D-55 Embedded Devices Process Implementation Subcommittee

Cochair Raj Kumar, Northrop Grumman Space Systems
Cochair Jeff Seekatz, TTM Technologies - Stafford
Staff Liaison
Committee Charter This subcommittee is working on revision A of IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry. This specification covers qualification and performance of embedded active and passive circuitry within the finished printed board.