IPC Document Revision Table
IPC has hundreds of standards, guidelines, handbooks, and tools to help you build electronics better.
All of IPC's current and historical documents are catalogued below. If you do not see the document that you're looking for, make sure to check the 'obsolete and superseded documents' tab at the bottom of the page.
If you have any questions, please contact answers@ipc.org.
| Product ID | Document Name | Responsible Committee | Status | DoD |
|---|---|---|---|---|
| J-STD-001 | Requirements for Soldered Electrical and Electronic Assemblies | 5-22a | Rev J 4/24 Rev H 9/20 Rev G Am1 10/18 Rev G 10/17 Rev F WAM1 2/16 Rev F Am 1 12/15 Rev F 08/14 Rev E 4/10 Rev D Amend 1 4/08 Rev D 2/05 Rev C 3/00 Rev B 10/96 Rev A 1/95 Orig. 4/92 Supersedes IPC-S-815 | 07/01 |
| J-STD-001xA/A-610xA Automotive Addendum | Automotive Addendum to IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610 Acceptability of Electronic Assemblies The addendum MUST be used with the same version of the standard; e.g. 001/A-610 | Rev HA 10/21 Rev GA 2/20 | ||
| J-STD-001xS Space Hardware Addendum | Space Applications Electronic Hardware Addendum for J-STD-001. The addendum MUST be used with the same version of the standard; e.g. 001CS with 001C, 001DS with 001D, 001ES with 001E | 5-22as | JS 1/25 HS 5/21 GS Amend 1 3/20 GS 4/18 FS Am1 2/17 FS 02/15 ES 12/10 DS Amend 1 9/09 DS 11/06 CS 1/04 | 04/21 |
| IPC-HDBK-001 | Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies | 5-22f | Rev H 3/21 Rev F 2/16 Rev E 2/12 Amend 2 10/05 Amend 1 12/00 Orig. 3/98 | 07/01 |
| SMC-TR-001 | An Introduction to Tape Automated Bonding Fine Pitch Technology | No Longer Maintained* Orig. 1/89 | ||
| IT-WP-001 | Myths of E-Commerce | No Longer Maintained* Orig. 9/00 | ||
| SMC-WP-001 | Soldering Capability White Paper Report | No Longer Maintained* Orig. 8/91 | ||
| SMEMA 1.2 | Mechanical Equipment Interface Standard | No Longer Maintained* Update IPC-SMEMA-9851 | ||
| JP002 | Current Tin Whiskers Theory and Mitigation Practices Guideline | 5-23e | No Longer Maintained* Orig. 3/06 | |
| J-STD-002 | Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires | 5-23b | Rev E 11/17 Rev D 6/13 Rev C Amend 1 10/08 Rev C 12/07 Rev B 2/03 Rev A 10/98 Orig. 4/92 Supersedes IPC-S-805 | 05/95 |
| SMC-WP-002 | An Assessment of the Use of Lead in Electronic Assembly | Obsolete without replacement Orig. 8/92 | ||
| J-STD-003 | Solderability Tests for Printed Boards | 5-23a | Rev D 1/23 Rev C WAM 1&2 9/17 Rev C Amend 1 9/14 Rev C 9/13 Rev B 2/07 Rev A 2/03 Original 4/92 Supersedes IPC-S-804 | 01/04 |
| SMC-WP-003 | Chip Mounting Technology | No Longer Maintained* Orig. 8/93 | ||
| SMEMA 3.1 | Fiducial Mark Standard | |||
| J-STD-004 | Requirements for Soldering Fluxes | 5-24a | Rev D - 12/23 Rev C - 01/22 Rev B Amend 1 – 11/11 Rev B 12/08 Rev A 1/04 Orig. 1/95 Supersedes IPC-SF-818 | 05/95 |
| SMC-WP-004 | Design for Success | No Longer Maintained* Orig. 4/97 | ||
| SMEMA 4 | Reflow Terms and Definitions | |||
| J-STD-005 | Requirements for Soldering Pastes | 5-24b | Rev B 4/24 Rev A 2/12 Amend 1 6/96 Orig. 1/95 Supersedes IPC-SP-819 | 05/95 |
| SMC-WP-005 | PWB Surface Finishes | No Longer Maintained* Orig. 4/97 | ||
| IPC-HDBK-005 | Guide to Solder Paste Assessment | 5-24b | No Longer Maintained* Orig. 1/06 | |
| SMEMA 5 | Screen Printing Terms and Definitions | |||
| J-STD-006 | Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications | 5-24c | Rev C Amend 1 11/17 Rev C 7/13 Rev B Amends 1 & 2 10/09 Rev B Amend 1 6/08 Rev B 1/06 Rev A 5/01 Amend 1 7/96 Orig. 1/95 | 05/95 |
| IPC-WP-006 | Round Robin Testing & Analysis: Lead-Free Alloys, Tin, Silver, & Copper | SPVC | No Longer Maintained* Orig. 8/03 | |
| SMEMA 6 | Electronics Cleaning Terms and Definitions | |||
| SMEMA 7 | Fluid Dispensing Terms and Definitions | |||
| IPC-WP-008 | Setting up Ion Chromatography Capability | 5-30 | No Longer Maintained* Orig. 12/05 | |
| IPC-WP-009 | A Summary of Tin Whisker Research References | No Longer Maintained* Orig. 3/09 | ||
| IPC-WP-010 | A Summary of Fungus Resistance Test Methods | 5-30 | ||
| J-STD-012 | Implementation of Flip Chip and Chip Scale Technology | 5-21g | Superseded by IPC-7094 10/13 Orig. 1/96 | |
| IPC-WP-012 | Pb-free Electronics Risk Management (PERM) Council Pb-free Research Priorities | 8-81D | Orig. 5/14 | |
| J-STD-013 | Implementation of Ball Grid Array and Other High Density Technology | 5-21f | Superseded by IPC-7095 10/13 Orig. 7/96 | |
| IPC-WP-013 | Analytical Procedures for Portable Lead-Free Alloy Test Data | SPVC | No Longer Maintained* Orig. 5/14 | |
| IPC-WP-014 | Pb-free Electronics Risk Management (PERM) Council Position on the use of Pb-free Electronics in the Aerospace, Defense and High Performance Electronic Industries | 8-81 | Rev A 3/20 Orig. 7/14 | |
| IPC-WP-015 | Pb-free Electronics Risk Management (PERM) Council Pb-free Rebaseline | 8-81 | No Longer Maintained* Orig. 4/14 | |
| IPC-WP-016 | PC Round Robin Study -Conformal Coatings Moisture and Insulation Resistance and Dielectric Withstanding Voltage | No Longer Maintained* Orig. 2/13 | ||
| IPC-WP-017 | What Conformal Coaters Wish Designers Knew About Coatings | No Longer Maintained* Orig. 10/15 | ||
| IPC-DRM-18 | Component Identification Desk Reference Manual | No Longer Maintained* Rev J 2/18 Rev H 11/07 Rev G 9/03 Rev F 8/01 Rev E 8/00 Rev D 7/99 Rev C 7/98 Rev B 2/97 Rev A 4/96 Orig. 9/95 | ||
| IPC-WP-019 | An Overview on Global Change in Ionic Cleanliness Requirements | Rev B 9/20 Rev A 9/18 Orig. 8/17 | ||
| J-STD-020 | Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices | B-10a | Rev F 11/22 Rev E 2/15 Rev D Amend 1 3/08 Rev D 8/07 Rev C 7/04 Rev B 7/02 Rev A 4/99 Orig. 10/96 | |
| IPC-WP-021 | Considerations of New Classes of Coatings for IPC-CC-830 Revision C | Orig. 9/19 | ||
| IPC/PERM-WP-022 | Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report | 8-81F | No Longer Maintained* Orig. 8/18 | |
| IPC-WP-023 | IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface | V-TSL | Orig. 5/19 | |
| IPC-WP-024 | Smart Textiles Reliability Following Laundering | D-70 | No Longer Maintained* Orig. 8/18 | |
| IPC-WP-025 | A Framework for the Engineering and Design of E-Textiles | D-70 | Orig. 4/19 | |
| J-STD-026 | Semiconductor Design Standard for Flip Chip Applications | 5-21g | No Longer Maintained* Orig. 8/99 | |
| IPC-WP-026 | IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A review of the current state of the blockchain technology and its potential applications in electronics manufacturing | V-TSL | Orig. 9/19 | |
| IPC-WP-028 | Guidance on Objective Evidence for Validating the Acceptability of Bubbles in Conformal Coatings | Orig. 2/24 | ||
| J-STD-027 | Mechanical Outline Standard for Flip Chip or Chip Scale Configurations | 5-21g | No Longer Maintained* Orig. 2/03 | |
| J-STD-028 | Performance Standard for Flip Chip Scale Bumps | 5-21g | No Longer Maintained* Orig. 8/99 | |
| J-STD-030 | Selection and Application of Board Level Underfill Materials | 5-24f | No Longer Maintained* Rev A 3/14 Orig. 9/05 | |
| J-STD-032 | Performance Standard for Ball Grid Array Bumps and Columns | 5-21f | No Longer Maintained* Orig. 6/02 | |
| J-STD-033 | Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices | B-10a | No Longer Maintained* Rev D 5/18 Rev C Amend 1 8/14 Rev C 2/12 Rev B Amend 1 1/07 Rev B 10/05 Rev A 7/02 Orig. 4/99 | |
| J-STD-035 | Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components | B-10a | Rev A 11/22 Orig. 4/99 | |
| IPC-0040 | Optoelectronic Assembly and Packaging Technology | 5-25 | No Longer Maintained* Orig. 5/03 | |
| J-STD-046 | Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers (revision of JESD46D) Joint JEDEC/IPC/ECIA | 2-15f | No Longer Maintained* Orig. 11/16 | |
| J-STD-048 | Notification Standard for Product Discontinuance | 2-15f | No Longer Maintained* Orig. 5/15 | |
| IPC-T-50 | Terms and Definitions for Interconnecting and Packaging Electronic Circuits | 2-30 | Rev N 11/21 Rev M 6/15 Rev K 7/13 Rev J 10/11 Rev I Skipped Due to Conflict with “L” and “1” Rev H 7/08 Rev G 12/03 Rev F 6/96 Rev E 7/92 Rev D 11/88 Rev C 3/85 Rev B 6/80 Rev A 8/76 Orig. 8/75 | 09/80 |
| IPC-T-51 | Terms and Definitions for Design and Manufacture of Printed Electronics | D-64a | Orig. 4/22 | |
| IPC-DRM-53 | Introduction to Electronics Assembly | No Longer Maintained* Orig. 6/00 | ||
| IPC-SC-60 | Post Solder Solvent Cleaning Handbook | 5-31a | Superseded and combined into CH-65B 5/11 Rev A 8/99 Orig. 4/87 | |
| IPC-SA-61 | Post-Solder Semi-Aqueous Cleaning Handbook | 5-31b | Superseded and combined into CH-65B 5/11 Rev A 6/02 Orig. 7/95 | |
| IPC-AC-62 | Post Solder Aqueous Cleaning Handbook | 5-31b | Superseded and combined into CH-65B 5/11 Rev A 1/96 Orig. 12/86 | |
| IPC-CH-65 | Guidelines for Cleaning of Printed Boards and Assemblies | 5-31d | No Longer Maintained* Rev B 7/11 Rev A 9/99 Orig. 12/90 | |
| IPC-CS-70 | Guidelines for Chemical Handling Safety in Printed Board Manufacturing | Obsolete without replacement Orig. 8/88 | ||
| EIA/IPC/JEDEC-J-STD-075 | Classification of Passive and Solid State Devices for Assembly Processes | B-10a | Rev A 11/22 Orig. 8/08 | |
| IPC-CM-78 | Guidelines for Surface Mounting and Interconnecting Chip Carriers | Superseded by IPC-SM-780 Rev C – 3/88 Orig. 11/83 | ||
| IPC-MP-83 | IPC Policy on Metrication | Obsolete without replacement Orig. 8/85 | ||
| IPC-PC-90 | General Requirements for Implementation of Statistical Process Control | 7-22 | Superseded by IPC-9191 Orig. 10/90 | W02/03 |
| IPC-QS-95 | General Requirements for Implementation of ISO 9000 Quality Systems | 7-22 | Obsolete without replacement Orig. 4/93 | |
| IPC-L-108 | Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards | 3-11 | Superseded by IPC-4101 Rev B 6/90 Rev A 10/80 Orig. 3/76 | |
| IPC-L-109 | Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards | 3-11 | Superseded by IPC-4101 Rev B 7/92 Rev A 10/80 Orig. 3/76 | |
| IPC-L-110 | Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards | 3-11 | Rev A Superseded by IPC-L-109 and IPC-4101 | |
| IPC-CC-110 | Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications | 3-11c | Superseded by IPC-4121 Rev A 12/97 Orig. 1/94 | |
| IPC-L-112 | Specification for Composite Metal Clad Base Materials for Printed Boards | 3-11 | Superseded by IPC-4101 Rev A 6/92 Orig. 7/81 | |
| IPC-WP-113 | Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) | 7-31k & 7-31h | No Longer Maintained* Orig. 12/15 | |
| IPC-WP-114 | Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) | 7-31k & 7-31h | No Longer Maintained* Orig. 12/15 | |
| IPC-L-115 | Specification for Rigid Metal Clad Base Materials for Printed Boards | 3-11 | Superseded by IPC-4101 Rev B 4/90 Rev A 10/80 Orig. 3/77 | |
| IPC-WP-116 | Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan | 7-31k & 7-31h | No Longer Maintained* Orig. 12/15 | |
| IPC-L-120 | Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates | Obsolete without replacement | ||
| IPC-L-125 | Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections | D-23 | Superseded by IPC-4103 Rev A 7/92 Orig. 8/83 | |
| IPC-L-130 | Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards | 3-11 | Superseded by IPC-L-108 and IPC-4101 Orig. 1/77 | |
| IPC-DD-135 | Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules | Obsolete without replacement Orig. 8/95 | ||
| IPC-EG-140 | Specification for Finished Fabric Woven from “E” Glass for Printed Boards | 3-12d | Superseded by IPC-4412 Amend 1 & 2 6/97 Orig. 3/88 | W02/03 |
| IPC-SG-141 | Specification for Finished Fabric Woven from “S” Glass for Printed Boards | 3-12d | No Longer Maintained* Orig. 2/92 | 7/93 |
| IPC-A-142 | Specification for Finished Fabric Woven from Aramid for Printed Boards | 3-12 | No Longer Maintained* Orig. 6/90 | W05/12 |
| IPC-QF-143 | General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards | 3-12d | No Longer Maintained* Orig. 2/92 | W6/11 |
| IPC-CF-148 | Resin Coated Metal for Printed Boards | 3-12c | Superseded by IPC-4563 Rev A 9/98 Orig. 6/90 | |
| IPC-MF-150 | Metal Foil for Printed Wiring Applications | 3-12a | Superseded by IPC-4562 5/00 Amend 1 8/92 Rev F 10/91 Changed from CF-150 to MF-150 Rev E 5/81 Rev D 3/76 Rev C 8/74 Rev B 2/71 Rev A 9/67 Orig. 8/66 | W02/02 |
| IPC-CF-152 | Composite Metallic Material Specification for Printed Wiring Boards | 3-12h | No Longer Maintained* Rev B 12/97 Rev A 1/94 Orig. 6/90 | |
| IPC-FC-203 | Specification for Flat Cable, Round Conductor, Ground Plane | D-13 | Obsolete 7/96 Orig. 7/85 | |
| IPC-FC-210 | Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC) | D-13 | Obsolete 7/96 Orig. 9/85 | |
| IPC-FC-213 | Performance Specification for Flat Undercarpet Telephone Cable | D-13* | Obsolete 7/96 Orig. 9/84 | |
| IPC-FC-217 | General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable | D-13 | Obsolete 7/96 Reaffirmed 4/90 Orig. 8/82 | |
| IPC-FC-218B/EIA-RS-429 | General Specification for Connectors, Electrical Flat Cable Type | D-13 | Obsolete 7/96 Reaffirmed 5/91 Reaffirmed 11/81 Orig. 7/76 | |
| IPC-FC-219 | Environment Sealed Flat Cable Connectors for use in Aerospace Applications | D-13 | Obsolete 7/96 Orig. 5/84 | |
| IPC-FC-220 | Specification for Flat Cable, Flat Conductor, Unshielded | D-13 | Obsolete 7/96 Rev C 7/85 Rev B 8/75 Rev A 1/74 Orig. 5/70 | |
| IPC-FC-221 | Specification for Flat-Copper Conductors for Flat Cables | D-13 | Obsolete 7/96 Rev A 5/84 Orig. 8/75 | |
| IPC-FC-222 | Specification of Flat Cable Round Conductor, Unshielded | D-13 | Obsolete 7/96 Reaffirmed 5/91 Orig. 6/80 | |
| IPC-FC-225 | Flat Cable Design Guide | D-13 | Obsolete 7/96 Reaffirmed 10/85 Orig. 8/75 | |
| IPC-FC-231 | Flexible Base Dielectrics for Use in Flexible Printed Wiring | D-13 | Superseded by IPC-4202 Amend 10/95 Rev C 4/92 Rev B 2/86 Rev A 5/83 Orig. 7/74 | W03/03 |
| IPC-FC-232 | Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films | D-13 | Superseded by 4203 5/02 Amend 10/95 Rev C 6/94 Rev B 2/86 Rev A 5/83 Orig. 7/74 | W03/03 |
| IPC-FC-233 | Flexible Adhesive Bonding Films | D-13 | Incorporated into IPC-FC-232C 6/94 Rev A 2/86 Orig. 5/83 | W11/03 |
| IPC-FC-234 | PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits | D-1 | No Longer Maintained* Rev A 12/14 Orig. 12/97 | |
| IPC-FC-240 | Single sided flex | D-12 | Superseded by IPC-6013 Incorporated into FC-250 Rev B 1/74 Rev A 5/69 Orig. 12/65 | |
| IPC-FC-241 | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring | D-13* | Superseded by IPC-4204 Amend 10/95 Rev C 4/92 Rev B 2/86 Rev A 5/83 Orig. 7/74 | W02/02 |
| IPC-RF-245 | Performance Specification for Rigid-Flex Printed Boards | D-12 | Superseded by IPC-6013 Orig. 4/87 | |
| IPC-D-249 | Design Standard for Flexible Single-and Double-Sided Printed Boards | D-11 | Superseded by IPC-2223 Orig. 1/87 | |
| IPC-FC-250 | Specification for Single – and Double-Sided Flexible Printed Wiring | D-12 | Superseded by IPC-6013 Rev A 9/86 Orig. 1/74 | |
| IPC-FA-251 | Guidelines for Single and Double Sided Flex Circuits | D-12 | No Longer Maintained* Orig. 2/92 | |
| IPC-D-275 | Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies | D-31b | Superseded by IPC-2221 and 2222 Supersedes IPC-D-319 and IPC-D-949 Amendment 1 4/96 Orig. 9/91 | W10/09 |
| IPC-RB-276 | Qualification and Performance Specification for Rigid Printed Boards | D-33a | Superseded by IPC-6011 and IPC-6012 Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C | |
| IPC-D-279 | Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies | 6-10b | No Longer Maintained* Orig. 7/96 | |
| IPC-D-300 | Printed Board Dimensions and Tolerances | 1-10a | Superseded by IPC-2615 Rev G 1/84 Rev F 11/74 Rev E 10/70 Rev D 1/70 Rev C 10/65 Rev B 1/64 Rev A 7/61 Orig. 8/60 | |
| IPC-D-310 | Guidelines for Phototool Generation and Measurement Techniques | No Longer Maintained* Rev C 6/91 Rev B 12/85 Rev A 12/77 Orig. 9/69 | ||
| IPC-A-311 | Process Control Guidelines for Phototool Generation and Use | No Longer Maintained* Orig. 3/96 | ||
| IPC-D-316 | Design Guide for Microwave Circuit Boards Utilizing Soft Substrates | D-21b | Superseded by IPC-2252 Orig. 5/95 | |
| IPC-D-317 | Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques | D-21a | Superseded by IPC-2251 Rev A 1/95 Orig. 4/90 | |
| IPC-HF-318 | Microwave End Product Board Inspection and Test | D-22 | Superseded by IPC-6018 Rev A 12/91 Orig. 6/85 | |
| IPC-D-319 | Design Standard for Rigid Single-and Double-Sided Printed Boards | D-31b | Superseded by IPC-D-275, then by IPC-2221/2222 Orig. 1/87 | |
| IPC-SD-320 | Performance Specification for Rigid Single- and Double-Sided Printed Boards | D-33a | Superseded by IPC-RB-276 Supersedes IPC-TC-500 Rev B 11/86 Rev A 3/81 Orig. 1/77 | |
| IPC-D-322 | Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes | Reaffirmed 9/91 Orig. 8/84 | 10/94 | |
| IPC-MC-324 | Performance Specifications for Metal Core Boards | D-33a | Superseded by IPC-6011 and IPC-6012 Orig. 10/88 | |
| IPC-D-325 | Documentation Requirements for Printed Boards, Assemblies and Support Drawings | 2-40 | No Longer Maintained* Partially Superseded: Schematic Drawings Superseded by IPC-2612 and IPC-2612-1. Fabrication Drawings Superseded by IPC-2614. Dimensioning and Tolerancing Superseded by IPC-2615. For all other documentation requirements, continue to use IPC-D-325. Rev A 5/95 Orig. 1/87 | |
| IPC-D-326 | Information Requirements for Manufacturing Printed Board Assemblies | 2-11a | No Longer Maintained* Rev A 1/04 Orig. 4/91 | |
| IPC-D-330 | Design Guide Manual | No Longer Maintained* Orig. 1/92 | ||
| IPC-PD-335 | Electronic Packaging Handbook | No Longer Maintained* Orig. 12/89 | ||
| IPC-NC-349 | Computer Numerical Control Formatting for Drillers and Routers | No Longer Maintained* Orig. 8/85 | 10/85 | |
| IPC-D-350 | Printed Board Description in Digital Form | 2-11 | No Longer Maintained* Rev D 7/92 Rev C 10/85 Rev B 8/77 Rev A 2/75 Orig. 8/72 | 07/78 |
| IPC-D-351 | Printed Board Drawings in Digital Form | No Longer Maintained* Orig. 8/85 | 09/85 | |
| IPC-D-352 | Electronic Design Data Description for Printed Boards in Digital Form | No Longer Maintained* Orig. 8/85 | 09/85 | |
| IPC-D-354 | Library Format Description for Printed Boards in Digital Form | No Longer Maintained* Orig. 2/87 | ||
| IPC-D-355 | Printed Board Assembly Description in Digital Form | No Longer Maintained* Orig. 1/95 | ||
| IPC-D-356 | Bare Board Electrical Test Information in Digital Form | 2-11c | No Longer Maintained* Rev B 10/02 Rev A 1/98 Orig. 3/92 | 08/92 |
| IPC-AM-361 | Specification for Rigid Substrates for Additive Process Printed Boards | Superseded by IPC-4101 Orig. 1/82 | ||
| IPC-MB-380 | Guidelines for Molded Interconnection Devices | No Longer Maintained* Orig. 10/90 | ||
| IPC-D-390 | Automated Design Guidelines | No Longer Maintained* Rev A 2/88 Orig. 7/74 | ||
| IPC-C-406 | Design and Application Guidelines for Surface Mount Connectors | No Longer Maintained* Orig. 1/90 | ||
| IPC-CI-408 | Solderless Surface Mount Connector Design Characteristics and Application Guidelines | B-22c | No Longer Maintained* Orig. 1/94 | |
| IPC-BP-421 | General Specification for Rigid Printed Board Backplanes with Press Fit Contacts | Obsolete without replacement Reaffirmed 4/90 Orig. 10/80 | ||
| IPC-D-422 | Design Guide for Press Fit Rigid Printed Board Backplanes | No Longer Maintained* Orig. 9/82 | ||
| IPC-DW-424 | General Specification for Encapsulated Discrete Wire Interconnection Boards | No Longer Maintained* Orig. 1/95 | ||
| IPC-DW-425 | Design and End Product Requirements for Discrete Wiring Boards | No Longer Maintained* Rev A 5/90 Orig. 9/82 | 03/94 | |
| IPC-DW-426 | Specifications for Assembly of Discrete Wiring | No Longer Maintained* Orig. 12/87 | ||
| IPC-TR-460 | Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards | No Longer Maintained* Rev A 2/84 Orig. 1973 | ||
| IPC-TR-461 | Solderability Evaluation of Thick and Thin Fused Coatings | No Longer Maintained* Orig. 3/79 | ||
| IPC-TR-462 | Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage | No Longer Maintained* Orig. 10/87 | ||
| IPC-TR-464 | Accelerated Aging for Solderability Evaluations | 5-23b | No Longer Maintained* Addendum 12/87 Orig. 4/84 | |
| IPC-TR-465-1 | Round Robin Test on Steam Ager Temperature Control Stability | No Longer Maintained* Orig. 1993 | ||
| IPC-TR-465-2 | The Effect of Steam Aging Time and Temperature on Solderability Test Results | No Longer Maintained* Orig. 1993 | ||
| IPC-TR-465-3 | Evaluation of Steam Aging on Alternative Finishes, Phase IIA | No Longer Maintained* Orig. 7/96 | ||
| IPC-TR-466 | Wetting Balance Standard Weight Comparison Test | No Longer Maintained* Orig. 4/95 | ||
| IPC-TR-467 | Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D | No Longer Maintained* Orig. 10/96 | ||
| IPC-TR-468 | Factors Affecting Insulation Resistance Performance of Printed Boards | No Longer Maintained* Orig. 3/79 | ||
| IPC-TR-470 | Thermal Characteristics of Multilayer Interconnection Boards | No Longer Maintained* Orig. 1/74 | ||
| IPC-TR-474 | An Overview of Discrete Wiring Techniques | Obsolete without replacement Reprint 1984 Orig. 3/79 | ||
| IPC-TR-476 | How to Avoid Metallic Growth Problems on Electronic Hardware Rev A Electrochemical Migration Electrically Induced Failures In Printed Assemblies | No Longer Maintained* Rev A 6/84 (new title) Orig. 9/77 | ||
| IPC-TR-480 | Results of Multilayer Test Program Round Robin IV Phase I | Obsolete without replacement Orig. 9/75 | ||
| IPC-TR-481 | Results of Multilayer Test Program Round Robin V | No Longer Maintained* Orig. 4/81 | ||
| IPC-TR-482 | New Developments in Thin Copper Foils | No Longer Maintained* Orig. 1/76 | ||
| IPC-TR-483 | Dimensional Stability Testing of Thin Laminates – Report on Phase I International Round Robin Test Program | No Longer Maintained* Rev A 3/91 Addendums 10/87 Orig. 4/84 | ||
| IPC-TR-484 | Results of IPC Copper Foil Ductility Round Robin Study | No Longer Maintained* Orig. 4/86 | ||
| IPC-TR-485 | Results of Copper Foil Rupture Strength Test Round Robin Study | No Longer Maintained* Orig. 3/85 | ||
| IPC-TR-486 | Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations | No Longer Maintained* Orig. 7/01 | ||
| IPC-TR-549 | Measles in Printed Wiring Boards | No Longer Maintained* Orig. 11/78 | ||
| IPC-TR-551 | Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components | No Longer Maintained* Orig. 7/93 | ||
| IPC-DR-570 | General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards | 4-12 | No Longer Maintained* Rev A 4/84 Orig. 1/79 | |
| IPC-DR-572 | Drilling Guidelines for Printed Boards | 4-12 | No Longer Maintained* Rev A 3/07 Orig. 4/88 | |
| IPC-TR-575 | Additive Process Evaluation-Report on Phase I IPC Round Robin Testing Program on Additive Printed Wiring Boards | Obsolete without replacement Orig. 4/75 | ||
| IPC-TR-576 | Additive Process Evaluation | Obsolete without replacement Orig. 9/77 | ||
| IPC-TR-577 | Additive Process Evaluation - Report on Phase III IPC Round Robin Testing Program on Rigid Additive Printed Boards | Obsolete without replacement Orig. 4/80 | ||
| IPC-TR-578 | Leading Edge Manufacturing Technology Report – Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards | No Longer Maintained* Orig. 9/84 | ||
| IPC-TR-579 | Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards | No Longer Maintained* Orig. 9/88 | ||
| IPC-TR-580 | Cleaning and Cleanliness Test Program Phase 1 Test Results | No Longer Maintained* Orig. 10/89 | ||
| IPC-TR-581 | IPC Phase 3 Controlled Atmosphere Soldering Study | No Longer Maintained* Orig. 8/94 | ||
| IPC-TR-582 | IPC Phase 3 No-Clean Flux Study | No Longer Maintained* Orig. 11/94 | ||
| IPC-TR-583 | An In-Depth Look At Ionic Cleanliness Testing | No Longer Maintained* Orig. 7/02 | ||
| IPC-WP/TR-584 | IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies | 4-33 | No Longer Maintained* Rev A 8/07 Orig. 4/03 | |
| IPC-TR-585 | Time, Temperature and Humidity Stress of Final Board Finish Solderability | No Longer Maintained* Orig. 5/06 | ||
| IPC-TR-586 | Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A) | 4-14 | No Longer Maintained* Orig. 5/09 | |
| IPC-TR-587 | Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report | 5-22ARR | Orig. 7/20 | |
| IPC-A-600 | Acceptability of Printed Boards | 7-31a & D-33a | Rev K 7/20 Rev J 6/16 Rev H 4/10 Rev G Amend 1 1/08 Rev G 7/04 Rev F 11/99 Rev E 8/95 Rev D '89 Rev C '78 Rev B '74 Rev A '70 Orig. '64 | |
| IPC-SS-605 | Printed Board Quality Evaluation Slide Set | Obsolete without replacement | ||
| IPC-QE-605 | Printed Board Quality Evaluation Handbook | 7-31c | No Longer Maintained* Rev A 2/99 | |
| J-STD-609 | Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices | 4-34b | Rev C 1/25 Rev B 11/16 Rev A 3/10 Orig. 5/07; supersedes IPC-1066 | 01/08 |
| IPC-A-610 | Acceptability of Electronic Assemblies | 7-31b | Rev J 3/24 Rev H 9/20 Rev G 10/17 Rev F WAM1 2/16 Rev F Amend 1 12/15 Rev F 8/14 Rev E 4/10 Rev D Amend 1 4/08 Rev D 2/05 Rev C Amend 1 11/01 Rev C 1/00 Rev B 12/94 Rev A 3/90 Orig. 8/83 | 02/02 |
| IPC-A-610G-R | Rail Transit Addendum to IPC-A-610G Acceptability of Electronic Assemblies | 7-31r | Rev. G-R 3/22 | |
| IPC-A-610xC | IPC-A-610xC Telecom Addendum | 7-31bc | GC 1/20 FC 2/17 DC 8/09 (orig.) | |
| IPC-HDBK-610 | Handbook and Guide to IPC-A-610 (Includes B-C-D comparison) | No Longer Maintained* Amend 1 10/05 Orig. 9/02 | ||
| IPC-QE-615 | Assembly Quality Evaluation Handbook | Obsolete without replacement | ||
| IPC-D-620 | Design and Critical Process Requirements for Cable and Wiring Harnesses | 7-31k | Rev A 12/21 Orig. 2/16 | |
| IPC/WHMA-A-620 | Acceptability of Electronic Wire Harnesses and Cables | 7-31f | Rev E 10/22 Rev D 1/20 Rev C 1/17 Rev B Amend 1 8/13 Rev B 10/12 Rev A 7/06 Orig. 1/02 | |
| IPC/WHMA-A-620 REDLINE | Acceptability of Electronic Wire Harnesses and Cables | Rev C to D 5/20 Rev B to C 3/17 | ||
| IPC/WHMA-A-620 Space Hardware Addendum | Space Applications Electronic Hardware Addendum for IPC/WHMA-A-620. The addendum MUST be used with the same version of the standard; e.g. 620CS with 620C | 7-31fs | Rev E-S 10/23 Rev D-S 9/20 Rev C-S 4/18 Rev B-S 6/13 Rev A-S Amend 1 7/12 Rev A-S 1/11 | |
| IPC/WHMA-A-620CR | Rail Transit Addendum to IPC/WHMA-A-620C | 7-31r | Rev. CR 3/22 | |
| IPC-HDBK-620 | Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620 | 7-31h/7-31k | Orig 6/18 | |
| IPC-A-630 | Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures | 7-31j | Orig. 9/13 | |
| IPC-HDBK-630 | Guidelines for Design, Manufacture, Inspection, and Testing of Electronic Enclosures | 7-31j | Orig. 7/14 | |
| IPC-A-640 | Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies | 7-31m | Rev. A 3/22 Orig. 7/17 | |
| IPC-AI-640 | User’s Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates | Obsolete without replacement Orig. 1/87 | ||
| IPC-D-640 | Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies | 7-31m | Rev. A 4/22 Orig. 9/16 | |
| IPC-AI-641 | User’s Guidelines for Automated Solder Joint Inspection | Obsolete without replacement Orig. 1/87 | ||
| IPC-AI-642 | User’s Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB’s | Obsolete without replacement Orig. 10/88 | ||
| IPC-OI-645 | Standard for Visual Optical Inspection Aids | 7-31d | Orig. 10/93 | |
| IPC-TM-650 | Test Methods Manual | Updated per test method | ||
| IPC-ET-652 | Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards | Superseded by IPC-9252 Orig. 10/90 | ||
| IPC-QL-653 | Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material | 7-10c | Rev A 11/97 Orig. 8/88 | 07/89 |
| IPC-MI-660 | Incoming Inspection of Raw Materials Manual | No Longer Maintained* Orig. 2/84 | ||
| IPC-R-700 | Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies | Superseded by IPC-7711A/7721A Rev C 1/88 Rev B 9/77 Rev A 12/71 Orig. 9/67 | ||
| IPC-TA-720 | Technology Assessment Handbook on Laminates | No Longer Maintained* Orig. ’86 | ||
| IPC-TA-721 | Technology Assessment Handbook on Multilayer Boards | No Longer Maintained* Orig. ’88 | ||
| IPC-TA-722 | Technology Assessment of Soldering | No Longer Maintained* Orig. ’90 | ||
| IPC-TA-723 | Technology Assessment Handbook on Surface Mounting | No Longer Maintained* Orig. ’91 | ||
| IPC-TA-724 | Technology Assessment Series on Cleanrooms | No Longer Maintained* Orig. 4/98 | ||
| IPC-PE-740 | Troubleshooting Guide for Printed Board Manufacture and Assembly | 7-23 | No Longer Maintained* PWB Sections superseded by IPC-9121 Rev A 12/97 Orig. 1/85 | |
| IPC-CM-770 | Guidelines for Printed Board Component Mounting | 5-21a | No Longer Maintained* Rev E 1/04 Rev D 1/96 Rev C 1/87 Rev B 10/80 Rev A 3/76 Orig. 9/68 | |
| IPC-SM-780 | Component Packaging and Interconnecting with Emphasis on Surface Mounting | No Longer Maintained* Orig. 3/88 | ||
| IPC-SM-782 | Surface Mount Design and Land Pattern Standard | 1-13 | Superseded by IPC-7351 Rev A Amend 2 4/99 Rev A Amend 1 10/96 Rev A 8/93 Orig. 3/87 | |
| IPC-SM-784 | Guidelines for Chip-on-Board Technology Implementation | No Longer Maintained* Orig. 11/90 | ||
| IPC-SM-785 | Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments | No Longer Maintained* Orig. 11/92 | ||
| IPC-SM-786 | Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs | Superseded by J-STD-020 and J-STD-033 Rev A 1/95 Orig. 12/90 | ||
| IPC-MC-790 | Guidelines for Multichip Module Technology Utilization | Orig. 8/92 | ||
| IPC-S-801 | 5-23a | Superseded by IPC-804 and J-STD-003 | ||
| IPC-S-803 | 5-23a | Superseded by IPC-804 and J-STD-003 | ||
| IPC-S-804 | Solderability Test Methods for Printed Wiring Boards | 5-23a | Superseded by J-STD-003 Rev A 1/87 Orig. 1/82 | |
| IPC-S-805 | Solderability Tests for Component Leads and Terminations | 5-23b | Superseded by J-STD-002 Orig. 1/85 | |
| IPC-MS-810 | Guidelines for High Volume Microsection | No Longer Maintained* Orig. 10/93 | ||
| IPC-S-815 | General Requirements for Soldering Electronic Interconnections | Superseded byJ-STD-001 Rev B 12/87 Rev A 6/81 Orig. 11/77 | ||
| IPC-S-816 | SMT Process Guideline and Checklist | No Longer Maintained* Orig. 7/93 | ||
| IPC-SM-817 | General Requirements for Dielectric Surface Mounting Adhesives | 5-21k | No Longer Maintained* Rev A 12/14 Orig. 11/89 | |
| IPC-SF-818 | General Requirement for Electronic Soldering Fluxes | 5-24a | Superseded by J-STD-004 Rev 12/91 Orig. 2/88 | |
| IPC-SP-819 | General Requirements and Test Methods for Electronic Grade Solder Paste | 5-24b | Superseded by J-STD-005 Orig. 10/88 | |
| IPC-AJ-820 | Assembly and Joining Handbook | 7-35 | No Longer Maintained* Rev A 2/12 Orig. 4/97 | |
| IPC-CA-821 | General Requirements for Thermally Conductive Adhesives | No Longer Maintained* Orig. 1/95 | ||
| IPC-CC-830 | Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies | 5-33a | Rev C 1/19 Rev B Amend 1 10/08 Rev B 8/02 Rev A Amend 1 7/99 Rev A 10/98 Orig. 1/84 | |
| IPC-HDBK-830 | Guidelines for Design, Selection and Application of Conformal Coatings | 5-33c | Rev A 8/13 Orig. 10/02 | |
| IPC-SM-839 | Pre and Post Solder Mask Application Cleaning Guidelines | Superseded by IPC-CH-65 Orig. 4/90 | ||
| IPC-SM-840 | Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials | 5-33b | Rev E 12/10 Rev D 4/07 Rev C Amend 1 6/00 Rev C 1/96 Rev B 5/88 Rev A 7/83 Orig. 11/77 | 08/83 |
| IPC-HDBK-840 | Solder Mask Handbook | Orig. 9/06 | ||
| IPC-HDBK-850 | Guidelines for Design, Selection and Application of Potting and Encapsulation Materials Used for Electronics Printed Circuit Board Assembly | 5-33f | Orig. 7/12 | |
| IPC-H-855 | Hybrid Microcircuit Design Guide | Obsolete without replacement Orig. 10/82 | ||
| IPC-D-859 | Design Standard for Thick Film Multilayer Hybrid Circuits | No Longer Maintained* Orig. 12/89 | ||
| IPC-HM-860 | Specification for Multilayer Hybrid Circuits | No Longer Maintained* Orig. 1/87 | ||
| IPC-TF-870 | Qualification and Performance of Polymer Thick Film Printed Boards | No Longer Maintained* Orig. 11/89 | ||
| IPC-ML-910 | Design and End Production Specification for Rigid Multilayer Printed Boards | D-31b & D-33a | Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IPC-6011 for End Product Specification Rev A 8/76 Orig. 6/68 | |
| IPC-D-949 | Design Standard for Rigid Multilayer Printed Boards | D-31b | Superseded by IPC-D-275 and subsequently by IPC-2221/2222 Orig. 1/87 | |
| IPC-ML-950 | Performance Specification for Rigid Multilayer Printed Boards | D-33a | Superseded by IPC-RB-276 and subsequently IPC-6011/6012 Rev C 11/8 Rev B 12/77 Rev A 9/70 Orig. 1/66 | |
| IPC-ML-960 | Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards | D-33b | No Longer Maintained* Orig. 7/94 | |
| IPC-ML-975 | End Product Documentation Specification for Multilayer Printed Wiring Boards | Superseded by IPC-D-325 Orig. 9/69 | ||
| IPC-ML-990 | Performance Specification for Flexible Multilayer Wiring | D-33a | Superseded by IPC-6011 Orig. 9/72 | |
| IPC-TP-1043 | Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 | No Longer Maintained* Orig. 8/92 | ||
| IPC-TP-1044 | Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 | No Longer Maintained* Orig. 10/92 | ||
| IPC-1065 | Material Declaration Handbook | 4-34a | No Longer Maintained* Orig. 1/05 | |
| IPC-1066 | Labeling of PCBs and Assemblies | 4-34b | Superseded by J-STD-609 Orig. 12/04 | |
| IPC-1071 | Intellectual Property Protection in Printed Board Manufacturing | E-20 | Superseded by IPC-1791 Rev B 5/16 Rev A 7/14 Orig. 1/11 | |
| IPC-1072 | Intellectual Property Protection in Assembly Manufacturing | E-21 | Superseded by IPC-1791 Am 1 3/17 Orig. 2/16 | |
| IPC-WP-1081 | White Paper on Conflict Minerals Due Diligence Guidance | E-30 | No Longer Maintained* Orig. 8/13 | |
| IPC-TP-1090 | The Layman’s Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002 | No Longer Maintained* Orig. 7/96 | ||
| IPC-TP-1103 | Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads | Obsolete without replacement | ||
| IPC-TP-1114 | The Layman’s Guide to Qualifying a Process to J-STD-001B | No Longer Maintained* Orig. 1/98 | ||
| IPC-TP-1115 | Selection and Implementation Strategy for A Low-Residue No-Clean Process | No Longer Maintained* Orig. 12/98 | ||
| IPC-1131 | IT Guidelines for PWB Manufacturers | 2-20 | No Longer Maintained* Orig. 4/00 | |
| IPC-1331 | Voluntary Safety Standard for Electrically Heated Process Equipment | No Longer Maintained* Orig. 3/00 | ||
| IPC-1401 | Corporate Social Responsibility and Sustainability Protocols for Electronic Manufacturing Industry | 4-35CN | Rev. A 11/21 Orig. 3/17 | |
| IPC-1402 | Standard for Green Cleaners Used in Electronics Manufacturing | 5-26A | Orig. 11/22 | |
| IPC-1601 | Printed Board Handling and Storage Guidelines | D-35 | Superseded by IPC-1602 Rev A 6/16 Orig. 8/10 | |
| IPC-1602 | Standard for Printed Board Handling and Storage | D-35 | Rev A 11/24 Orig. 4/20 | |
| IPC-1710 | OEM Standard for Printed Board Manufacturers’ Qualification Profile (MQP) | No Longer Maintained* Rev A 7/04 12/97 updated Orig. 2/94 | ||
| IPC-1720 | Assembly Qualification Profile (AQP) | No Longer Maintained* Rev A 7/04 Orig. 7/96 | ||
| IPC-1730 | Laminator Qualification Profile (LQP) | No Longer Maintained* Rev A 6/00 Orig. 1/98 | ||
| IPC-1731 | Strategic Raw Materials Supplier Qualification Profile | 3-12i | No Longer Maintained* Orig. 6/00 | |
| IPC-1751 | Generic Requirements for Declaration Process Management | 2-18a | No Longer Maintained* Rev A w/Amend 1 12/12 Rev A 2/10 Vers. 1.1 3/07 Orig. 3/06 | |
| IPC-1752 | Materials Declaration Management | 2-18b | Rev B 7/20 Rev A. w/Amend 1&2 2/14 Rev A w/Amend 1 12/12 Rev A 2/10 Vers. 1.1 3/07 Orig. 3/06 | |
| IPC-1753 | Laboratory Report Standard | 2-18j | Am 1 5/18 Orig. 2/14 | |
| IPC-1754 | Materials and Substances Declaration for Aerospace and Defense and Other Industries | 2-18k | Am 2 6/20 w/Amend 1 3/19 Orig 6/18 | |
| IPC-1755 | Conflict Minerals Data Exchange Standard | 2-18h | Rev. A w/am1 10/21 Rev A 5/20 w/Amend 1&2 4/17 Am 1 4/15 Orig. 4/14 | |
| IPC-1756 | Manufacturing Process Data Management | No Longer Maintained* Orig. 4/10 | ||
| IPC-1758 | Declaration Requirements for Shipping, Pack and Packing Materials | No Longer Maintained* Orig. 3/12 | ||
| IPC-1782 | Standard for Manufacturing and Supply Chain Traceability of Electronic Products | 2-19a | Rev B 10/23 Rev A 11/20 Orig. 11/16 | 04/21 |
| IPC-1791 | Trusted Electronic Designer, Manufacturer, and Assembler Requirements | 2-19b | Rev D 11/23 Rev C 3/23 Rev B 8/21 Am 1 3/19 Orig. 9/18 Supersedes IPC-1071 and IPC-1072 | |
| IPC-1792 | Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain | 2-12C | Orig. 11/22 | |
| IPC-2141 | Controlled Impedance Circuit Boards and High Speed Logic Design | D-21c | No Longer Maintained* Rev A 3/04 Amend 1 2/99 Orig. 4/96 | 12/09 |
| IPC-2152 | Standard for Determining Current Carrying Capacity in Printed Board Design | 1-10b | No Longer Maintained* Orig. 8/09 | 02/11 |
| IPC-2221 | Generic Standard on Printed Board Design | D-31b | Rev C 12/23 Rev B 11/12 Rev A 5/03 Amend 1 1/00 Orig. 2/98 Supersedes IPC-D-275 | 09/99 |
| IPC-2222 | Sectional Design Standard for Rigid Organic Printed Boards | D-31b | Rev B 10/20 Rev A 12/10 Orig. 2/98 Supersedes IPC-D-275 | |
| IPC-2223 | Sectional Design Standard for Flexible Printed Boards | D-11 | Rev E 1/20 Rev D 9/16 Rev C 11/11 Rev B 5/08 Rev A 6/04 Orig. 11/98 Supersedes IPC-D-249 | 09/99 |
| IPC-2224 | Sectional Standard for Design of PWBs for PC Cards | 1-21 | Obsolete Orig. 1/98 | |
| IPC-2225 | Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies | D-31c | No Longer Maintained* Orig. 5/98 | |
| IPC-2226 | Sectional Design Standard for High Density Interconnect (HDI) Printed Boards | D-31b | No Longer Maintained* Rev A 9/17 Orig. 4/03 | 03/09 |
| IPC-2228 | Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards | D-21 | Orig. 10/22 Supercedes IPC-2252 | |
| IPC-2231 | DFX Guidelines | 1-14 | Rev. A 10/21 Orig. 5/19 | |
| IPC-2251 | Design Guide for the Packaging of High Speed Electronic Circuits | D-21a | No Longer Maintained* Orig. 12/03 | 08/09 |
| IPC-2252 | Design and Manufacturing Guide for RF/Microwave Circuit Boards | D-21b | Superceded by IPC-2228 10/22 Orig. 7/02 | |
| IPC/JPCA-2291 | Design Guideline for Printed Electronics | D-61 | No Longer Maintained* Orig. 7/13 | |
| IPC-2292 | Design Standard for Printed Electronics on Flexible Substrates | D-61 | No Longer Maintained* Orig. 3/18 | |
| IPC-2294 | Design Standard for Printed Electronics on Rigid Substrates | D-61B | Orig. 6/24 | |
| IPC/JPCA-2315 | Design Guide for High Density Interconnects (HDI) and Microvia | D-41a | No Longer Maintained* Orig. 6/00 | |
| IPC-2316 | Design Guide for Embedded Passive Device Printed Boards | D-37a | No Longer Maintained* Orig. 3/07 | |
| IPC-2501 | Definition for Web-based Exchange of XML Data | 2-50 | No Longer Maintained* Orig. 7/03 | |
| IPC-2511 | Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology | 2-11 | No Longer Maintained* ev B 1/02 Rev A 1/00 Orig. 1 1/98 | |
| IPC-2512 | Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description | 2-11 | No Longer Maintained* Rev A 11/00 Orig. 11/98 | |
| IPC-2513 | Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description | 2-11 | No Longer Maintained* Rev A 11/00 | |
| IPC-2514 | Sectional Requirements for Implementation of Printed Board Manufacturing Data Description | 2-11 | No Longer Maintained* Rev A 11/00 | |
| IPC-2515 | Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description | 2-11 | No Longer Maintained* Rev A 11/00 | |
| IPC-2516 | Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description | 2-11 | No Longer Maintained* Rev A 11/00 | |
| IPC-2517 | Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description | 2-11 | No Longer Maintained* Rev A 11/00 | |
| IPC-2518 | Sectional Requirements for Implementation of Part List Product Data Description | 2-11 | No Longer Maintained* Rev A 11/00 | |
| IPC-2524 | PWB Fabrication Data Quality Rating System | 2-10 | No Longer Maintained* Orig. 2/99 | |
| IPC-2531 | Standard Recipe File Format Specification | 2-12 | No Longer Maintained* Orig. 3/99 | |
| IPC-2541 | Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication | 2-13a | No Longer Maintained* Orig. 10/01 | |
| IPC-2546 | Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication | 2-13b | No Longer Maintained* Amend 2 1/05 Amend 1 1/03 Orig. 10/01 | |
| IPC-2547 | Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication | 2-13c | No Longer Maintained* Orig. 1/02 | |
| IPC-2551 | International Standard for Digital Twins | 2-12a | Orig. 12/20 | |
| IPC/DAC-2552 | General Electronic Components Model Based Definition (MBD) Standard | 2-12b | Orig. 1/22 | |
| IPC-2571 | Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX) | 2-15a | No Longer Maintained* Orig. 11/01 | |
| IPC-2576 | Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Exchange (PDX) | 2-15c | No Longer Maintained* Orig. 11/01 | |
| IPC-2578 | Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX) | 2-15e | No Longer Maintained* Orig. 11/01 | |
| IPC-2581 | Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology | 2-16 | Rev C 11/20 Rev B Am 1 1/17 Rev B 9/13 Rev A 5/12 Amend 1 5/07 Orig. 3/04 | |
| IPC-2582 | Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description | 2-17 | No Longer Maintained* Orig. 5/07 | |
| IPC-2583 | Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description | 2-17 | No Longer Maintained* Orig. 5/07 | |
| IPC-2584 | Sectional Requirements for Implementation of Printed Board Fabrication Data Description | 2-17 | No Longer Maintained* Orig. 5/07 | |
| IPC-2588 | Sectional Requirements for Implementation of Part List Product Data Description | 2-17 | No Longer Maintained* Orig. 5/07 | |
| IPC-2591 | Connected Factory Exchange (CFX) | 2-17 | Ver 2.0 3/25 Ver 1.7 8/23 Ver 1.6 3/23 Ver 1.5 7/22 Ver 1.4 1/22 Ver 1.3 2/21 Ver 1.2 9/20 Ver 1.1 1/20 Orig. 4/19 | |
| IPC-2611 | Generic Requirements for Electronic Product Documentation | 2-40 | No Longer Maintained* Orig. 4/10 | |
| IPC-2612 | Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) | 2-40 | No Longer Maintained* Orig. 4/10 | |
| IPC-2612-1 | Sectional Requirements for Electronic Diagramming Symbol Generation Methodology | 2-40 | No Longer Maintained* Orig. 4/10 | |
| IPC-2614 | Sectional Requirements for Board Fabrication Documentation | 2-40 | No Longer Maintained* Orig. 4/10 | |
| IPC-2615 | Printed Board Dimensions and Tolerances | 1-10a | No Longer Maintained* Orig. 7/00 Supersedes IPC-D-300 | 11/10 |
| IPC/PERM-2901 | Pb-free Design & Assembly Implementation Guide | No Longer Maintained* Orig. 2/18 | ||
| IPC-3406 | Guidelines for Electrically Conductive Surface Mount Adhesives | 5-24d | No Longer Maintained* Orig. 7/96 | |
| IPC-3408 | General Requirements for Anistropically Conductive Adhesive Films | 5-24d | No Longer Maintained* Orig. 11/96 | |
| IPC-4101 | Specification for Base Materials for Rigid and Multilayer Printed Boards | 3-11 | Rev E WAM1 4/22 Rev E 4/17 Rev D WAM 1 8/15 Rev D 4/14 Rev C 8/09 Rev B Amends 1&2 4/07 Rev B Amend 1 2/07 Rev B 6/06 Rev A Amend 1 6/02 Rev A 6/02 Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115 Orig. 12/97 | |
| IPC-4103 | Specification for Base Materials for High Speed/ High Frequency Applications | D-23 | No Longer Maintained* Rev B 11/17 Rev A Amend 1 3/14 Rev A 12/11 Orig. 1/02 Supersedes IPC-L-125 | |
| IPC/JPCA-4104 | Specification for High Density Interconnect (HDI) and Microvia Materials | D-42a | No Longer Maintained* Orig. 5/99 | |
| IPC-4110 | Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards | 3-12g | No Longer Maintained* Orig. 8/98 | |
| IPC-4121 | Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications | 3-11c | No Longer Maintained* Orig. 1/00 Supersedes IPC-CC-110 | |
| IPC-4130 | Specification and Characterization Methods for Nonwoven “E” Glass Mat | 3-12f | No Longer Maintained* Orig. 9/98 | |
| IPC-4202 | Specification for Flexible Base Dielectrics for use in Flexible Printed Boards | D-13 | Rev C 01/22 Rev B 12/16 Rev A 4/10 Orig. 5/02 Supersedes IPC-FC-231C | 02/03 |
| IPC-4203 | Adhesive Coated Dielectric Films for Use as Cover Sheets | D-13 | Rev B 5/18 Rev A Am1 10/14 Rev A 1/13 Orig. 5/02 Supersedes IPC-FC-232C | 02/03 |
| IPC-4204 | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards | D-13 | Rev B 9/18 Rev A Amend 1 2/14 Rev A 10/11 Orig. 5/02 Supersedes IPC-FC-241C | 02/03 |
| IPC-4411 | Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement | 3-12b | No Longer Maintained* Rev A 11/03 Orig. 4/99 | |
| IPC-4412 | Specification for Finished Fabric Woven form “E” Glass for Printed Boards | 3-12d | Rev C 9/21 Rev B Am3 12/18 Rev B Am2 5/18 Rev B 5/13 Rev A w/Amends 1, 2 & 3 7/11 Rev A Amend 3 12/10 Rev A Amend 2 5/09 Rev A Amend 1 3/08 Rev A 1/06 Orig. 6/02 Supersedes IPC-EG-140 | 02/03 |
| IPC-4552 | Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards | 4-14 | Rev B 5/21 Rev A 8/17 w/Amend 1&2 12/12 w/Amend 1 6/12 Orig. 10/02 | |
| IPC-4553 | Specification for Immersion Silver Plating for Printed Circuit Boards | 4-14 | No Longer Maintained* Rev A 5/09 Orig. 6/05 | |
| IPC-4554 | Specification for Immersion Tin Plating for Printed Circuit Boards | 4-14 | No Longer Maintained* Amend 1 9/11 Orig. 2/07 | |
| IPC-4555 | Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards | 4-14e | Orig. 4/22 | |
| IPC-4556 | Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards | 4-14 | Amend 1 1/16 Orig. 1/13 | |
| IPC-4562 | Metal Foil for Printed Wiring Applications | 3-12a | Rev B 10/23 Rev A WAM1 3/16 Rev A 4/08 Amend 1 5/05 Orig. 5/00 Supersedes IPC-MF-150F | 02/03 |
| IPC-4563 | Resin Coated Copper Foil for Printed Boards Guideline | 3-12c | No Longer Maintained* Orig. 11/07 Supercedes CF-148A | |
| IPC/JPCA-4591 | Requirements for Printed Electronics Functional Conductive Materials | D-63 | No Longer Maintained* Rev A 2/18 Orig. 12/12 | |
| IPC-4592 | Requirements for Printed Electronics Functional Dielectric Materials | D-63a | Orig. 8/22 | |
| IPC-HDBK-4691 | Handbook on Adhesive Bonding in Electronic Assembly Operations | 5-11c | No Longer Maintained* Orig. 1/16 | |
| IPC-4761 | Design Guide for Protection of Printed Board Via Structures | D-33d | No Longer Maintained* Orig. 7/06 | |
| IPC-4781 | Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks | 5-33e | No Longer Maintained* Orig. 5/08 | |
| IPC-4811 | Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards | D-52 | No Longer Maintained* Orig. 4/08 | |
| IPC-4821 | Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards | D-52 | No Longer Maintained* Amend 1 4/10 Orig. 5/06 | |
| IPC-4921 | Requirements for Printed Electronics Base Materials | D-62 | No Longer Maintained* Rev A 6/17 Orig. 6/12 | |
| IPC-4922 | Requirements for Sintering Materials for Electronics Assembly | 5-21P | Orig. 1/24 | |
| IPC-5262 | Design, Critical Process and Acceptance Requirements for Polymeric Applications | 5-24G | Orig. 7/22 | |
| IPC-5701 | Users Guide for Cleanliness of Unpopulated Printed Boards | 5-32c | No Longer Maintained* Orig. 7/03 | |
| IPC-5702 | Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards | 5-32c | No Longer Maintained* Orig. 6/07 | |
| IPC-5703 | Cleanliness Guidelines for Printed Board Fabricators | 5-32c | No Longer Maintained* Orig. 5/13 | |
| IPC-5704 | Cleanliness Requirements for Unpopulated Printed Boards | 5-32c | No Longer Maintained* Orig. 12/09 | |
| IPC-6011 | Generic Performance Specification for Printed Boards | D-33a | Rev. A 2/25 Orig. 7/96 | |
| IPC-6012 | Qualification and Performance Specification for Rigid Printed Boards | D-33a | Rev F 9/23 Rev E Amend 1 4/22 Rev E 2/20 Rev D Amend 1 10/17 Rev D 09/15 Rev C 4/10 Rev B Amend 2 3/08 Rev B with Amend 1 2/07 Rev B 8/04 Rev A Amend 1 7/00 Rev A 10/99 Orig. 7/96 | |
| IPC-6012xA | Automotive Applications Addendum to IPC-6012 Qualification and Performance Specification for Rigid Printed Boards | D-33aa | Rev EA 3/22 Rev DA WAM 1 11/18 Rev DA 5/16 | |
| IPC-6012xS | Space and Military Applications Addendum to IPC-6012 Qualification and Performance Specification for Rigid Printed Boards | Rev FS 2/24 Rev ES 4/20 Rev DS 09/15 | ||
| IPC-6012xM | Medical Applications Addendum to IPC-6012 Qualification and Performance Specification for Rigid Printed Boards | D-33AM | Rev EM 8/20 | |
| IPC-6012C-TC | Test Coupon Addendum to IPC-6012C Qualification and Performance Specification for Rigid Printed Boards | D-33ac | No Longer Maintained* Orig. 8/13 | |
| IPC-6013 | Qualification and Performance Specification for Flexible Printed Boards | D-12 | Rev E 9/21 Rev D Am 1 5/18 Rev D 9/17 Rev C 12/13 Rev B 1/09 Rev A with Amend 2 4/06 Rev A Amend 1 1/05 Rev A 11/03 Supersedes IPC-RF-245 and IPC-FC-250 Amend 1 4/00 Orig. 11/98 | |
| IPC-6013xM | Medical Applications Addendum to IPC-6013 Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Electronics. The addendum MUST be used with the same revision of the standard. | D-33am | Rev EM 3/22 | |
| IPC-6015 | Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures | D-33e | No Longer Maintained* Orig. 2/98 | |
| IPC-6016 | Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards | D-10 | Superseded by IPC-6012, IPC-6013 and/or IPC-6018 Orig. 5/99 | |
| IPC-6017 | Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices | D-53 | Rev A 08/21 Orig. 3/09 | |
| IPC-6018 | Qualification and Performance Specification for High Frequency (Microwave) Printed Boards | D-22 | Rev D 2/22 Rev C 7/16 Rev B 11/11 Rev A 1/02 Orig. 1/98 | |
| IPC-6018xS | Space and Military Avionics Applications Addendum to IPC-6018, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards. The addendum MUST be used with the same revision of the standard. | D-22 | Rev. DS 8/22 | |
| IPC/JPCA-6202 | Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards | D-14 | No Longer Maintained* Orig. 2/99 | |
| IPC/JPCA-6801 | Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection | D-40 | No Longer Maintained* Orig. 1/00 | |
| IPC/JPCA-6901 | Application Categories for Printed Electronics | D-64 | No Longer Maintained* Orig. 8/15 | |
| IPC-6902 | Qualification and Performance Specification for Printed Electronics on Flexible Substrates | D-64 | Orig. 2/21 | |
| IPC-6903 | Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) | D-64a | No Longer Maintained* Rev A 3/18 Orig. 10/15 | |
| IPC-6904 | Qualification and Performance Specifications for Printed Electronics on Rigid Substrates | D-64B | Orig. 6/24 | |
| IPC-7091 | Design and Assembly Process Implementation of 3D Components | Rev A 1/23 Orig. 9/17 | ||
| IPC-7092 | Design and Assembly Process Implementation for Embedded Components | D-55A | Rev A 11/22 Orig. 2/15 | |
| IPC-7093 | Design and Assembly Process Implementation for Bottom Termination SMT Components | 5-21h | Rev A 10/20 Orig. 3/11 | |
| IPC-7094 | Design and Assembly Process Implementation for Flip Chip and Die Size Components | 5-21g | No Longer Maintained* Rev A 3/18 Orig. 1/09 | |
| IPC-7095 | Design and Assembly Process Implementation for BGAs | 5-21f | Rev E 9/24 AM 1 6/19 Rev D 3/18 Rev C 1/13 Rev B 3/08 Rev A 11/04 Orig. 8/00 | |
| IPC-7351 | Generic Requirements for Surface Mount Design and Land Pattern Standard | 1-13 | No Longer Maintained* Rev B 6/10 Rev A 2/07 Supersedes IPC-SM-782A w/Amend1&2 Orig. 2/05 | |
| IPC-7352 | Generic Guideline for Land Pattern Design | 1-13 | Orig. 7/23 | |
| IPC-7525 | Guidelines for Stencil Design | 5-21e | Rev C 11/21 Rev B 10/11 Rev A 2/07 Orig. 5/00 | |
| IPC-7526 | Stencil and Misprinted Board Cleaning Handbook | 5-31g | Rev. A 3/22 Orig. 2/07 | |
| IPC-7527 | Requirements for Solder Paste Printing | 5-21jND | Orig. 5/12 | |
| IPC-7530 | Guidelines for Temperature Profiling for Mass Soldering Processes (Wave and Reflow) | 5-22h | Rev B 1/25 Rev A 4/17 Orig. 5/01 | |
| IPC-7535 | Solder Dross Reduction in Wave Soldering Process | 5-22jcn | No Longer Maintained* Orig. 2/17 | |
| IPC-7621 | Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics | Orig. 3/18 | ||
| IPC-7711/21 | Rework, Modification and Repair of Electronic Assemblies | 7-34 | Rev D 1/24 Am 1 7/20 Rev C 1/17 Rev B 11/07 Rev A 10/03 Orig. 4/98 Supersedes IPC-R-700C | |
| IPC-7801 | Reflow Oven Process Control Standard | 5-45 | Rev A 8/22 Orig. 4/15 | |
| IPC-7912 | Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies | 5-22g | No Longer Maintained* Rev A 1/04 Orig. 7/00 | |
| IPC-8413-1 | Specification for Manufacturing Process Carriers for Handling Optical Fiber | 5-25a | No Longer Maintained* Orig. 4/03 | |
| IPC-8497-1 | Cleaning Methods and Contamination Assessment for Optical Assembly | 5-25e | No Longer Maintained* Orig. 12/05 | |
| IPC-8701 | Final Acceptance Criteria Standard for PV Modules-Final Module Assembly | E-15 | No Longer Maintained* Orig. 7/14 | |
| IPC-8921 | Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires | D-72 | Orig. 10/19 | |
| IPC-8952 | Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles | D-73A | Orig. 12/22 | |
| IPC-8971 | Requirements for Electrical Testing of Printed Electronics on E-Textiles | D-74A | Orig. 11/22 | |
| IPC-9111 | Troubleshooting for Printed Board Assembly Processes | 7-23 | Orig. 1/19 | |
| IPC-9121 | Troubleshooting for Printed Board Fabrication Processes | 7-24 | Rev A 2/22 Am 2 9/19 Am 1 5/18 Orig. 3/16 Supersedes PWB sections of IPC-PE-740 | |
| IPC-9151 | Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database | D-36 | Withdrawn 7/24 Rev D 5/12 Rev C 5/10 Rev B 2/07 Rev A 5/03 Orig. 6/02 | |
| IPC-9191 | General Guideline for implementation of Statistical Process Control (SPC) | 7-22 | No Longer Maintained* Orig. 11/99 Supersedes IPC-PC-90 | 02/03 |
| IPC-9194 | Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline | 7-22 | No Longer Maintained* Orig. 9/04 | |
| IPC-9199 | SPC Quality Rating | 7-22 | No Longer Maintained* Orig. 9/02 | |
| IPC-9201 | Surface Insulation Resistance Handbook | 5-32b | No Longer Maintained* Rev A 8/07 Orig. 7/96 | |
| IPC-9202 | Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance | 5-32b | Rev A 10/22 Orig. 10/11 | |
| IPC-9203 | Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle | 5-32b | Rev A 11/22 Orig. 5/12 | |
| IPC-9204 | Standard Only: Guideline on Flexibility and Stretchability Testing for Printed Electronics | D-65 | Orig. 2/17 | |
| IPC-9241 | Guidelines for Microsection Preparation | 7-12 | No Longer Maintained* Orig. 1/17 | |
| IPC-9251 | Test Vehicles for Evaluating Fine Line Capability | Obsolete without replacement Orig. 7/00 | ||
| IPC-9252 | Requirements for Electrical Testing of Unpopulated Printed Boards | 7-32c | No Longer Maintained* Rev B 9/16 Rev A Amend 1 10/12 Rev A 11/08 Orig. 2/01 Supersedes IPC-ET-652A | 04/09 |
| IPC-9257 | Requirements for Electrical Testing of Flexible Printed Electronics | D-65a | Orig. 2/21 | |
| IPC-9261 | In-Process DPMO and Estimated Yield for PWAs | 5-22g | No Longer Maintained* Rev A 10/06 Orig. 3/02 | |
| IPC-9262 | Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment | 7-32CN | No Longer Maintained* Orig. 2/17 | |
| IPC/JEDEC-9301 | Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability | 6-10D | Orig. 1/19 | |
| IPC-9501 | PWB Assembly Process Simulation for Evaluation of Electronic Components | 5-21c | No Longer Maintained* Orig. 7/95 | |
| IPC-9502 | PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components | 5-21c | No Longer Maintained* Orig. 4/99 | |
| IPC-9503 | Moisture Sensitivity Classification for Non-IC Components | Superseded by J-STD-075 8/08 Orig. 4/99 | ||
| IPC-9504 | Assembly Process Simulation for Evaluation of Non-IC Components | 5-21c | No Longer Maintained* Orig. 6/98 | |
| IPC-9505 | Guideline Methodology for Assessing Component and Cleaning Materials Compatibility | 5-31j | No Longer Maintained* Orig. 10/17 | |
| IPC-9591 | Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices | 9-81 | No Longer Maintained* Orig. 4/06 | |
| IPC-9592 | Requirements for Power Conversion Devices for the Computer and Telecommunications Industries | 9-81 | No Longer Maintained* Rev B 1/13 Rev A 5/10 Orig. 9/08 | |
| IPC-9631 | User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation | D-32 | No Longer Maintained* Orig. 12/10 | |
| IPC-9641 | High Temperature Printed Board Flatness Guideline | 6-11 | No Longer Maintained* Orig. 6/13 | |
| IPC-9691 | User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) | 5-32e | No Longer Maintained* Rev B 9/16 Rev A 8/07 Orig. 10/05 | |
| IPC-9701 | Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments (Formerly: Qualification and Performance Test Methods for Surface Mount Solder Attachments) | 6-10d | Rev B 2/22 Rev A 2/06 Orig. 1/02 | |
| IPC/JEDEC-9702 | Monotonic Bend Characterization of Board-Level Interconnects | 6-10d | No Longer Maintained* w/Am 1 8/15 Orig. 6/04 | |
| IPC/JEDEC-9703 | Mechanical Shock Test Guidelines for Solder Joint Reliability | 6-10d | No Longer Maintained* Orig. 3/09 | |
| IPC/JEDEC-9704 | Printed Circuit Assembly Strain Gage Test Guideline | 6-10d | No Longer Maintained* Rev A 2/12 Orig. 6/05 | |
| IPC/JEDEC-9706 | Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection | 6-10d | No Longer Maintained* Orig. 1/14 | |
| IPC/JEDEC-9707 | Spherical Bend Test Method for Characterization of Board Level Interconnects | 6-10d | No Longer Maintained* Am 1 5/18 Orig. 9/11 | |
| IPC-9708 | Test Methods for Characterization of Printed Board Assembly Pad Cratering | 6-10d | No Longer Maintained* Orig. 12/10 | |
| IPC-9709 | Test Guidelines for Acoustic Emission Measurement during Mechanical Test | 6-10d | Rev A 11/21 Orig. 12/13 | |
| IPC-9797 | Press-fit Standard for Automotive Requirements and other High-Reliability Applications | 5-21M | Rev A 5/23 Orig. 6/20 | |
| IPC-HDBK-9798 | Handbook for Press-fit Standard for Automotive Requirements and Other High-Reliability Applications | 5-21n | Orig. 4/22 | |
| IPC-9850 | Surface Mount Equipment Performance Characterization | No Longer Maintained* Rev A 11/11 Orig. 7/02 | ||
| IPC-SMEMA-9851 | Equipment Interface Specification | No Longer Maintained* Orig. 11/04 | ||
| IPC-HERMES-9852 | The Global Standard for Machine-to-Machine Communication in SMT Assembly | Ver 1.6 7/24 Ver 1.5 11/22 Ver 1.4 2/22 Orig. 6/19 | ||
| IPC-QRG-PTH (Prev: IPC-DRM-PTH, IPC-DRM-40) | Through-Hole Solder Joint Evaluation Desk Reference Manual
| Rev H 9/21 Rev G 2/18 Rev F 5/15 Rev E 7/10 Rev D (2nd print) 11/08 Rev D 11/05 Renamed to DRM-PTH Rev E 2/02 Rev D 7/00 Rev C 9/99 Rev B 1/99 Rev A 8/97 Orig. 5/97 | ||
| IPC-QRG-SMT (Prev: IPC-DRM-SMT) | Surface Mount Solder Joint Evaluation Desk Reference Manual | Rev H 3/22 Rev G 2/18 Rev F 5/15 Rev E 8/10 Rev D 12/05 Rev C 10/01 Rev B 4/00 Rev A 3/99 Orig. 7/98 | ||
| IPC-DRM-WHA (IPC-DRM-56) | Wire Preparation & Crimping | Rev D 2/22 Rev C 6/17 Rev B 3/13 Rev A 11/06 Renamed DRM-WHA Orig. 7/02 | ||
| IPC-EMSI-TC | IPC Sample Master Ordering Agreement for EMS Companies and OEMs | No Longer Maintained* Orig. 3/02 | ||
| Roadmap | International Technology Roadmap for Electronic Interconnections | 8-40 | No Longer Maintained* Updated 2015 Updated 2013 Updated 2011 Updated 2009 Updated 2007 Updated 2005 Updated 2003 Updated 2001 Updated 9/97 Orig. 6/95 |
*"No Longer Maintained" - Indicates that the document is not expected to be in revision at this time. Documents may be taken out of this status in the future if a committee decides to revise or reaffirm the document.