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Please use the committee reference table below to determine committee codes.  If you would like to join more than one working group, please separate codes by commas.

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Contribute to the IPC Standards that Your Company, Competitors, Customers and Suppliers Depend On

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation takes place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you from joining a committee, IPC welcomes global input.

Committee members sharpen their presentation skills and negotiation skills during the committee process. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry. 

We make it easy for you to join a committee by completing the form on this page. Please make sure to reference the committee (see that information below) or tell us the technology that interests you. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

IPC provides a user friendly, secure platform to conduct committee business (IPC Works). As a task group/committee member you will be required to log on in order to use IPC Works. To access IPC Works 

Technical Questions

For questions relating to IPC standards content or other technical inquiries, contact Answers@ipc.org.

Committee Members in China and Asia

IPC members in China and Asia are invited to participate in the committee process through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting: Harryhan@ipc.org

Harry Han

韩云
Director, IPC Greater China Certification, Training and Standards
IPC大中华区认证培训及技术标准总监

 

Submit Comments for Standards Improvement

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Standard Improvement Comments 

Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions.

Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, to design, to manufacture of boards and to finished assemblies. We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted a project is established and the great work of the industry committees starts. 

IPC encourages individuals from the global electronics industry to submit their ideas and comments for standards improvement and the potential of new standards. 

1-10 Printed Board Design Committee
1-10c Test Coupon and Artwork Generation Task Group
1-13 Land Pattern Subcommittee
1-14 DFX Standards Subcommittee
2-10 Electronic Product Data Description Committee
2-12 Digital Twin Subcommittee
2-12a Generic Requirements for Digital Twin Task Group
2-15 Supply Chain Communication Subcommittee
2-15f Obsolete and Discontinued Product Task Group
2-16 Digital Product Model Exchange (DPMX) Subcommittee
2-17 Connected Factory Initiative Subcommittee
2-19 Supply Chain Traceability and Trust Subcommittee
2-19a Critical Components Traceability Task Group
2-19b Trusted Supplier Task Group
2-30 Terms and Definitions Committee
2-40 Electronic Documentation Technology Committee
3-10 Printed Board Base Materials Committee
3-11 Laminate Prepreg Materials Subcommittee
3-11g Corrosion of Metal Finishes Task Group
4-10 Fabrication Processes Committee
4-12 Drilling and Routing Subcommittee
4-14 Plating Processes Subcommittee
4-30 Environment, Health & Safety Steering Committee
4-33 Halogen-Free Materials Subcommittee
5-20 Assembly & Joining Committee
5-22 Soldering Subcommittee
5-22a J-STD-001 Task Group
5-22acn J-STD-001 Task Group - China
5-22as J-STD-001 Space and Military Electronic Assemblies Task Group
5-22f IPC-HDBK-001 Task Group
5-22h Thermal Profiling Guide Task Group
5-22jcn Solder Dross Reduction Chemical Task Group - China
5-22k Bottom Termination Components Test Methods Task Group
5-23 Solderability Subcommittee
5-23a Printed Circuit Board Solderability Specifications Task Group
5-23b Component and Wire Solderability Specification Task Group
5-24 Assembly & Joining Materials
5-24a Flux Specifications Task Group
5-24b Solder Paste Task Group
5-24c Solder Alloy Task Group
5-24f Underfill Materials Design, Selection and Process Task Group
5-24g Polymerics Standard Task Group
5-30 Cleaning and Coating Committee
5-31 Cleaning and Alternatives Subcommittee
5-31g Stencil Cleaning Task Group
5-31j Cleaning Compatibility
5-32 Cleanliness Assessment Subcommittee
5-32a Ion Chromatography Ionic Conductivity Task Group
5-32b SIR and Electrochemical Migration Task Group
5-32c Bare Board Cleanliness Assessment Task Group
5-32e Conductive Anodic Filament (CAF) Task Group
5-33 Coating Subcommittee
5-33a Conformal Coating Task Group
5-33awg Conformal Coating Requirements Working Group
5-33b Solder Mask Performance Task Group
5-33c Conformal Coating Handbook Task Group
5-33g Low Pressure Molding Task Group
6-10 Product Reliability Committee
6-10d SMT Attachment Reliability Test Methods TG
7-10 Testing Committee
7-11 Test Methods Subcommittee
7-11b Base Materials Test Methods Task Group
7-12 Microsection Subcommittee
7-20 Process Control Management Committee
7-23 Assembly Process Effects Handbook Subcommittee
7-24 Printed Board Fabrication and Assembly Process Effects Subcommittee
7-24a Printed Board Process Effects Handbook Task Group
7-30 Product Assurance Committee
7-31 Acceptability Subcommittee
7-31a IPC-A-600 Task Group
7-31b IPC-A-610 Task Group
7-31bc A-610 Telecom Addendum Task Group
7-31bv J-STD-001 and IPC-A-610 Automotive Addendum Task Group
7-31bv-cn IPC-A-610 Automotive Addendum - China
7-31d Optical Inspection Aides Task Group
7-31f IPC WHMA-A-620 Task Group
7-31fs IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group
7-31h IPC-HDBK-620 Handbook Task Group
7-31j Electronic Box Assemblies Task Group
7-31k Wire Harness Design Task Group
7-31m Fiber Optic Cable Acceptability Task Group
7-33 Quality Assurance Subcommittee
7-34 Repairability Subcommittee
7-35 Assembly and Joining Handbook Subcommittee
8-40 Roadmap Executive Committee
9-80 OEM Management Council Steering Committee
B-10 Packaged Electronic Components Committee
B-10a Plastic Chip Carrier Cracking Task Group
B-11 3-D Electronic Packages Subcommittee
B-11a 3D Electronic Packages Guideline Task Group
D-10 Flexible Circuits Committee
D-11 Flexible Circuits Design Subcommittee
D-12 Flexible Circuits Specifications Subcommittee
D-12a UL 796F and UL746F Task Group
D-13 Flexible Circuits Base Materials Subcommittee
D-15 Flexible Circuits Test Methods Subcommittee
D-20 High Speed-High Frequency Committee
D-21 High Speed High Frequency Design Subcommittee
D-21c High Speed/High Frequency Controlled Impedance T.G
D-22 High Speed High Frequency Board Performance Sub-committee
D-23 High Speed High Frequency Base Materials Subcommittee
D-24 High Speed-High Frequency Test Methods Subcommittee
D-24a TDR Test Methods Task Group
D-24b Bereskin Test Methods Task Group
D-24c High-Frequency Test Methods Task Group Frequency-Domain Methods
D-24d High Frequency Signal Loss Task Group
D-30 Rigid Printed Board Committee
D-31 Rigid Printed Board Design Subcommittee
D-31b IPC-2221 2222 Task Group
D-32 Thermal Stress Test Methodology Subcommittee
D-33 Performance Standards Subcommittee
D-33a Rigid Printed Bd. Performance Specifications TG
D-33aa IPC-6012 Automotive Addendum Task Group
D-33am IPC-6012 Medical Addendum Task Group
D-33as IPC-6012 Aerospace Addendum Task Group
D-35 Printed Board Storage and Handling Subcommittee
D-36 PB Process Capability-Qual Relative Reliab. Bench
D-50 Embedded Components Committee
D-52 Embedded Component Materials Subcommittee
D-54 Embedded Devices Test Methods Subcommittee
D-55 Embedded Devices Process Implementation Subcommittee
D-55a Embedded Circuitry Guideline Task Group
D-60 Printed Electronics Committee
D-62 Printed Electronics Base Materials Substrates Subcommittee
D-63 Printed Electronics Functional Materials Subcommittee
D-63a Printed Electronics Functional Dielectric Materials Task Group
D-64 Printed Electronics Final Assembly Subcommittee
D-64a Printed Electronics Terms and Definitions Task Group
D-66 Printed Electronics Processes Subcommittee
D-66a 3D Printed Electronics Processes Task Group
D-70 E-Textiles Committee
D-71 E-Textiles Joining and Interconnection Techniques Subcommittee
D-72 E-Textiles Materials Subcommittee
D-74 E-Textile Test Methods Development and Validation Subcommittee
D-75 E-Textiles Quality and Reliability Subcommittee
D-73 E-Textiles Design Subcommittee
D-73a E-Textiles Printed Electronics Design Standard Task Group
E-30 Materials and Supplier Declarations Committee
E-31 Supplier Declaration Subcommittee
E-31a Generic Requirements for Declaration Process Management Task Group
E-31b Materials Declaration Task Group
E-31h Conflict Minerals Data Exchange Task Group
E-31j Lab Report Declaration Task Group
E-31k Materials and Substances Declaration for the Aerospace, Defense, HE and Other Industries
E-32 Conflict Minerals Due Diligence Committee
V-essc IPC European Standards Steering Committee
V-taec Technical Activities Executive Committee
V-tsl Technology Solutions Committee
V-tsl-mvia Weak Interface Microvia Failures Technology Solutions Subcommittee