Committee Home Page

Contribute to the IPC Standards that Your Company, Competitors, Customers and Suppliers Depend On

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation takes place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you from joining a committee, IPC welcomes global input.

Committee members sharpen their presentation skills and negotiation skills during the committee process. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry. 

We make it easy for you to join a committee by completing the form on this page. Please make sure to reference the committee (see that information below) or tell us the technology that interests you. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

IPC provides a user friendly, secure platform to conduct committee business (IPC Works). As a task group/committee member you will be required to log on in order to use IPC Works. To access IPC Works 

Technical Questions 

For questions relating to IPC standards content or other technical inquiries, contact

Committee Members in China and Asia

IPC members in China and Asia are invited to participate in the committee process through TGAsia Forum, our e-mail forum for discussion of standards development.


IPC Standards Committees

Note: All groups listed on this page conduct their meetings in English

1-10 Printed Board Design Committee
1-10c Test Coupon and Artwork Generation Task Group
1-13 Land Pattern Subcommittee
1-14 DFX Standards Subcommittee
2-10 Electronic Product Data Description Committee
2-12 Digital Twin Subcommittee
2-12a Generic Requirements for Digital Twin Task Group
2-12b Model Based Definition (MBD) for Digital Twins Task Group
2-12c Cybersecurity Protection Standard Task Group
2-12d Digital Sustainability Credentials Standard Task Group
2-15 Supply Chain Communication Subcommittee
2-15f Obsolete and Discontinued Product Task Group
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-16d IPC-2581 Users Task Group
2-17 Connected Factory Initiative Subcommittee
2-17a IPC-CFX Standard Task Group
2-17b IPC-HERMES-9852 Standard Task Group
2-19 Supply Chain Traceability and Trust Subcommittee
2-19a Critical Components Traceability Task Group
2-19b Trusted Supplier Task Group
2-19c Component-Level Authentication (CLA) Standard Task Group
2-30 Terms and Definitions Committee
2-40 Electronic Documentation Technology Committee
3-10 Printed Board Base Materials Committee
3-11 Laminate Prepreg Materials Subcommittee
3-11a IPC-4101 Task Group
3-11g Corrosion of Metal Finishes Task Group
3-11j Metal Based Laminates for Printed Boards
3-14 IC Substrate subcommittee
3-14a IC substrate Task Group
4-10 Fabrication Processes Committee
4-12 Drilling and Routing Subcommittee
4-14 Plating Processes Subcommittee
4-14b Final Finishes for Printed Boards – ENIG Task Group
4-14c Final Finishes for Printed Boards – Immersion Silver Task Group
4-14d Final Finishes for Printed Boards – Immersion Tin Task Group
4-14e Final Finishes for Printed Boards - OSP Task Group
4-14f Final Finishes for Printed Boards – ENEPIG Task Group
4-30 Environment, Health & Safety Steering Committee
4-33 Halogen-Free Materials Subcommittee
4-35cn Corporate Social Responsibility and Sustainability in the Supply Chain in China
5-20 Assembly & Joining Committee
5-21 Component Mounting Subcommittee
5-21e Solder Stencil Task Group
5-21f Ball Grid Array Task Group
5-21g Flip Chip Mounting Task Group
5-21h Bottom Termination Components (BTC) Task Group
5-21jnd Solder Paste Printing Task Group
5-21k IPC-SM-817 SMT Adhesive Task Group
5-21m Cold Joining Press-fit Task Group
5-21n Cold Joining Press-fit Handbook Task Group
5-21p Sintering Materials for Electronics Assemblies
5-21q Requirements and Acceptance of Wire Bonding Task Group
5-22 Soldering Subcommittee
5-22a J-STD-001 Task Group
5-22acn J-STD-001 Task Group - China
5-22as J-STD-001 Space and Military Electronic Assemblies Task Group
5-22f IPC-HDBK-001 Task Group
5-22h Thermal Profiling Guide Task Group
5-22k Bottom Termination Components Test Methods Task Group
5-23 Solderability Subcommittee
5-23a Printed Circuit Board Solderability Specifications Task Group
5-23b Component and Wire Solderability Specification Task Group
5-24 Assembly & Joining Materials
5-24a Flux Specifications Task Group
5-24b Solder Paste Task Group
5-24c Solder Alloy Task Group
5-24f Underfill Materials Design, Selection and Process Task Group
5-24g Polymerics Standard Task Group
5-26 Green Cleaners Subcommittee
5-26a Green Cleaners in Manufacturing Task Group
5-27 System in Package (SiP) Subcommittee
5-27a System in Package (SiP) Task Group
5-30 Cleaning and Coating Committee
5-31 Cleaning and Alternatives Subcommittee
5-31d Cleaning Handbook Task Group
5-31j Cleaning Compatibility
5-32 Cleanliness Assessment Subcommittee
5-32a Ion Chromatography Ionic Conductivity Task Group
5-32c Bare Board Cleanliness Assessment Task Group
5-32e Conductive Anodic Filament (CAF) Task Group
5-32g Residue Assessment Task Group
5-33 Coating Subcommittee
5-33a Conformal Coating Task Group
5-33b Solder Mask Performance Task Group
5-33c Conformal Coating Handbook Task Group
5-33f Potting and Encapsulation Task Group
5-33g Low Pressure Molding Task Group
5-40 Assembly Equipment Committee
5-45 Reflow Oven Process Control Subcommittee
5-45a Reflow Oven Process Control Standard Task Group
6-10 Product Reliability Committee
6-10d SMT Attachment Reliability Test Methods TG
6-10e SMT Performance Task Group
6-10f Monotonic Bend Characterization Task Group
6-10j Design Guidelines for IoT-Based Products Task Group
6-10k Thermal Management and Electronic Component Derating Task Group
7-10 Testing Committee
7-11 Test Methods Subcommittee
7-12 Microsection Subcommittee
7-13 Laboratory Subcommittee
7-13a Laboratory Qualification Task Group
7-14 In-Circuit Testing and Programming Subcommittee
7-14a In-System Device Programming Task Group
7-20 Process Control Management Committee
7-24 Printed Board Fabrication and Assembly Process Effects Subcommittee
7-24a Printed Board Process Effects Handbook Task Group
7-24b Printed Board Assembly Process Handbook Task Group
7-25a Automated Optical Inspection Process Control Standard Task Group
7-25b AOI Process Control for IC Substrates Standard Task Group
7-30 Product Assurance Committee
7-31 Acceptability Subcommittee
7-31a IPC-A-600 Task Group
7-31b IPC-A-610 Task Group
7-31bc A-610 Telecom Addendum Task Group
7-31br IPC-A-610 Addendum for High Speed Railway Task Group
7-31bv J-STD-001 and IPC-A-610 Automotive Addendum Task Group
7-31bv-cn IPC-A-610 Automotive Addendum - China
7-31d Optical Inspection Aides Task Group
7-31f IPC WHMA-A-620 Task Group
7-31fr IPC WHMA-A-620 Addendum for High Speed Railway Task Group
7-31fs IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
7-31h IPC-HDBK-620 Handbook Task Group
7-31j Electronic Box Assemblies Task Group
7-31k Wire Harness Design Task Group
7-31m Fiber Optic Cable Acceptability Task Group
7-31n Manual Magnification Aides Task Group
7-31p Optical Module Printed Boards
7-31fcn Acceptability of Electronic Wire Harnesses and Cables
7-33 Quality Assurance Subcommittee
7-34 Repairability Subcommittee
7-35 Assembly and Joining Handbook Subcommittee
7-36 Strategic Supplier Initiatives Subcommittee
7-36a Automotive EMS Supplier Declaration Task Group
9-80 OEM Management Council Steering Committee
9-82 Power Conversion Devices Standard Subcommittee
9-82a Firmware Design and Test for Power Conversion Task Group
B-10 Packaged Electronic Components Committee
B-10a Plastic Chip Carrier Cracking Task Group
B-11 3-D Electronic Packages Subcommittee
B-11a 3D Electronic Packages Guideline Task Group
D-10 Flexible Circuits Committee
D-11 Flexible Circuits Design Subcommittee
D-12 Flexible Circuits Specifications Subcommittee
D-12a UL 796F and UL746F Task Group
D-13 Flexible Circuits Base Materials Subcommittee
D-15 Flexible Circuits Test Methods Subcommittee
D-20 High Speed-High Frequency Committee
D-15 High Speed High Frequency Base Materials Subcommittee
D-21 High Speed High Frequency Design Subcommittee
D-22 High Speed High Frequency Board Performance Sub-committee
D-24 High Speed-High Frequency Test Methods Subcommittee
D-25 High Speed High Frequency Communication Devices Subcommittee
D-25a Design and Test Requirements for High Speed Connectors in High Reliability Applications
D-30 Rigid Printed Board Committee
D-31 Rigid Printed Board Design Subcommittee
D-31b IPC-2221 2222 Task Group
D-32 Thermal Stress Test Methodology Subcommittee
D-33 Performance Standards Subcommittee
D-33-ap Ultra HDI Subcommittee
D-33a Rigid Printed Bd. Performance Specifications TG
D-33aa IPC-6012 Automotive Addendum Task Group
D-33am IPC-6012 Medical Addendum Task Group
D-33as IPC-6012 Aerospace Addendum Task Group
D-33j 2391 Task Group
D-35 Printed Board Storage and Handling Subcommittee
D-50 Embedded Components Committee
D-52 Embedded Component Materials Subcommittee
D-54 Embedded Devices Test Methods Subcommittee
D-55 Embedded Devices Process Implementation Subcommittee
D-55a Embedded Circuitry Guideline Task Group
D-60 Printed Electronics Committee
D-61 Printed Electronics Design Subcommittee
D-61a Flexible Printed Electronics Design Standard Task Group
D-63 Printed Electronics Functional Materials Subcommittee
D-63a Printed Electronics Functional Dielectric Materials Task Group
D-64 Printed Electronics Final Assembly Subcommittee
D-61b Rigid Printed Electronics Design Standard Task Group
D-64a Printed Electronics Terms and Definitions Task Group
D-64b Printed Electronics on Rigid Substrates Performance Specification Task Group
D-67 Additively Manufactured Electronics Subcommittee
D-67a Acceptability of Additively Manufactured Electronics Specification Task Group
D-67b Additively Manufactured Electronics Performance Specification Task Group
D-67c Additively Manufactured Electronics Coupons Task Group
D-70 E-Textiles Committee
D-72 E-Textiles Materials Subcommittee
D-72a Conductive Yarns for E-Textiles Task Group
D-72b Woven, Knitted and Braided E-Textiles Standard Task Group
D-73 E-Textiles Design Subcommittee
D-73a E-Textiles Printed Electronics Design Standard Task Group
D-74 E-Textile Test Methods Development and Validation Subcommittee
D-74a Printed Electronics E-Textiles Electrical Test Task Group
D-74b E-Textiles Exposure and Durability Test Methods Task Group
D-75 E-Textiles Quality and Reliability Subcommittee
D-75a E-Textiles Wearables Standard Task Group
D-80 IPC 3D Plastronics Steering Committee
D-83 Plastronics Assembly Subcommittee
D-83a In-Mold Electronics Interconnection Task Group
D-84 Plastronics Quality and Reliability Subcommittee
D-84a Plastronics Accelerated Reliability Testing Task Group
E-30 Materials and Supplier Declarations Committee
E-31 Supplier Declaration Subcommittee
E-31a Generic Requirements for Declaration Process Management Task Group
E-31b Materials Declaration Task Group
E-31h Conflict Minerals Data Exchange Task Group
E-31j Lab Report Declaration Task Group
E-31k Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries
Ipcdf IPC Design - France
V-dlc DESIGN Leadership Council
V-essc IPC European Standards Steering Committee
V-taec Technical Activities Executive Committee
V-tsl Technology Solutions Committee
V-tsl-mvia Weak Interface Microvia Failures Technology Solutions Subcommittee
V-wft IPC Workforce Training Advisory Committee