IPC announced today the December 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
IPC announced today the December 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.19.
Demand in the electronics industry recovered to 100 in December, marking the threshold between contraction and expansion after four consecutive months below this level according to IPC’s January Sentiment of the Global Electronics Manufacturing Supply Chain Report.
The first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents. The aim of the PEDC was to create a new European platform for the exchange of information on current developments and trends in electronics design.
A new white paper, “Unlocking AI for Automated Optical Inspection” released today by IPC’s Chief Technologist Council, focuses on AI’s role in AOI processes for printed circuit board assemblies (PCBAs).
Lead, Educate and Connect - these three words gives the perfect insight into this year’s Wire Harness Conference. Starting with a record high of 50 attendees joining the “First Timers Session” that was led by representatives of WHMA’s Board of Directors; this meeting was to educate the participants on the association and conference, discuss industry topics, and introduce and connect the First Timers with other members throughout the conference.
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance.
In conjunction with Global Industrie/Midest and SNESE, IFTEC and IPC conducted the first regional European qualification for the IPC Hand Soldering Competition in Lyon, France on March 5-8, 2019. The competition was fierce as 32 competitors went soldering iron to soldering iron to compete for the coveted hand soldering competition crown.
U.S. export control rules have changed significantly in the last decade, and more change is expected over the next few years as policymakers tackle the treatment of emerging and foundational technologies and respond to geopolitical developments.
IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together. IPC offers a new technical education course, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, to provide instruction on how best to use these documents jointly.