IPC applauds the work of the Armed Services Committees and the Senate Appropriations Committee for reporting bills including key provisions which will strengthen the electronics ecosystem.
IPC® invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts and educational course proposals for IPC E-TEXTILES Europe 2019 to be held on November 12, 2019 in Munich, Germany.
IPC announces the addition of Diana Radovan, Ph.D., to its global advocacy team. As IPC’s new sustainability policy director, Dr. Radovan is responsible for leading the industry’s engagement with government on matters related to sustainability and is based in IPC’s Munich, Germany office.
Ensuring reliability in high-voltage electronics, a new standardized test method for abrasion resistance of e-textiles, and assembly and solder joint X-ray challenges are just a few of technical conference topics offered at IPC’s High Reliability Forum October 9-10 at the McKimmon Center in Raleigh, N.C.
Sentiment in the electronics industry saw a modest uptick in August, though it remains below the peak observed in April 2024. The improvement was driven by stronger demand and reduced costs according to IPC’s August Sentiment of the Global Electronics Manufacturing Supply Chain Report.
IPC announces a transformative partnership with Stephen F. Austin State University (SFASU)'s engineering department, the IPC Education Foundation and the Center for Applied Research and Rural Innovation (CARRI). This collaboration is set to revolutionize workforce development and education in electronics manufacturing, aligning academic programs with industry needs.
IPC announced today the July 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.21.
IPC announced today the July 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.
Starting September 12, IPC’s Road to Reliability Webinar series will bring industry leaders together to discuss the hurdles in achieving reliability for new e-mobility technology. Speakers will examine reliability drivers, technology applications, and target lifecycles in each free webinar.
IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.