IPC Blog | IPC International, Inc.

Survey: How Smart are Your Manufacturing Processes?

IPC has partnered with Auburn University to conduct a study on behalf of the Department of Defense (DoD) that can significantly help our nation’s manufacturing industries, and

IPC Goes Deep on Advanced Packaging in 2022

Message to policymakers on requirements for building a more robust, domestic ecosystem for advanced electronics

Matt Kelly Promoted to Chief Technology Officer and Vice President, IPC Technology Solutions

Congratulations to Matt Kelly on his promotion to Chief Technology Officer and Vice President, Technology Solutions.

Kelly Scanlon Promoted to IPC Lead Sustainability Strategist for Industry Sustainability Programs

Congratulations to IPC’s Kelly Scanlon, DrPH, CIH, on her promotion to lead sustainability strategist for industry sustainability programs

E-Mobility Conference 2022: IPC APEX EXPO

e-Mobility is a challenging new paradigm for electronics design. Regardless of industry, automotive, two-wheeler, vertical takeoff and landing (VTOL), rail, or marine, e

U.S. Election Results a Mixed Bag for Electronics Industry

The results are in from the recent U.S. federal election, and the impacts on the electronics manufacturing industry are likely to be mixed.

CHIPS Act Implementation Must Be About More than Just Chips

The U.S. Government must actively encourage the expansion of the advanced packaging ecosystem, supply-chain partnerships, and industry-backed workforce programs if it wants to

The U.S. Government Needs to Embrace a Silicon-to-Systems Approach

The bipartisan CHIPS and Science Act of 2022 is launching a new era of leadership for U.S. semiconductor manufacturing and related industries. However, rebuilding the advanced

International PCB Designer Community Steps Up to Compete

Forty-eight printed board designers from around the world have registered to compete in the IPC Design Competition 2023

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