IPC Document Revision Table

IPC has hundreds of standards, guidelines, handbooks, and tools to help you build electronics better

All of IPC's current and historical documents are catalogued below. If you do not see the document that you're looking for, make sure to check the 'obsolete and superseded documents' tab at the bottom of the page. 

If you have any questions, please contact answers@ipc.org

The following table was updated in February 2020.

Product ID Document Name Responsible Committee Status DoD
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies  5-22a Rev H  9/20
Rev G Am1  10/18
Rev G 10/17
Rev F WAM1  2/16
Rev F Am 1  12/15
Rev F 08/14
Rev E  4/10
Rev D Amend 1  4/08
Rev D 2/05
Rev C 3/00
Rev B 10/96
Rev A 1/95
Orig. 4/92; Supersedes IPC-S-815
07/01
J-STD-001xA/A-610xA Automotive Addendum Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
The addendum MUST be used with the same version of the standard; e.g. 001G/A-610G
  Rev GA  2/20  
J-STD-001xS Space Hardware Addendum Space Applications Electronic Hardware Addendum for J-STD-001. The addendum MUST be used with the same version of the standard; e.g. 001CS with 001C, 001DS with 001D, 001ES with 001E 5-22as GS Amend 1  3/20
GS  4/18
FS Am1 2/17
FS 02/15
ES 12/10
DS Amend 1 9/09
DS 11/06
CS 1/04 
 
IPC-HDBK-001 Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies  5-22f Rev F  2/16
Rev E  2/12
Amend 2  10/05
Amend 1  12/00
Orig. 3/98
07/01
SMC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology    Orig. 1/89  
IT-WP-001 Myths of E-Commerce    Orig. 9/00  
SMC-WP-001 Soldering Capability White Paper Report    Orig. 8/91  
SMEMA 1.2 Mechanical Equipment Interface Standard   Update IPC-SMEMA-9851   
JP002 Current Tin Whiskers Theory and Mitigation Practices Guideline 5-23e Orig.  3/06  
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires  5-23b Rev D 6/13
Rev C Amend 1 10/08
Rev C 12/07
Rev B  2/03
Rev A 10/98
Orig. 4/92; Supersedes IPC-S-805
05/95
SMC-WP-002 An Assessment of the Use of Lead in Electronic Assembly    Obsolete without replacement
Orig. 8/92
 
J-STD-003 Solderability Tests for Printed Boards  5-23a Rev C WAM 1&2  9/17
Rev C Amend 1 9/14
Rev C 9/13
Rev B  2/07
Rev A  2/03
Original 4/92; Supersedes IPC-S-804
01/04
SMC-WP-003 Chip Mounting Technology    Orig. 8/93  
SMEMA 3.1 Fiducial Mark Standard       
J-STD-004 Requirements for Soldering Fluxes  5-24a Rev B. Amend 1 – 11/11
Rev B 12/08
Rev A  1/04
Orig. 1/95; Supersedes IPC-SF-818
05/95
SMC-WP-004 Design for Success    Orig. 4/97  
SMEMA 4 Reflow Terms and Definitions       
J-STD-005 Requirements for Soldering Pastes  5-24b Rev A 2/12
Amend 1  6/96
Orig. 1/95; Supersedes IPC-SP-819
05/95
SMC-WP-005 PWB Surface Finishes    Orig. 4/97  
IPC-HDBK-005 Guide to Solder Paste Assessment 5-24b Orig. 1/06  
SMEMA 5 Screen Printing Terms and Definitions       
J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications  5-24c Rev C Amend 1  11/17
Rev C 7/13
Rev B Amends 1 & 2 10/09
Rev B Amend 1  6/08
Rev B  1/06
Rev A  5/01
Amend 1  7/96
Orig. 1/95
05/95
IPC-WP-006 Round Robin Testing & Analysis: Lead-Free Alloys, Tin, Silver, & Copper SPVC Orig. 8/03  
SMEMA 6 Electronics Cleaning Terms and Definitions       
SMEMA 7 Fluid Dispensing Terms and Definitions       
         
IPC-WP-008 Setting up Ion Chromatography Capability 5-30 Orig. 12/05  
IPC-WP-010 A Summary of Fungus Resistance Test Methods 5-30    
J-STD-012 Implementation of Flip Chip and Chip Scale Technology  5-21g Superseded by IPC-7094    10/13
Orig. 1/96
 
IPC-WP-012 Pb-free Electronics Risk Management (PERM) Council Pb-free Research Priorities  8-81D Orig. 5/14  
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology  5-21f Superseded by IPC-7095   10/13
Orig. 7/96
 
IPC-WP-013 Analytical Procedures for Portable Lead-Free Alloy Test Data SPVC Orig. 5/14  
IPC-WP-014 Pb-free Electronics Risk Management (PERM) Council Position on the use of Pb-free Electronics in the Aerospace, Defense and High Performance Electronic Industries Aug-81 Rev A 3/20
Orig. 7/14
 
IPC-WP-015 Pb-free Electronics Risk Management (PERM) Council Pb-free Rebaseline Aug-81 Orig. 4/14  
IPC-WP-016 PC Round Robin Study -Conformal Coatings
Moisture and Insulation Resistance and Dielectric Withstanding Voltage
  Orig. 2/13  
IPC-WP-017 What Conformal Coaters Wish Designers Knew About Coatings   Orig. 10/15  
IPC-DRM-18 Component Identification Desk Reference Manual    Rev J  2/18
Rev H 11/07
Rev G 9/03
Rev F 8/01
Rev E 8/00
Rev D 7/99
Rev C 7/98
Rev B 2/97
Rev A 4/96
Orig. 9/95
 
IPC-WP-019 An Overview on Global Change in Ionic Cleanliness Requirements   Rev B  9/20
Rev A  9/18
Orig. 8/17
 
J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices  B-10a Rev E 2/15
Rev D Amend 1  3/08
Rev D  8/07
Rev C 7/04
Rev B 7/02
Rev A 4/99
Orig. 10/96
 
IPC/PERM-WP-022 Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report 8-81F Orig. 8/18  
IPC-WP-023 IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance: Via Chain Continuity Reflow Test: The Hidden Reliability Threat – Weak Microvia Interface V-TSL Orig. 5/19  
IPC-WP-024 Smart Textiles Reliability Following Laundering D-70 Orig. 8/18  
IPC-WP-025 A Framework for the Engineering and Design of E-Textiles D-70 Orig. 4/19  
J-STD-026 Semiconductor Design Standard for Flip Chip Applications  5-21g Orig. 8/99  
IPC-WP-026 IPC Technology Solutions White Paper on Blockchain and the Electronics Industry: A review of the current state of the blockchain technology and its potential applications in electronics manufacturing V-TSL Orig. 9/19  
J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations  5-21g Orig.  2/03  
J-STD-028 Performance Standard for Flip Chip Scale Bumps  5-21g Orig. 8/99  
J-STD-030 Selection and Application of Board Level Underfill Materials 5-24f Rev A 3/14
Orig. 9/05
 
J-STD-032 Performance Standard for Ball Grid Array Bumps and Columns  5-21f Orig. 6/02  
J-STD-033 Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices  B-10a Rev D  5/18
Rev C Amend 1  8/14
Rev C 2/12
Rev B Amend 1  1/07
Rev B 10/05
Rev A 7/02
Orig. 4/99
 
J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components  B-10a Orig. 4/99  
IPC-0040 Optoelectronic Assembly and Packaging Technology   5-25 Orig. 5/03  
J-STD-046 Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers (revision of JESD46D)
Joint JEDEC/IPC/ECIA 
2-15f Orig. 11/16  
J-STD-048 Notification Standard for Product Discontinuance 2-15f Orig. 5/15  
IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits  2-30 Rev M 6/15
Rev K 7/13
Rev J 10/11
Rev I Skipped Due to Conflict with “L” and “1”
Rev H  7/08
Rev G 12/03
Rev F 6/96
Rev E 7/92
Rev D 11/88
Rev C 3/85
Rev B 6/80
Rev A 8/76
Orig. 8/75
09/80
IPC-DRM-53 Introduction to Electronics Assembly    Orig. 6/00  
IPC-SC-60 Post Solder Solvent Cleaning Handbook  5-31a Superseded and combined into CH-65B 5/11
Rev A 8/99
Orig. 4/87
 
IPC-SA-61 Post-Solder Semi-Aqueous Cleaning Handbook  5-31b Superseded and combined into CH-65B 5/11
Rev A 6/02
Orig. 7/95
 
IPC-AC-62 Post Solder Aqueous Cleaning Handbook  5-31b Superseded and combined into CH-65B 5/11
Rev A 1/96
Orig. 12/86
 
IPC-CH-65 Guidelines for Cleaning of Printed Boards and Assemblies  5-31d Rev B 7/11
Rev A 9/99
Orig. 12/90
 
IPC-CS-70 Guidelines for Chemical Handling Safety in Printed Board Manufacturing    Obsolete without replacement
Orig. 8/88
 
J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes B-10a Orig. 8/08  
IPC-CM-78 Guidelines for Surface Mounting and Interconnecting Chip Carriers    Superseded by IPC-SM-780
Rev C – 3/88
Orig. 11/83
 
IPC-MP-83 IPC Policy on Metrication    Obsolete without replacement
Orig. 8/85 
 
IPC-PC-90 General Requirements for Implementation of Statistical Process Control  7-22 Superseded by IPC-9191
Orig. 10/90
W02/03
IPC-QS-95 General Requirements for Implementation of ISO 9000 Quality Systems  7-22 Obsolete without replacement
Orig. 4/93
 
IPC-L-108 Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards  3-11 Superseded by IPC-4101
Rev B  6/90
Rev A 10/80
Orig. 3/76
 
IPC-L-109 Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards  3-11 Superseded by IPC-4101
Rev B  7/92
Rev A 10/80
Orig. 3/76
 
IPC-L-110 Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards  3-11 Rev A Superseded by IPC-L-109 and IPC-4101  
IPC-CC-110 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications  3-11c Superseded by IPC-4121
Rev A 12/97
Orig. 1/94
 
IPC-L-112 Specification for Composite Metal Clad Base Materials for Printed Boards  3-11 Superseded by IPC-4101
Rev A 6/92
Orig. 7/81
 
IPC-WP-113 Guidance for the Development and Implementation of a Red Plague Control Plan (RPCP) 7-31k & 7-31h Orig. 12/15  
IPC-WP-114 Guidance for the Development and Implementation of a White Plague Control Plan (WPCP) 7-31k & 7-31h Orig. 12/15  
IPC-L-115 Specification for Rigid Metal Clad Base Materials for Printed Boards  3-11 Superseded by IPC-4101
Rev B 4/90
Rev A 10/80
Orig. 3/77
 
IPC-WP-116 Guidance for the Development and Implementation of a Foreign Object Debris (FOD) Control Plan 7-31k & 7-31h Orig. 12/15  
IPC-L-120 Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates    Obsolete without replacement  
IPC-L-125 Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections  D-23 Superseded by IPC-4103
Rev A 7/92
Orig. 8/83
 
IPC-L-130 Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards  3-11 Superseded by IPC-L-108 and IPC-4101
Orig. 1/77
 
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules    Obsolete without replacement
Orig. 8/95
 
IPC-EG-140 Specification for Finished Fabric Woven from “E” Glass for Printed Boards  3-12d Superseded by IPC-4412
Amend 1 & 2 6/97
Orig. 3/88
W02/03
IPC-SG-141 Specification for Finished Fabric Woven from “S” Glass for Printed Boards  3-12d Orig. 2/92 7/93
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards  3-12 Orig. 6/90 W05/12
IPC-QF-143 General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards  3-12d Orig. 2/92 W6/11
IPC-CF-148 Resin Coated Metal for Printed Boards  3-12c Superseded by IPC-4563
Rev A 9/98
Orig. 6/90
 
IPC-MF-150 Metal Foil for Printed Wiring Applications  3-12a Superseded by IPC-4562 5/00
Amend 1 8/92
Rev F 10/91 Changed from CF-150 to MF-150
Rev E 5/81
Rev D 3/76
Rev C 8/74
Rev B 2/71
Rev A 9/67
Orig. 8/66
W02/02
IPC-CF-152 Composite Metallic Material Specification for Printed Wiring Boards  3-12h Rev B 12/97
Rev A 1/94
Orig. 6/90
 
IPC-FC-203 Specification for Flat Cable, Round Conductor, Ground Plane  D-13 Obsolete 7/96
Orig. 7/85
 
IPC-FC-210 Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC)  D-13 Obsolete 7/96
Orig. 9/85
 
IPC-FC-213 Performance Specification for Flat Undercarpet Telephone Cable  D-13* Obsolete 7/96
Orig. 9/84
 
IPC-FC-217 General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable  D-13 Obsolete 7/96
Reaffirmed 4/90
Orig. 8/82
 
IPC-FC-218B/EIA-RS-429 General Specification for Connectors, Electrical Flat Cable Type  D-13 Obsolete 7/96
Reaffirmed 5/91
Reaffirmed 11/81
Orig. 7/76
 
IPC-FC-219 Environment Sealed Flat Cable Connectors for use in Aerospace Applications  D-13 Obsolete 7/96
Orig. 5/84
 
IPC-FC-220 Specification for Flat Cable, Flat Conductor, Unshielded  D-13 Obsolete 7/96
Rev C 7/85
Rev B 8/75
Rev A 1/74
Orig. 5/70
 
IPC-FC-221 Specification for Flat-Copper Conductors for Flat Cables  D-13 Obsolete 7/96
Rev A 5/84
Orig. 8/75
 
IPC-FC-222 Specification of Flat Cable Round Conductor, Unshielded  D-13 Obsolete 7/96
Reaffirmed 5/91
Orig. 6/80
 
IPC-FC-225 Flat Cable Design Guide  D-13 Obsolete 7/96
Reaffirmed 10/85
Orig. 8/75
 
IPC-FC-231 Flexible Base Dielectrics for Use in Flexible Printed Wiring  D-13 Superseded by IPC-4202
Amend 10/95
Rev C 4/92
Rev B 2/86
Rev A 5/83
Orig. 7/74
W03/03
IPC-FC-232 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films  D-13 Superseded by 4203 5/02
Amend 10/95
Rev C 6/94
Rev B 2/86
Rev A 5/83
Orig. 7/74
W03/03
IPC-FC-233 Flexible Adhesive Bonding Films  D-13 Incorporated into IPC-FC-232C 6/94
Rev A 2/86
Orig. 5/83
W11/03
IPC-FC-234 PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits  D-1 Rev A 12/14
Orig. 12/97
 
IPC-FC-240 Single sided flex  D-12 Superseded by IPC-6013
Incorporated into FC-250
Rev B 1/74
Rev A 5/69
Orig. 12/65
 
IPC-FC-241 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring  D-13* Superseded by IPC-4204
Amend 10/95
Rev C 4/92
Rev B 2/86
Rev A 5/83
Orig. 7/74
W02/02
IPC-RF-245 Performance Specification for Rigid-Flex Printed Boards  D-12 Superseded by IPC-6013
Orig. 4/87
 
IPC-D-249 Design Standard for Flexible Single-and Double-Sided Printed Boards  D-11 Superseded by IPC-2223
Orig. 1/87
 
IPC-FC-250 Specification for Single – and Double-Sided Flexible Printed Wiring  D-12 Superseded by IPC-6013
Rev A 9/86
Orig. 1/74
 
IPC-FA-251 Guidelines for Single and Double Sided Flex Circuits  D-12 Orig. 2/92  
IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies  D-31b Superseded by IPC-2221 and 2222
Supersedes IPC-D-319 and IPC-D-949
Amendment 1  4/96
Orig. 9/91
W10/09
IPC-RB-276 Qualification and Performance Specification for Rigid Printed Boards  D-33a Superseded by IPC-6011 and IPC-6012
Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C
 
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies  6-10b Orig. 7/96  
IPC-D-300 Printed Board Dimensions and Tolerances  1-10a Superseded by IPC-2615
Rev G 1/84
Rev F 11/74
Rev E 10/70
Rev D 1/70
Rev C 10/65
Rev B 1/64
Rev A 7/61
Orig. 8/60
 
IPC-D-310 Guidelines for Phototool Generation and Measurement Techniques    Rev C  6/91
Rev B 12/85
Rev A 12/77
Orig. 9/69
 
IPC-A-311 Process Control Guidelines for Phototool Generation and Use    Orig. 3/96  
IPC-D-316 Design Guide for Microwave Circuit Boards Utilizing Soft Substrates  D-21b Superseded by IPC-2252
Orig. 5/95
 
IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques  D-21a Superseded by IPC-2251
Rev A 1/95
Orig. 4/90
 
IPC-HF-318 Microwave End Product Board Inspection and Test  D-22 Superseded by IPC-6018
Rev A 12/91
Orig. 6/85
 
IPC-D-319 Design Standard for Rigid Single-and Double-Sided Printed Boards  D-31b Superseded by IPC-D-275, then by IPC-2221/2222
Orig. 1/87
 
IPC-SD-320 Performance Specification for Rigid Single- and Double-Sided Printed Boards  D-33a Superseded by IPC-RB-276
Supersedes IPC-TC-500
Rev B 11/86
Rev A 3/81
Orig. 1/77
 
IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes    Reaffirmed 9/91
Orig. 8/84
10/94
IPC-MC-324 Performance Specifications for Metal Core Boards  D-33a Superseded by IPC-6011 and IPC-6012
Orig. 10/88
 
IPC-D-325 Documentation Requirements for Printed Boards, Assemblies and Support Drawings  2-40 Inactive for new designs (see IPC-2610 series for new designs)
Rev A 5/95
Orig. 1/87
 
IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies  2-11a Rev A 1/04
Orig. 4/91
 
IPC-D-330 Design Guide Manual    Orig. 1/92  
IPC-PD-335 Electronic Packaging Handbook    Orig. 12/89  
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers    Orig. 8/85 10/85
IPC-D-350 Printed Board Description in Digital Form 2-11 Rev D 7/92
Rev C 10/85
Rev B 8/77
Rev A 2/75
Orig. 8/72
07/78
IPC-D-351 Printed Board Drawings in Digital Form    Orig. 8/85 09/85
IPC-D-352 Electronic Design Data Description for Printed Boards in Digital Form    Orig. 8/85 09/85
IPC-D-354 Library Format Description for Printed Boards in Digital Form    Orig. 2/87  
IPC-D-355 Printed Board Assembly Description in Digital Form    Orig. 1/95  
IPC-D-356 Bare Board Electrical Test Information in Digital Form  2-11c Rev B 10/02
Rev A 1/98
Orig. 3/92
08/92
IPC-AM-361 Specification for Rigid Substrates for Additive Process Printed Boards    Superseded by IPC-4101
Orig. 1/82
 
IPC-MB-380 Guidelines for Molded Interconnection Devices    Orig. 10/90  
IPC-D-390 Automated Design Guidelines    Rev A 2/88
Orig. 7/74
 
IPC-C-406 Design and Application Guidelines for Surface Mount Connectors    Orig. 1/90  
IPC-CI-408 Solderless Surface Mount Connector Design Characteristics and Application Guidelines B-22c Orig. 1/94  
IPC-BP-421 General Specification for Rigid Printed Board Backplanes with Press Fit Contacts    Obsolete without replacement
Reaffirmed 4/90
Orig. 10/80
 
IPC-D-422 Design Guide for Press Fit Rigid Printed Board Backplanes    Orig. 9/82  
IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards    Orig. 1/95  
IPC-DW-425 Design and End Product Requirements for Discrete Wiring Boards    Rev A 5/90
Orig. 9/82
03/94
IPC-DW-426 Specifications for Assembly of Discrete Wiring    Orig. 12/87  
IPC-TR-460 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards    Rev A 2/84
Orig. 1973
 
IPC-TR-461 Solderability Evaluation of Thick and Thin Fused Coatings    Orig. 3/79  
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage    Orig. 10/87  
IPC-TR-464 Accelerated Aging for Solderability Evaluations  5-23b Addendum 12/87
Orig. 4/84
 
IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability    Orig. 1993  
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results    Orig. 1993  
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA    Orig. 7/96  
IPC-TR-466 Wetting Balance Standard Weight Comparison Test    Orig. 4/95  
IPC-TR-467 Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D    Orig. 10/96  
IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards    Orig. 3/79  
IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards    Orig. 1/74  
IPC-TR-474 An Overview of Discrete Wiring Techniques    Obsolete without replacement
Reprint 1984
Orig. 3/79
 
IPC-TR-476 How to Avoid Metallic Growth Problems on Electronic Hardware Rev A Electrochemical Migration Electrically Induced Failures In Printed Assemblies    Rev A 6/84 (new title)
Orig. 9/77
 
IPC-TR-480 Results of Multilayer Test Program Round Robin IV Phase I    Obsolete without replacement
Orig. 9/75
 
IPC-TR-481 Results of Multilayer Test Program Round Robin V    Orig. 4/81  
IPC-TR-482 New Developments in Thin Copper Foils    Orig. 1/76  
IPC-TR-483 Dimensional Stability Testing of Thin Laminates – Report on Phase I International Round Robin Test Program    Rev A 3/91
Addendums 10/87
Orig. 4/84
 
IPC-TR-484 Results of IPC Cooper Foil Ductility Round Robin Study    Orig. 4/86  
IPC-TR-485 Results of Cooper Foil Rupture Strength Test Round Robin Study    Orig. 3/85  
IPC-TR-486 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations    Orig. 7/01  
IPC-TR-549 Measles in Printed Wiring Boards    Orig. 11/78  
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components    Orig. 7/93  
IPC-DR-570 General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards  4-12 Rev A 4/84
Orig. 1/79
 
IPC-DR-572 Drilling Guidelines for Printed Boards  4-12 Rev A  3/07
Orig. 4/88
 
IPC-TR-575 Additive Process Evaluation-Report on Phase I IPC Round Robin Testing Program on Additive Printed Wiring Boards   Obsolete without replacement
Orig. 4/75
 
IPC-TR-576 Additive Process Evaluation    Obsolete without replacement
Orig. 9/77
 
IPC-TR-577 Additive Process Evaluation - Report on Phase III IPC Round Robin Testing Program on Rigid Additive Printed Boards   Obsolete without replacement
Orig. 4/80
 
IPC-TR-578 Leading Edge Manufacturing Technology Report – Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards    Orig. 9/84  
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards    Orig. 9/88  
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results    Orig. 10/89  
IPC-TR-581 IPC Phase 3 Controlled Atmosphere Soldering Study    Orig. 8/94  
IPC-TR-582 IPC Phase 3 No-Clean Flux Study    Orig. 11/94  
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing   Orig. 7/02  
IPC-WP/TR-584 IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies 4-33 Rev A  8/07
Orig.  4/03
 
IPC-TR-585 Time, Temperature and Humidity Stress of Final Board Finish Solderability   Orig.  5/06  
IPC-TR-586 Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A) 4-14 Orig. 5/09  
IPC-TR-587 Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report 5-22ARR Orig. 7/20  
IPC-A-600 Acceptability of Printed Boards  7-31a & D-33a Rev K  7/20
Rev J  6/16
Rev H  4/10
Rev G Amend 1  1/08
Rev G  7/04
Rev F 11/99
Rev E 8/95
Rev D '89
Rev C '78
Rev B '74
Rev A '70
Orig. '64
 
IPC-SS-605 Printed Board Quality Evaluation Slide Set    Obsolete without replacement  
IPC-QE-605 Printed Board Quality Evaluation Handbook  7-31c Rev A 2/99  
J-STD-609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices 4-34b Rev B 11/16
Rev A  3/10
Orig. 5/07; supersedes IPC-1066
01/08
IPC-A-610 Acceptability of Electronic Assemblies  7-31b Rev H  9/20
Rev G 10/17
Rev F WAM1  2/16
Rev F Amend 1  12/15
Rev F  8/14
Rev E  4/10
Rev D Amend 1 4/08
Rev D 2/05
Rev C Amend 1 11/01
Rev C 1/00
Rev B 12/94
Rev A 3/90
Orig. 8/83
02/02
IPC-A-610xC IPC-A-610xC Telecom Addendum 7-31bc GC 1/20
FC 2/17
DC 8/09 (orig. )
 
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes B-C-D comparison)   Amend 1  10/05
Orig. 9/02
 
IPC-QE-615 Assembly Quality Evaluation Handbook    Obsolete without replacement  
IPC-D-620 Design and Critical Process Requirements for Cable and Wiring Harnesses  7-31k Orig.  2/16  
IPC/WHMA-A-620 Acceptability of Electronic Wire Harnesses and Cables  7-31f Rev D 1/20
Rev C 1/17
Rev B Amend 1 8/13
Rev B 10/12
Rev A 7/06
Orig. 1/02
 
IPC/WHMA-A-620 REDLINE Acceptability of Electronic Wire Harnesses and Cables    Rev B to C  3/17  
IPC/WHMA-A-620 Space Hardware Addendum Space Applications Electronic Hardware Addendum for IPC/WHMA-A-620. The addendum MUST be used with the same version of the standard; e.g. 620CS with 620C 7-31fs Rev D-S  9/20
Rev C-S  4/18
Rev B-S  6/13
Rev A-S Amend 1  7/12
Rev A-S  1/11
 
IPC-HDBK-620 Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620  7-31h/7-31k Orig 6/18  
IPC-A-630 Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures 7-31j Orig. 9/13  
IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection, and Testing of Electronic Enclosures   7-31j Orig. 7/14  
IPC-A-640 Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies  7-31m Orig. 7/17  
IPC-AI-640 User’s Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates    Obsolete without replacement
Orig. 1/87
 
IPC-D-640 Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies 7-31m Orig. 9/16  
IPC-AI-641 User’s Guidelines for Automated Solder Joint Inspection    Obsolete without replacement
Orig. 1/87
 
IPC-AI-642 User’s Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB’s    Obsolete without replacement
Orig. 10/88
 
IPC-OI-645 Standard for Visual Optical Inspection Aids  7-31d Orig. 10/93  
IPC-TM-650 Test Methods Manual    Updated per test method  
IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards    Superseded by IPC-9252
Orig. 10/90
 
IPC-QL-653 Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material  7-10c Rev A 11/97
Orig. 8/88
07/89
IPC-MI-660 Incoming Inspection of Raw Materials Manual    Orig. 2/84  
IPC-R-700 Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies    Superseded by IPC-7711A/7721A
Rev C 1/88
Rev B 9/77
Rev A 12/71
Orig. 9/67
 
IPC-TA-720 Technology Assessment Handbook on Laminates    Orig. ’86   
IPC-TA-721 Technology Assessment Handbook on Multilayer Boards    Orig. ’88  
IPC-TA-722 Technology Assessment of Soldering    Orig. ’90  
IPC-TA-723 Technology Assessment Handbook on Surface Mounting    Orig. ’91  
IPC-TA-724 Technology Assessment Series on Cleanrooms    Orig. 4/98  
IPC-PE-740 Troubleshooting Guide for Printed Board Manufacture and Assembly  7-23 PWB Sections superseded by IPC-9121
Rev A 12/97
Orig. 1/85
 
IPC-CM-770 Guidelines for Printed Board Component Mounting  5-21a Rev E 1/04
Rev D 1/96
Rev C 1/87
Rev B 10/80
Rev A 3/76
Orig. 9/68
 
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting    Orig. 3/88  
IPC-SM-782 Surface Mount Design and Land Pattern Standard  1-13 Superseded by IPC-7351
Rev A Amend 2  4/99
Rev A Amend 1  10/96
Rev A 8/93
Orig. 3/87
 
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation    Orig. 11/90  
IPC-SM-785 Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments    Orig. 11/92  
IPC-SM-786 Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs   Superseded by J-STD-020 and J-STD-033
Rev A 1/95
Orig. 12/90
 
IPC-MC-790 Guidelines for Multichip Module Technology Utilization    Orig. 8/92  
IPC-S-801   5-23a Superseded by IPC-804 and J-STD-003  
IPC-S-803   5-23a Superseded by IPC-804 and J-STD-003  
IPC-S-804 Solderability Test Methods for Printed Wiring Boards  5-23a Superseded by J-STD-003
Rev A 1/87
Orig. 1/82
 
IPC-S-805 Solderability Tests for Component Leads and Terminations  5-23b Superseded by
J-STD-002
Orig. 1/85
 
IPC-MS-810 Guidelines for High Volume Microsection    Orig. 10/93  
IPC-S-815 General Requirements for Soldering Electronic Interconnections    Superseded byJ-STD-001
Rev B 12/87
Rev A 6/81
Orig. 11/77
 
IPC-S-816 SMT Process Guideline and Checklist    Orig. 7/93  
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives  5-21k Rev A 12/14
Orig. 11/89
 
IPC-SF-818 General Requirement for Electronic Soldering Fluxes  5-24a Superseded by J-STD-004
Rev 12/91
Orig. 2/88
 
IPC-SP-819 General Requirements and Test Methods for Electronic Grade Solder Paste  5-24b Superseded by J-STD-005
Orig. 10/88
 
IPC-AJ-820 Assembly and Joining Handbook 7-35 Rev A 2/12
Orig. 4/97
 
IPC-CA-821 General Requirements for Thermally Conductive Adhesives    Orig. 1/95  
IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies  5-33a Rev C  1/19
Rev B  Amend 1 10/08
Rev B 8/02
Rev A Amend 1 7/99
Rev A 10/98
Orig. 1/84
 
IPC-HDBK-830 Guidelines for Design, Selection and Application of Conformal Coatings 5-33c Rev A 8/13
Orig. 10/02
 
IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines    Orig. 4/90  
IPC-SM-840 Qualification and Performance Specification  of Permanent Solder Mask and Flexible Cover Materials  5-33b Rev E 12/10
Rev D 4/07
Rev C Amend 1 6/00
Rev C 1/96
Rev B 5/88
Rev A 7/83
Orig. 11/77
08/83
IPC-HDBK-840 Solder Mask Handbook 5-33d Orig. 9/06  
IPC-HDBK-850 Guidelines for Design, Selection and Application of Potting and Encapsulation Materials Used for Electronics Printed Circuit Board Assembly 5-33f Orig. 7/12  
IPC-H-855 Hybrid Microcircuit Design Guide    Obsolete without replacement
Orig. 10/82
 
IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits    Orig. 12/89  
IPC-HM-860 Specification for Multilayer Hybrid Circuits    Orig. 1/87  
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards    Orig. 11/89  
IPC-ML-910 Design and End Production Specification for Rigid Multilayer Printed Boards  D-31b & D-33a Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IPC-6011 for End Product Specification
Rev A  8/76
Orig.  6/68
 
IPC-D-949 Design Standard for Rigid Multilayer Printed Boards  D-31b Superseded by IPC-D-275 and subsequently by IPC-2221/2222
Orig. 1/87
 
IPC-ML-950 Performance Specification for Rigid Multilayer Printed Boards  D-33a Superseded by IPC-RB-276 and subsequently IPC-6011/6012
Rev C 11/8
Rev B 12/77
Rev A 9/70
Orig. 1/66
 
IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards  D-33b Orig. 7/94  
IPC-ML-975 End Product Documentation Specification for Multilayer Printed Wiring Boards    Superseded by IPC-D-325
Orig. 9/69
 
IPC-ML-990 Performance Specification for Flexible Multilayer Wiring  D-33a Superseded by IPC-6011
Orig. 9/72
 
IPC-TP-1043 Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1    Orig. 8/92  
IPC-TP-1044 Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2    Orig. 10/92  
IPC-1065 Material Declaration Handbook 4-34a Orig. 1/05  
IPC-1066 Labeling of PCBs and Assemblies 4-34b Superseded by J-STD-609
Orig. 12/04
 
IPC-1071 Intellectual Property Protection in Printed Board Manufacturing E-20 Superseded by IPC-1791
Rev B  5/16
Rev A  7/14
Orig.  1/11
 
IPC-1072 Intellectual Property Protection in Assembly Manufacturing E-21 Superseded by IPC-1791
Am 1  3/17
Orig. 2/16
 
IPC-WP-1081 White Paper on Conflict Minerals Due Diligence Guidance E-30 Orig. 8/13  
IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002    Orig. 7/96  
IPC-TP-1103 Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads    Obsolete without replacement  
IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001B    Orig. 1/98  
IPC-TP-1115 Selection and Implementation Strategy for A Low-Residue No-Clean Process    Orig. 12/98  
IPC-1131 IT Guidelines for PWB Manufacturers  2-20 Orig. 4/00  
IPC-1331 Voluntary Safety Standard for Electrically Heated Process Equipment    Orig. 3/00  
IPC-1401 Corporate Social Responsibility
and Sustainability Protocols for
Electronic Manufacturing Industry
4-35CN Orig. 3/17  
IPC-1601 Printed Board Handling and Storage Guidelines D-35 Rev A 6/16
Orig. 8/10
 
IPC-1602 Standard for Printed Board Handling and Storage D-35 Orig.  4/20  
IPC-1710 OEM Standard for Printed Board Manufacturers’ Qualification Profile (MQP)    Rev A 7/04
12/97 updated
Orig. 2/94
 
IPC-1720 Assembly Qualification Profile (AQP)    Rev A 7/04
Orig. 7/96
 
IPC-1730 Laminator Qualification Profile (LQP)    Rev A 6/00
Orig. 1/98
 
IPC-1731 Strategic Raw Materials Supplier Qualification Profile  3-12i Orig. 6/00  
IPC-1751 Generic Requirements for Declaration Process Management E-31a Rev A w/Amend 1  12/12
Rev A  2/10
Vers. 1.1  3/07
Orig. 3/06
 
IPC-1752 Materials Declaration Management E-31b Rev B 7/20
Rev A. w/Amend 1&2    2/14
Rev A w/Amend 1   12/12
Rev A 2/10
Vers. 1.1 3/07
Orig. 3/06
 
IPC-1753 Laboratory Report Standard E-31j Am 1 5/18
Orig. 2/14
 
IPC-1754 Materials and Substances  Declaration for Aerospace and Defense and Other Industries E-31k Am 2  6/20
w/Amend 1 3/19
Orig 6/18
 
IPC-1755 Conflict Minerals Data Exchange Standard E-31h

Rev A 5/20

w/Amend 1&2 4/17
Am 1  4/15
Orig. 4/14

 
IPC-1756 Manufacturing Process Data Management   Orig. 4/10  
IPC-1758 Declaration Requirements for Shipping, Pack and Packing Materials   Orig. 3/12  
IPC-1782 Standard for Manufacturing and Supply Chain Traceability of Electronic Products  2-19a

Rev A. 11/20

Orig. 11/16

 
IPC-1791 Trusted Electronic Designer, Manufacturer, and Assembler Requirements  2-19b Am 1  3/19
Orig.  9/18; Supersedes IPC-1071 and IPC-1072
 
IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design  D-21c Rev A 3/04
Amend 1  2/99
Orig. 4/96
12/09
IPC-2152 Standard for Determining Current Carrying Capacity in Printed Board Design 1-10b Orig. 8/09 02/11
IPC-2221 Generic Standard on Printed Board Design  D-31b Rev B 11/12
Rev A 5/03
Amend 1  1/00
Orig. 2/98; Supersedes IPC-D-275
09/99
IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards  D-31b Rev B 10/20
Rev A 12/10
Orig. 2/98; Supersedes IPC-D-275
 
IPC-2223 Sectional Design Standard for Flexible Printed Boards  D-11 Rev E  1/20
Rev D  9/16
Rev C 11/11
Rev B 5/08
Rev A 6/04
Orig. 11/98; Supersedes IPC-D-249
09/99
IPC-2224 Sectional Standard for Design of PWBs for PC Cards  1-21 Orig. 1/98  
IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies  D-31c Orig. 5/98  
IPC-2226 Sectional Design Standard for High Density Interconnect (HDI) Printed Boards  D-31b Rev A  9/17
Orig. 4/03
03/09
IPC-2231 DFX Guidelines 1-14 Orig. 5/19  
IPC-2251 Design Guide for the Packaging of High Speed Electronic Circuits D-21a Orig. 12/03 08/09
IPC-2252 Design and Manufacturing Guide for RF/Microwave Circuit Boards  D-21b Orig. 7/02  
IPC/JPCA-2291 Design Guideline for Printed Electronics D-61 Orig. 7/13  
IPC-2292 Design Standard for Printed Electronics on Flexible Substrates  D-61 Orig 3/18  
IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvia  D-41a Orig. 6/00  
IPC-2316 Design Guide for Embedded Passive Device Printed Boards D-37a Orig. 3/07  
IPC-2501 Definition for Web-based Exchange of XML Data 2-50 Orig. 7/03  
IPC-2511 Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology  2-11 Rev B  1/02
Rev A  1/00
Orig. 1 1/98
 
IPC-2512 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description  2-11 Rev A 11/00
Orig. 11/98
 
IPC-2513 Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 2-11 Rev A 11/00  
IPC-2514 Sectional Requirements for Implementation of Printed Board Manufacturing Data Description  2-11 Rev A 11/00  
IPC-2515 Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description 2-11 Rev A 11/00  
IPC-2516 Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description  2-11 Rev A 11/00  
IPC-2517 Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description 2-11 Rev A 11/00  
IPC-2518 Sectional Requirements for Implementation of Part List Product Data Description  2-11 Rev A 11/00  
IPC-2524 PWB Fabrication Data Quality Rating System  2-10 Orig. 2/99  
IPC-2531 Standard Recipe File Format Specification  2-12 Orig. 3/99  
IPC-2541 Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication  2-13a Orig. 10/01  
IPC-2546 Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication  2-13b Amend 2  1/05
Amend 1  1/03
Orig. 10/01
 
IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication  2-13c Orig. 1/02  
IPC-2551 International Standard for Digital Twins 2-12a Orig. 12/20  
IPC-2571 Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX)  2-15a Orig. 11/01  
IPC-2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Exchange (PDX)  2-15c Orig. 11/01  
IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX)  2-15e Orig. 11/01  
IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology 2-16

Rev C 11/20

Rev B Am 1  1/17
Rev B 9/13
Rev A 5/12
Amend 1  5/07
Orig. 3/04

 
IPC-2582 Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description 2-17 Orig. 5/07  
IPC-2583 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 2-17 Orig. 5/07  
IPC-2584 Sectional Requirements for Implementation of Printed Board Fabrication Data Description 2-17 Orig. 5/07  
IPC-2588 Sectional Requirements for Implementation of Part List Product Data Description 2-17 Orig. 5/07  
IPC-2591 Connected Factory Exchange (CFX) 2-17

ver 1.3 2/21

ver 1.2  9/20
ver 1.1  1/20
Orig. 4/19

 
IPC-2611 Generic Requirements for Electronic Product Documentation 2-40 Orig. 4/10  
IPC-2612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) 2-40 Orig. 4/10  
IPC-2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2-40 Orig. 4/10  
IPC-2614 Sectional Requirements for Board Fabrication Documentation 2-40 Orig. 4/10  
IPC-2615 Printed Board Dimensions and Tolerances  1-10a Orig. 7/00; Supersedes IPC-D-300 11/10
IPC/PERM-2901 Pb-free Design & Assembly Implementation Guide   Orig. 2/18  
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives  5-24d Orig. 7/96  
IPC-3408 General Requirements for Anistropically Conductive Adhesive Films  5-24d Orig. 11/96  
IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards  3-11 Rev E 4/17
Rev D WAM 1  8/15
Rev D 4/14
Rev C 8/09
Rev B Amends 1&2  4/07
Rev B Amend 1  2/07
Rev B  6/06
Rev A Amend 1 6/02
Rev A 6/02; Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
Orig. 12/97
 
IPC-4103 Specification for Base Materials for High Speed/ High Frequency Applications D-23 Rev B  11/17
Rev A Amend 1  3/14
Rev A 12/11
Orig. 1/02; Supersedes IPC-L-125
 
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials  D-42a Orig. 5/99  
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards  3-12g Orig. 8/98  
IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications  3-11c Orig. 1/00; Supersedes IPC-CC-110  
IPC-4130 Specification and Characterization Methods for Nonwoven “E” Glass Mat  3-12f Orig. 9/98  
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Wiring  D-13 Rev B 12/16
Rev A  4/10
Orig. 5/02; Supersedes IPC-FC-231C
02/03
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets  D-13 Rev B  5/18
Rev A Am1 10/14
Rev A 1/13
Orig. 5/02; Supersedes IPC-FC-232C
02/03
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards D-13 Rev B  9/18
Rev A Amend 1  2/14
Rev A 10/11
Orig. 5/02; Supersedes IPC-FC-241C
02/03
IPC-4411 Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement  3-12b Rev A 11/03
Orig. 4/99
 
IPC-4412 Specification for Finished Fabric Woven form “E” Glass for Printed Boards  3-12d Rev B Am3  12/18
Rev B Am2  5/18
Rev B 5/13
Rev A w/Amends 1, 2 & 3  7/11
Rev A Amend 3 12/10
Rev A Amend 2  5/09
Rev A Amend 1  3/08
Rev A 1/06
Orig. 6/02; Supersedes IPC-EG-140
02/03
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards  4-14 Rev A  8/17
w/Amend 1&2  12/12
w/Amend 1  6/12
Orig. 10/02
 
IPC-4553 Specification for Immersion Silver Plating for Printed Circuit Boards 4-14 Rev A 5/09
Orig. 6/05
 
IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards 4-14 Amend 1  9/11
Orig. 2/07
 
IPC-4556 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards 4-14 Amend 1  1/16
Orig. 1/13
 
IPC-4562 Metal Foil for Printed Wiring Applications 3-12a Rev A WAM1  3/16
Rev A 4/08
Amend 1  5/05
Orig. 5/00; Supersedes IPC-MF-150F
02/03
IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline 3-12c Orig. 11/07; Replaces CF-148A  
IPC/JPCA-4591 Requirements for Printed Electronics Functional Conductive Materials D-63 Rev A  2/18
Orig. 12/12
 
IPC-HDBK-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations 5-11c Orig. 1/16  
IPC-4761  Design Guide for Protection of Printed Board Via Structures D-33d Orig. 7/06  
IPC-4781 Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks 5-33e Orig. 5/08  
IPC-4811 Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards D-52 Orig. 4/08  
IPC-4821 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards D-52 Amend 1  4/10
Orig. 5/06
 
IPC-4921 Requirements for Printed Electronics Base Materials  D-62 Rev A  6/17
Orig. 6/12
 
IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards 5-32c Orig. 7/03  
IPC-5702 Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards 5-32c Orig. 6/07  
IPC-5703 Cleanliness Guidelines for Printed Board Fabricators 5-32c Orig. 5/13  
IPC-5704 Cleanliness Requirements for Unpopulated Printed Boards 5-32c Orig. 12/09  
IPC-6011 Generic Performance Specification for Printed Boards  D-33a Orig. 7/96  
IPC-6012 Qualification and Performance Specification for Rigid Printed Boards  D-33a Rev E  2/20
Rev D Amend 1  10/17
Rev D  09/15
Rev C  4/10
Rev B Amend 2  3/08
Rev B with Amend 1  2/07
Rev B 8/04
Rev A Amend 1  7/00
Rev A  10/99
Orig.  7/96
 
IPC-6012DA Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards  D-33aa Rev DA WAM 1  11/18
Rev DA  5/16
 
IPC-6012xS Space and Military Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards    Rev ES  4/20
Rev DS 09/15
 
IPC-6012EM Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards D-33AM Orig. 8/20  
IPC-6012C-TC Test Coupon Addendum to IPC-6012C Qualification and Performance Specification for Rigid Printed Boards D-33ac Orig. 8/13  
IPC-6013 Qualification and Performance Specification for Flexible Printed Boards  D-12 Rev D Am 1  5/18
Rev D  9/17
Rev C  12/13
Rev B  1/09
Rev A with Amend 2  4/06
Rev A  Amend 1  1/05
Rev A  11/03; Supersedes IPC-RF-245 and IPC-FC-250
Amend 1  4/00
Orig. 11/98
 
IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures  D-33e Orig. 2/98  
IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards  D-10 Superseded by IPC-6012, IPC-6013
and/or IPC-6018
Orig. 5/99
 
IPC-6017 Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices D-53 Orig. 3/09  
IPC-6018 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards  D-22 Rev C  7/16
Rev B 11/11
Rev A  1/02
Orig. 1/98
 
IPC/JPCA-6202 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards  D-14 Orig. 2/99  
IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection  D-40 Orig. 1/00  
IPC/JPCA-6901 Application Categories for Printed Electronics D-64 Orig. 8/15  
IPC-6903 Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) D-64a Rev A  3/18
Orig. 10/15
 
IPC-7091 Design and Assembly Process Implementation of 3D Components   Orig. 9/17  
IPC-7092 Design and Assembly Process Implementation for Embedded Components  D-55 Orig. 2/15  
IPC-7093 Design and Assembly Process Implementation for Bottom Termination SMT Components 5-21h

Rev A 10/20

Orig. 3/11

 
IPC-7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components 5-21g Rev A  3/18
Orig. 1/09
 
IPC-7095 Design and Assembly Process Implementation for BGAs  5-21f WAM 1  6/19
Rev D  3/18
Rev C 1/13
Rev B  3/08
Rev A 11/04
Orig. 8/00
 
IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard 1-13 Rev B 6/10
Rev A  2/07
Supersedes IPC-SM-782A w/Amend1&2
Orig.  2/05
 
IPC-7525 Guidelines for Stencil Design  5-21e Rev B 10/11
Rev A  2/07
Orig.  5/00
 
IPC-7526 Stencil and Misprinted Board Cleaning Handbook 5-31g Orig.  2/07  
IPC-7527 Requirements for Solder Paste Printing 5-21jND Orig. 5/12  
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering Processes  (Wave and Reflow) 5-22h Rev A 4/17
Orig.  5/01
 
IPC-7535 Solder Dross Reduction in Wave Soldering Process 5-22jcn Orig.  2/17  
IPC-7621 Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics    Orig.  3/18  
IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies 7-34 Am 1  7/20
Rev C  1/17
Rev B  11/07
Rev A  10/03
Orig.  4/98; Supersedes IPC-R-700C
 
IPC-7801 Reflow Oven Process Control Standard 5-45 Orig. 4/15  
IPC-7912 Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies  5-22g Rev A  1/04
Orig.  7/00
 
IPC-8413-1 Specification for Manufacturing Process Carriers for Handling Optical Fiber 5-25a Orig.  4/03  
IPC-8497-1 Cleaning Methods and Contamination Assessment for Optical Assembly 5-25e Orig. 12/05  
IPC-8701 Final Acceptance Criteria Standard for PV Modules-Final Module Assembly E-15 Orig. 7/14  
IPC-8921 Requirements for Woven and Knitted Electronic Textiles (E-Textiles) Integrated with Conductive Fibers, Conductive Yarns and/or Wires  D-72 Orig. 10/19  
IPC-9111 Troubleshooting for Printed Board Assembly Processes 7-23 Orig.  1/19  
IPC-9121 Troubleshooting for Printed Board Fabrication Processes 7-24 Am 2  9/19
Am 1  5/18
Orig. 3/16; Supersedes PWB sections of IPC-PE-740
 
IPC-9151 Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database D-36 Rev D 5/12
Rev C 5/10
Rev B  2/07
Rev A 5/03
Orig.  6/02
 
IPC-9191 General Guideline for implementation of Statistical Process Control (SPC)  7-22 Supersedes IPC-PC-90
Orig. 11/99
02/03
IPC-9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline 7-22 Orig.  9/04  
IPC-9199 SPC Quality Rating  7-22 Orig.  9/02  
IPC-9201 Surface Insulation Resistance Handbook  5-32b Rev A  8/07
Orig.  7/96
 
IPC-9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance 5-32b Orig. 10/11  
IPC-9203 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 5-32b Orig. 5/12  
IPC-9241 Guidelines for Microsection Preparation 7-12 Orig. 1/17  
IPC-9251 Test Vehicles for Evaluating Fine Line Capability    Obsolete without replacement
Orig.  7/00
 
IPC-9252 Requirements for Electrical Testing of Unpopulated Printed Boards  7-32c Rev B  9/16
Rev A Amend 1  10/12
Rev A  11/08
Orig. 2/01; Supersedes IPC-ET-652A
04/09
IPC-9261 In-Process DPMO and Estimated Yield for PWAs  5-22g Rev A 10/06
Orig. 3/02
 
IPC-9262 Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 7-32CN Orig. 2/17  
IPC/JEDEC-9301 Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability 6-10D Orig. 1/19  
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components  5-21c Orig. 7/95  
IPC-9502 PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components  5-21c Orig. 4/99  
IPC-9503 Moisture Sensitivity Classification for Non-IC Components    Superseded by J-STD-075  8/08
Orig. 4/99
 
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components  5-21c Orig. 6/98  
IPC-9505 Guideline Methodology for Assessing Component and Cleaning Materials Compatibility 5-31j Orig. 10/17  
IPC-9591 Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices 9-81 Orig.  4/06  
IPC-9592 Requirements for Power Conversion Devices for the Computer and Telecommunications Industries 9-81 Rev B 1/13
Rev A  5/10
Orig.  9/08
 
IPC-9631 User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation D-32 Orig. 12/10  
IPC-9641 High Temperature Printed Board Flatness Guideline 6-11 Orig. 6/13  
IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) 5-32e Rev B  9/16
Rev A  8/07
Orig. 10/05
 
IPC-9701 Qualification and Performance Test Methods for Surface Mount Solder Attachments  6-10d Rev A  2/06
Orig.  1/02
 
IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects 6-10d w/Am 1  8/15
Orig.  6/04
 
IPC/JEDEC-9703 Mechanical Shock Test Guidelines for Solder Joint Reliability 6-10d Orig.  3/09  
IPC/JEDEC-9704 Printed Circuit Assembly Strain Gage Test Guideline 6-10d Rev A 2/12
Orig.  6/05
 
IPC/JEDEC-9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection 6-10d Orig. 1/14  
IPC/JEDEC-9707 Spherical Bend Test Method for Characterization of Board Level Interconnects 6-10d Am 1 5/18
Orig. 9/11
 
IPC-9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering 6-10d Orig. 12/10  
IPC-9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Test 6-10d Orig. 12/13  
IPC-9797 Press-fit Standard for Automotive Requirements and other High-Reliability Applications 5-21M Orig. 6/20  
IPC-9850 Surface Mount Equipment Performance Characterization    Rev A 11/11
Orig.  7/02
 
IPC-SMEMA-9851 Equipment Interface Specification   Orig. 11/04  
IPC-HERMES-9852 The Global Standard for Machine-to-Machine Communication in SMT Assembly    Orig. 6/19  
IPC-DRM-PTH
(IPC-DRM-40)

Through-Hole Solder Joint Evaluation Desk Reference Manual 

 

  Rev G  2/18
Rev F  5/15
Rev E 7/10
Rev D (2nd print) 11/08
Rev D 11/05
Renamed to DRM-PTH
Rev E 2/02
Rev D 7/00
Rev C 9/99
Rev B 1/99
Rev A 8/97
Orig. 5/97
 
IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual    Rev G  2/18
Rev F  5/15
Rev E  8/10
Rev D 12/05
Rev C 10/01
Rev B 4/00
Rev A 3/99
Orig. 7/98
 
IPC-DRM-WHA
(IPC-DRM-56)
Wire Preparation & Crimping   Rev B 3/13
Rev A 11/06
Renamed DRM-WHA
Orig.  7/02
 
IPC-EMSI-TC IPC Sample Master Ordering Agreement for EMS Companies and OEMs   Orig.  3/02  
Roadmap International Technology Roadmap for Electronic Interconnections  8-40 Updated 2015
Updated 2013
Updated 2011
Updated 2009
Updated 2007
Updated 2005
Updated 2003
Updated 2001
Updated 9/97
Orig. 6/95