased durability, broader temperature ranges and exceptional chemical resistance. They serve as t .. weiterlesen

Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain identical chemo -rheological properties to yield dimensionally stable laminates. A prep .. weiterlesen

We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen .. weiterlesen

Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding fine line requirements. Advantages for volume production of fine features below 50? .. weiterlesen

The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are p .. weiterlesen

The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight. Industry experience has proven tha .. weiterlesen

An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time .. weiterlesen

The market for optical communication equipment and components has grown significantly since the early 1980s with growth rates exceeding 50% annually in the late 1990s. Although demand has dropp .. weiterlesen

Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. The O .. weiterlesen

A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vec .. weiterlesen

Processing thin core capacitor materials can be challenging,particularly those with non-reinforced dielectric less than 0.001” thick. Several processing steps require special attention to ensur .. weiterlesen

In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. In the paper .. weiterlesen

Solid Solder Deposit (SSD) technology was developed in the early and mid-1990's to improve first pass yields in the manufacture of electronic devices. As the trend towards finer pitch surface m .. weiterlesen

Inventory has been a hotly debated topic in many organizations. Since inventory is directly visible in company financials,there is a high degree of sensitivity to excessive inventory levels in .. weiterlesen

Automation,change and complexity have become the normal working environment in the PCB market. With this change has come the realization that high tech manufacturing,technological innovation an .. weiterlesen

A uniform transmission line is described electrically by a characteristic impedance and a time delay. From the length of the line and the time delay,the effective dielectric constant can be ext .. weiterlesen

Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published .. weiterlesen

Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. These increasing demands man .. weiterlesen

If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. Not .. weiterlesen

It is not often understood that when electrical signals travel along a wire or trace --- they reflect. Always! We intuitively understand that when we send audio waves across a room,a field or a .. weiterlesen

This paper presents a method both to enhance the yield of embedded resistor processes and to print embedded resistors using drop-on-demand ink-jet device capable of dispensing a precise volume .. weiterlesen

Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. Newer,high speed,horizontal plating lines utilize insoluble anodes .. weiterlesen

Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. Traditionally,the biggest drawback of .. weiterlesen

Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than .. weiterlesen

Permittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. Reliable design o .. weiterlesen

New vertical continuous plating equipment has been developed while taking into consideration production and environmental requirements. The vertical continuous plating equipment conveys printed .. weiterlesen

As imaging requirements continue to move towards finer resolution,accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major cont .. weiterlesen

The latest types of components launched by the leading component manufacturers have increased the need for process control in rework. These packages are referred to by the generic name Land Gri .. weiterlesen

Automated Optical Inspection (AOI) equipment has become an option for electronics manufacturers who are considering how to improve performance on the production line. During the last few years .. weiterlesen

Flip Chip on Board (FCOB) is one of the most quickly growing segments in advanced electronic packaging. In many cases,assembly processes are not capable of providing the high throughputs needed .. weiterlesen

Wafer-applied underfills are key to the widespread acceptance of flip chip technology. This NIST-ATP funded consortium is developing the materials and processes for achieving a wafer-applied un .. weiterlesen

This paper will discuss the implementation of real-time automated SPC for the Reflow Process. Topics covered will include: a new statistical method for quantifying the thermal process performan .. weiterlesen

Eutectic Bi-42Sn solder is a low melting point alternative to lead-based solders,particularly for low cost,consumer electronics. In earlier work,the mechanical properties of this solder have be .. weiterlesen

Like many other phrases carelessly thrown around by economists and business consultants,Return on Investment has become the overused acronym ROI,and has gained popularity so quickly that engine .. weiterlesen

As 0402 has become a common package for printed circuit board (PCB) assembly,research and development on mounting 0201 components is emerging as an important topic in the field of surface mount .. weiterlesen