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North American PCB Industry Sales Up 14.6 Percent in September

IPC announced today the September 2022 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.12.

Winners of IPC Hand Soldering & Rework Competition at NEPCON Nagoya 2022 Announced

IPC hosted its popular IPC Hand Soldering & Rework Competition in Nagoya, Japan on October 26-28, 2022. Held for the first time in person since the COVID-19 pandemic, the competition welcomed 24 finalists from 17 electronics companies from Japan. The total number of the competitors exceeded 130; 24 finalists passed the primary and the secondary qualifiers and competed at the final stage.

One-Fourth of Electronics Manufacturers Believe We are Currently in a Recession

New data from IPC show that most electronics manufacturing industry executives see a recession as inevitable.

IPC E-Textiles 2023 Offers an International Lineup of Speakers

IPC E-Textiles 2023 will be held Monday, January 23, 2023, in conjunction with IPC APEX EXPO, in San Diego, Calif., at the San Diego Convention Center.

IPC India to Host 2nd Annual Integrated Electronics Manufacturing & Interconnections (IEMI) Event

IPC India has announced the 2nd annual Integrated Electronics Manufacturing and Interconnections (IEMI) event scheduled on August 1, 2023 in Chennai, and on August 3, 2023, in Pune, India.

IPC to Unveil New Member Magazine, ‘IPC Community’ at IPC APEX EXPO 2023

IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.

IPC and High Density Package Users Group Sign MoU, Strengthening Collaboration and Value to Membership

IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain of manufacturing products that utilize high-density electronic packages and printed circuit boards, have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.

Salary Budgets Rise Sharply in 2022 Says New IPC Wage Rate and Salary Study

A sharp increase in salary budgets and use of flexible hours programs for North American electronics assembly companies are among the findings of a new study published by IPC this week, the 2022 Wage Rate and Salary Study for the North American Electronics Assembly Industry.

Registration Open for the 2023 WHMA 30th Annual Wire Harness Conference

Registration is now open for the 2023 WHMA 30th Annual Wire Harness Conference, the industry’s only annual global leadership conference for the wire harness manufacturing industry. Geared to wire harness manufacturers, their suppliers and customers, the event will take place in person, February 14-16, 2023, in Albuquerque, New Mexico at the Sandia Resort and Casino.

WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2023

WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 16-18, 2023, at the Wisconsin Center in Milwaukee, Wis.

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