IPC and i4.0 Today to Host i4.0 Connect Forum
Sixty-six percent of manufacturing companies say that their leadership does not have a clear vision for the digital future. As manufacturing moves toward the Smart Factory and Industry 4.0, IPC and i4.0 Today will offer members of the electronics industry an opportunity to learn about the technology and future surrounding Industry 4.0 with a two-day i4.0 Connect Forum, to take place in Silicon Valley, Calif., November 6-7.
"According to statistics, the Industry 4.0 market is projected to reach $152 billion by 2020,” said David Bergman, IPC vice president of standards and training. “Augmented reality, artificial intelligence, robotics, additive manufacturing, and IPC CFX are just a few of the technologies taking us toward Industry 4.0 and the Smart Factory. What does this mean for the electronics industry? What are the benefits and how does it all come together? The i4.0 Connect Forum will address these questions and provide first-hand knowledge from industry leaders who are working to achieve smart manufacturing practices."
Featuring speakers from Siemens, Saline Lectronics, and Koh Young Technology, the i4.0 Connect Forum will provide attendees with first-hand knowledge of the experiences, challenges and solutions industry leaders are taking to achieve truly smart manufacturing. “In a time of rapid and fundamental growth in the manufacturing industry, this Forum will provide insight into how robotics, artificial intelligence and other technologies are creating an Industry 4.0 movement in electronics manufacturing,” added Bergman.
“This event will give attendees an opportunity to listen, learn and contribute towards achieving Industry 4.0 standards, and gain knowledge directly from the experts who will be there to share their experiences. This is a must attend event to help keep you at the forefront of Industry 4.0 in electronics” added Mike Nelson, Group President for i4.0 Today.
For more information on i4.0 Connect Forum or to register, visit www.ipc.org/i4.0-Connect.