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IPC K-FEST 2024

IPC K-FEST is set to be IPC’s landmark event in Korea, bringing together industry peers to celebrate the advancements and contributions that have shaped the landscape of electronics standards and technology.

IPC Hand Soldering Competition Thailand 2024

IPC’s hand soldering competitions around the world are highly popular events generating a lot of attention, participation and publicity.

IPC Hand Soldering Competition Vietnam 2024

IPC’s hand soldering competitions around the world are highly popular events generating a lot of attention, participation and publicity.

Advanced Technology Symposium in Tokyo by KEIDANREN

This event will be held in Tokyo, Japan sponsored by KEIDANREN, a comprehensive economic organization with a membership comprised of 1,512 representative companies of Japan, 107 nationwide industrial associations and the regional economic organizations for all 47 prefectures.

IPC Hand Soldering Competition (HSC) 2024 in Japan

This competition is for choosing the Japanese champion to dispatch the world final 2024 with the cooperation of Japan Unix Co., Ltd.

NEPCON NAGOYA / IPC HSC 2024 Japan Final

NEPCON NAGOYA is the exhibition held in the center of the manufacturing industry of Japan.

IPC Works ASIA 2024 IPC Seminar in Japan

This annual seminar is held mainly for IPC members, regional TG participants and its standards users in Japan with the collaboration of IPC Asia.

IPC Standards Task Group Meeting - Japan regional F2F meeting

This face-to-face opportunity intends for regional task group members in Japan such as 7-31BV-JP. With the guests from IPC Global, we discuss and make proposals to the original task group.

Test Methods to Validate Acceptable Levels of Flux and Other Process Residues on Production Assemblies

Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly. This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.

IPC Hand Soldering Competition 2024 Regional Qualification - United Kingdom

Skilled soldering experts will be competing for 60 minutes on a complex circuit board assembly to win the 2024 National title, and earn a cash prize and a chance to compete at the IPC Hand Soldering World Championship.

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