IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board.
IPC Hosts Advanced Packaging Symposium in Tokyo
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping th
Electronics Industry Praises U.S. Government Notice of Funding Opportunity for “Advanced Packaging” Technologies
IPC praised today’s issuance from the CHIPS for America R&D Office, through the National Institute of Standards and Technology (NIST), of a
New Microelectronics and Advanced Packaging Roadmap Guides U.S. Electronics Ecosystem
IPC, part of MAPT Roadmap Extended Executive Committee provides data on next generation advanced packaging, materials, substrates, and supply chain future needs
Today, IPC, in collaboration with other industry organizations and representatives from academia and government, celebrate the release of the Semiconductor Research Corporation’s (SRC) Microelectronics and Advanced P
IPC and IMAPS to Host On-Shoring Advanced Packaging and Assembly Workshop
IPC and the International Microelectronics Assembly and Packaging Society (IMAPS) will host an “On-Shoring Advanced Packaging and Assembly,” workshop July 10-12, 2023, in Washington, D.C.
CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say
Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission gathered in Washington, D.C.