IPC Conference Paper Archive

The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHS directive. Certification to the QC 080000,the IECQ HSPM Specification,addresses the other 5 Hazardo .. read more

Planar microvoids have been observed on second level interconnections between solder metallizations and copper lands on PCB boards with immersion silver surface finish. These planar microvoids .. read more

For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me .. read more

boards in the in-line aqueous cleaning process. As lead-free circuit boards become more complex and component spacing decreases,the effectiveness of direct blow-off drying is greatly diminished .. read more

As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi .. read more

This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca .. read more

A perplexing challenge for RoHS compliance is adapting large,complex and thick,high-layer count multilayers to lead-free assembly. These are typically dense,complex assemblies with large BGAs a .. read more

As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must be considered. One process that is often over looked is the cleaning of .. read more

With the latest legislations from RoHS and WEEE dominating the horizon of the PCB landscape there is a need for manufacturers and their suppliers to understand their impacts. The requirement to .. read more

Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) and its predecessor WEEE directiv .. read more

A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints. Components,with leads finished with nickel-palladium-gold (NiPdAu) .. read more

The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini .. read more

As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase seen in the amount of studies performed for electronics assemblies sold .. read more

This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle designed to resemble real world manufacturing applications. Four different Pb-free a .. read more

The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process. The largest changes are in the reflow process,as Pb-free pastes requ .. read more