IPC Conference Paper Archive

This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili .. read more

Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased driving a .. read more

Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l .. read more

1.Obtain suggestions from the solder manufactures Low-Ag SAC Paste •Increase in reflow temp •Impact on thermal fatigue and wetting Sn-Bi low-temp Paste •Impact on shock strength •Creep fatigue .. read more

SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs .. read more

The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin .. read more

Conclusions: •Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity. •Lead-free BGAs: The statistical analysis and th .. read more

With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho .. read more

As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look .. read more

TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materia .. read more

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive component .. read more

As the use of lead-free alloys has increased in electronic assemblies,much work has been done to develop Design for Manufacturability (DFM) guidelines for the new materials. However,there are s .. read more

The Surface Mount Technology (SMT) industry has been faced with several challenges in the past decades. Two of the most recent ones are RoHS compliant lead-free assembly and the adoption of fin .. read more

The increased temperatures associated with lead free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes,are commonly fil .. read more

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology. .. read more

Although lead-free soldering has been main stream in the industry since 2006,with the replacement of eutectic SnPb system by the Sn/Ag/Cu system,the development of drop-in lead-free alternative .. read more

The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre .. read more

SAC105 was shown to have better drop shock reliability than SAC305 however SAC105 thermal cycle performance was not necessarily as good at SAC305. Small quantities (0.1% or so) of some elements .. read more

Continental is using the IPC solder spread coupon (adopted from NPL) to evaluate Pb-free solder pastes and PCB surface finishes for Solderability. This presentation will compare and contrast so .. read more

Accelerated testing of plated hole life is necessary for economic reasons due to the long time to failure during field operating conditions. One difficulty in performing accelerated testing on .. read more

An important element of the High Density Packaging Users Group (HDPUG) Consortium investigation into the reliability of printed wiring board (PWB) constructed with 20 different Pb-free mater .. read more

Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st .. read more

Two different temperature cycling profiles were used to compare the thermal fatigue reliability of Pb free and SnPb solder joints in 16 different,high strain surface mount (SMT) packages. In so .. read more

The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids .. read more

With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010 .. read more

Most of electronic components on a printed circuit board assembly (PCBA) are surface mount components assembled using solder paste material. Having a good solder paste material is very critical .. read more

•Overview •Test Method Considerations •Proposed Test Methodology •PCB,Stencil & Part Information •Pick-up Adapter Design •Test Setup Overview •Head-in-Pillow Defect Detection •Test Parameters • .. read more

•Background and Objective •Head-in-Pillow (HiP) Defect •In Circuit Test (ICT) Testability •Evaluation Steps - Solder Paste Selection - Head-in-Pillow Test - Printability & Solderability Test .. read more

To help address the environmental requirements driven by the European Union RoHS Directive,consumer applications have changed the solder alloys for the manufacturing of printed circuit board as .. read more

•Board-level drop shock test was performed on 9 assemblies –63 parts / board –Parts representative of military package styles •Assembled on Pb-free compatible laminate with SAC 305 solder •Sele .. read more

The lead-free directive from the EU has created a number of challenges for high reliability electronic applications. Key among those challenges is the need to address the issue of tin whiskers. .. read more

This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the .. read more

The use of an Organic Metal finish only a few nano-meters deposited onto copper pads of printed circuit boards provides effective protection against oxidation and preserves solderability. The N .. read more

Mechanical shock testing was conducted by Boeing Research and Technology (Seattle) for the NASA-DoD Lead-Free Electronics Solder Project. This project is follow-on to the Joint Council on Aging .. read more

Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00 .. read more

• The standard covers marking and labellingof both tin-lead and lead-free components,boards and solders used in 2ndlevel assembly. • Other areas covered include board base material type and sur .. read more

Thermal cycling tests were conducted using two different ceramic ball grid array (CBGA) test vehicles having balls comprised of nine different Pb free solder alloys. The experiment was designed .. read more

In this study,the reliabilities of low Ag SAC alloys doped with Mn or Ce (SACM or SACC) were evaluated under JEDEC drop,dynamic bending,thermal cycling,and cyclic bending test conditions agains .. read more

Some ball grid array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or SAC405 (4% Ag) to alloys with lower silver contents. There are numerous perceived reliability benefits to .. read more

The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material .. read more

Recently,the industry has seen the development of a wide range of new Pb-free alloys. A significant element of uncertainty within the industry regarding these new alloys is the lack of defined .. read more

Lead-free flux technology for electronic industry is mainly driven by high soldering temperature,high alloy surface tension, miniaturization,air soldering due to low cost consideration,and envi .. read more

Pad cratering in Printed Circuit Boards (PCBs) is typically associated with lead-free products. This paper addresses laminate materials and the failures associated with the higher Pb-Free reflo .. read more

For many of the Pb-free solders required under the European RoHS directive,there is now sufficient information,primarily in the form of the results of accelerated thermal cycling of various lev .. read more

This presentation discusses critical material properties and test data that are often overlooked in the introduction of new lead-free solder alloys,but are critical to alloy comparison and the .. read more

This paper will explore the most common alternatives to hot air-leveled solder (HASL) as a finish for flex circuits and some of the issues one may want to be aware of when converting. Whether t .. read more

- History & Importance of PCB - Environmental Initiatives - Reliability Consideration With High Temp Processing - Reliability Considerations for Materials to withstand Lead-Free Assembly .. read more

Although lead free assembly is now widely adopted the industry is still exploring a variety of options for lead free alloys. Attempts to standardize on a single alloy for either reflow or wave .. read more

At present there are a large number of materials that have been proposed as replacements for lead containing solder for reflow and wave and selective soldering. Unlike solder paste in a reflow .. read more

Little data has been generated on the performance of lead-free solders under vibration and mechanical shock. What data exists suggests that lead-free solders may be less reliable than eutectic .. read more