IPC Conference Paper Archive

The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent .. leer más

Many of the latest SMT assemblies for hand held devices like cell phones present a challenge to process and manufacturing engineers with the introduction of miniature components such as .3 mm C .. leer más

Many articles have been published indicating that 60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct .. leer más

The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products,with increased functionality and smaller form factor,the boundari .. leer más

Trace impedances are specified and controlled on PCBs as their nominal impedance value and variations are key factors in establishing system I/O bus performance. PCB trace impedances are evalua .. leer más

Signal integrity analysis has shown that printed circuit board (PCB) insertion loss is a key factor affecting high speed channel performance. Determining and controlling PCB insertion loss have .. leer más

As a result of heightened requirements for quality,integrity and reliability of electronic products,the role of wafer auditing and nondestructive testing of printed circuit boards and electroni .. leer más

In PCB industry,Optical Inspection has been grown rapidly in past decades. It is now playing an important role in manufacturing process. Most manufacturers are now using AOI machines to report .. leer más

The paper discusses on the problems faced by the Assembly,Test Manufacturing (ATM) plants of Intel Corporation for a certain Tape and Reel Process. The problem is generic across the other siste .. leer más

According to Prismark Partners,the use of QFNs is growing faster than any package type except for flip-chip CSPs. Prismark projects that by 2013,32.6 billion QFNs will be assembled worldwide,wh .. leer más

Solder voiding in ball grid array (BGA) solder joints has been well characterized and documented in IPC-A-610 and IPC- 7095 which define industry recommended BGA solder workmanship criteria and .. leer más

• Inspection of integrated power electronics = sophisticated test task • X-ray inspection based on 2D / 2.5D principles not utilisable • Full 3D inspection with adapted image capturing and reco .. leer más

An evaluation of four FR4 laminates in commonly used stack-ups was done to determine their survivability for the Pb-free HASL process followed by a worst case Pb-free manufacturing environment .. leer más

Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembly of RoHS comp .. leer más

The continuous progression toward portable,high frequency microelectronic systems has placed high demands on material performance,notably low dielectric constants (Dk),low loss tangent (Df),low .. leer más

In this paper,we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package .. leer más

While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff .. leer más

No-clean soldering processes dominate the commercial electronics manufacturing world. With the explosion of growth in handheld electronics devices,manufacturers have been forced to look for way .. leer más

In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC .. leer más

1. What is BIST 2. What is DSL 3. DSL test items 4. Digital & Analog DSL test 5. BIST on DSL 6. Comparison & Benefits .. leer más

Boundary-scan (1149.1) technology was originally developed to provide a far easier method to perform digital DC testing to detect intra-IC interconnect assembly faults,such as solder shorts and .. leer más

For many years there has been a huge disconnect between the engineers that design the assembly and the chemists responsible for developing the assembly materials. In short,engineers and chemist .. leer más

As we progress in the 21st century,electronics manufacturing will need more and more precision. Parts will get more complex since more components have to be assembled in smaller spaces. Circuit .. leer más

Round Robin Reliability Evaluation “Revival” Proposal 1.TR-579 2.IST( IPC-9151/TM 2.6.26) 3.HATS (IPC-9151) 4.CITC(EIT) 5.TS(TM650-2.6.7.2B,MIL31032/1C) 6. Application(Odometer ) .. leer más

We describe the design of a novel test structure,to which we have given the name “HD”,that will facilitate the evaluation of blind and buried microvias in printed circuit boards,in comparison w .. leer más

What We Achieved: Current Proposed OTC Model Rule Modifications • Vapor degreasing exempted from 25 g/L limit – NESHAP-like equipment & controls • 150 g/L VOC maximum for electronics assemblies .. leer más

Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative .. leer más

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component .. leer más

Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds .. leer más

As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s .. leer más

- Hot nitrogen technology for local inerting system of wave soldering machines has proved to give significant advantages with Tin Lead or Lead free solders: - Better heat transfer on the PCBs,e .. leer más

Solid tantalum capacitors were introduced to the market more than five decades ago and continue to be widely used. Reliability issues arise when tantalum capacitors are exposed to excessive the .. leer más

Quad Flat Pack No Leads (QFNs) are thermally enhanced plastic packages that use conventional copper leadframe with wire bonded interconnects. . These leadless components provide an advanced pac .. leer más

Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d .. leer más

This paper presents systematic investigations on complete Through Hole filling for cores by a Cu electroplating process as an alternative to the common paste plugging process. This electro plat .. leer más

The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias was once relatively small,and focused on specialized applications in the military and high end comp .. leer más

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Recent environmental concerns over the safety of the halogenated flame retardants (HFR) used in commonplace FR4 printed circuit boards (PCB) have prompted market demand for HFR-free computer sy .. leer más

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In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free) within the Client Market space (Desktop and Notebook computers) iNEMI init .. leer más

Developing low-cost alternatives to near-eutectic SAC alloys for Pb-free assembly is crucial to continue producing affordable electronics products. Metals prices,especially silver,have been on .. leer más

Board-level drop test performance was evaluated and compared for the following four different solder combinations in BGA/CSP assembly: 1) SnPb paste with SnPb balls,2) SnPb paste with SAC105Ti .. leer más

This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints,which has direct relevance to ball grid arrays (BGA) and high density interconnect structures. Th .. leer más

The overall effectiveness of 20 circuit board assembly processes,made up of 4 solder/flux combinations and 6 cleaning processes was investigated by using in-situ surface insulation resistance m .. leer más

With the advent of RoHS and WEEE and the concern of some companies to eliminate halogen-containing compounds from their products,it is vital to have an understanding of halogen compounds and ho .. leer más

Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: .. leer más

As the need for electronics,electronic components and printed circuit boards becomes more important; the testing of products for these industries becomes a critical component. New materials,new .. leer más

Functional circuit test (FCT) of circuit boards and end products in a high volume (>1000 units per day) production environment presents challenging technical,logistic and cost obstacles that ar .. leer más

The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec .. leer más

The latest status of new ED copper foil developments is presented: ultra-flat profile for high speed digital boards and ultra-thin foil for finest pitch applications. Copper surface roughness h .. leer más