TLP Member Interviews
TLP Chair Mike Carano interviews TLP Member Matt Holzmann, CGI Americas. Holzmann discusses the future of the electronics industry, supply chain disruptions and resiliency, geopolitical and trade challenges, and consequences of not tackling challenges head on.
TLP Chair Mike Carano interviews TLP Member Denny Fritz, Fritz Consulting. Industry veteran and IPC Hall of Famer, Fritz discusses workforce development, technology roadmaps, electronic interconnect manufacturing, defense electronics, lead-free, and more.
TLP Chair Mike Carano interviews TLP Member Payman Dehghanian, Ph.D., George Washington University. Dr. Dehghanian discusses George Washington University SmartGrid Laboratory’s research and development solutions to enhance smart electricity grids.
TLP Chair Mike Carano interviews TLP Member Joe O’Neil, Green Circuits. O’Neil addresses the future of the electronics manufacturing industry: automation, standardization, emerging technologies, and more.
TLP Chair Mike Carano interviews TLP Member Carol Handwerker, Ph.D., Purdue University. Dr. Handwerker covers materials science, microelectronics, advanced packaging, economic and environmental sustainability and how industry can work together to develop a viable supply chain.
TLP Chair Mike Carano interviews TLP Member Savita Ganjigatti, Sienna Ecad Technologies. Ganjigatti addresses printed circuit board fabrication and design, emerging technologies, evolution of PCB design, designing for manufacturability and workforce development, training and cross-functional knowledge.
TLP Chair Mike Carano interviews TLP Member Roger Franz, TE Connectivity. Franz discusses the evolution of electronics, electronics materials, substances in electronics and product environmental compliance.
TLP Chair Mike Carano interviews TLP Member Bryan Erwin, BlueWave Merchant Partners. Erwin discusses trade policy, export-led employment, U.S. competitiveness and creating a level business playing field.