IPC’s Annual High Reliability Forum Adds Microvia Summit to Conference Lineup
Event to discuss solutions to microvia challenges and reliability concerns for Class 3 electronics
IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.
IPC Releases Report Projecting Employment Growth in European Electronics Sector; Launches Ambitious New Workforce Initiative
Employment in the European electronics sector is expected to grow according to a new study by Oxford Economics released today by
IPC Offers Tech Ed Course on Utilizing J-STD-001 and IPC-A-610 Together
Course to be taught in locations in U.S and Europe
IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together.
IPC to Host Workshops on U.S. Export Controls
Training to help manufacturers comply with U.S. export control rules
U.S.
IPC Hand Soldering Competition Winner Crowned at Global Industrie/Midest 2019
In conjunction with Global Industrie/Midest and SNESE, IFTEC and IPC conducted the first regional European qualification for the IPC Hand Soldering Competition in Lyon, France on March 5-8, 2019.
IPC Issues Electronics Industry Warning on Printed Board Microvia Reliability for High Performance Products
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products.