IPC Welcomes U.S. Presidential Determination Prioritizing Domestic Development of Printed Circuit Boards and IC Substrates
IPC, the global association representing the electronics manufacturing industry, welcomes the action of U.S.
IPC Applauds New U.S.-Canada Partnership to Strengthen Advanced Packaging and Printed Circuit Board Manufacturing in North America
The following is statement by John W. Mitchell, president and CEO of IPC, the global electronics manufacturing association, on the joint statement today of U.S.
Help Build the Industry’s Future: Become an IPC Emerging Engineer or Mentor
IPC now accepting applications for 2023 program
IPC’s Emerging Engineer program provides professionals early in their careers an opportunity to learn from industry mentors about IPC Standards development, and to obtain education and training for professional development.
Best Technical Papers at IPC APEX EXPO 2023 Selected
The best technical conference papers of IPC APEX EXPO 2023 have been selected.
IPC Releases IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC/WHMA-A-620E, Requirements and Acceptance for Cable and Wire Harness Assemblies prescribes practices and requirements for the manufacturing
IPC Issues New Report, The Evolution of Factories of the Future: What You Need to Know
IPC recently convened a roundtable of electronics executives to discuss trends driving the industry’s migration to the factory of the future.