Conformal Coating Evaluation Test Development
Description
The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases.
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Event
IPC APEX EXPO 2021
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop Shock Resistance
Description
DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock performance.
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Event
IPC APEX EXPO 2021
Evaluating Solder Joint Failures and Solder Joint Reliability: A Side-by-Side Comparison of Direct Current and Microwave Based Monitoring Techniques
Description
Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circuits.
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Event
IPC APEX EXPO 2021
Use of Photonic Soldering to Rework Chip Components
Description
Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where many passives must be removed and replaced without damaging or de-soldering adjacent components.
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Event
IPC APEX EXPO 2021
Board Thickness Effect on Accelerated Thermal Cycle Reliability
Description
This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehicles of 4 different thicknesses from .040 to .125 inch thick that are otherwise identical for IPC 9701 test
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Event
IPC APEX EXPO 2021
Powering The Internet of Things
Description
This Slide Show Utilizes the Cover Paper from the session.
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Event
IPC APEX EXPO 2021
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
Description
This slide show discusses inverters and power electronics for Heavy Machinery. There is discussion of Wide Band Gap Powered Devices. The purpose is increased efficiency gains. A new material, silicone carbide, is discussed. The capabilities of this material is presented.&n
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Event
IPC APEX EXPO 2021
Wide Bandgap (WBG) Power Electronics for Heavy-Duty Vehicles
Description
This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics
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Event
IPC APEX EXPO 2021
Packaging and Manufacturability Considerations for Strategic Power Applications
Description
All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications they serve.
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Event
IPC APEX EXPO 2021
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Description
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new technology isnow fully introduced to the market and will continue to rapidly expand due to very high demand.
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Event
IPC APEX EXPO 2021
TLPS Z-Axis Interconnect Solutions for Thermal Transfer and Electrical Connection in PCBs
Description
The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment.
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Event
IPC APEX EXPO 2021
Thermally Conductive and Electrically Insulative Multi-functional Film Adhesives for Assembling High-power Density Devices
Description
In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but also offer additional features to address electrical and thermal requirements to improve device reliability
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Event
IPC APEX EXPO 2021
Thermal Materials for Packaging Power Electronics
Description
Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C.
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Event
IPC APEX EXPO 2021
Solid Liquid Hybrid TIMs
Description
For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solution, especially for challenging applications.
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Event
IPC APEX EXPO 2021
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Description
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion.
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Event
IPC APEX EXPO 2021
Enig – Corrosion: The Status, The Risks and The Solutions
Description
The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is the nature of the gold plating step to include an immersion reaction.
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Event
IPC APEX EXPO 2021
PCB Reliability Evaluation for 0.92 mm Pitch Field Programmable Gate Array (FPGA) Applications
Description
Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provide greater functionality of the different I/O blocks in optimized FPGA devices.
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Event
IPC APEX EXPO 2021
Emerging Supply Chain Cybersecurity Requirements, Government Acronyms, and Actual Security
Description
Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC) and its impending impact on Supply Chain Security.
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Event
IPC APEX EXPO 2021
IPC-1791, Cybersecurity Maturity Model Certification (CMMC), and the Printed Circuit Board Design, Fabrication, and Assembly Industry
Description
This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the United States Munitions List (USML) that are vulnerable to theft, tampering, and supply disruption.
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Event
IPC APEX EXPO 2021
CyberSecurity Concerns for the Printed Circuit Board Industry
Description
This slide show discusses the cybersecurity risks associated with network integration. The supply chain is the most vulnerable, especially sub suppliers. A particular risk is when bad actor suppliers build in controlling components by changing the Gerber file. This allows worms
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Event
IPC APEX EXPO 2021
Present Company Not Excluded – New Cybersecurity Regulations Will Affect Your Business (and make it safer)
Description
Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual property and controlled unclassified information (CUI) is stolen very year by foreign adversaries.
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Event
IPC APEX EXPO 2021
Circuit Board Security Vulnerabilities and Counteractions
Description
Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks.
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Event
IPC APEX EXPO 2021
DoD Cybersecurity: Where We Are Now and What Needs to Be Done to Be Compliant
Description
This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically help secure their Operational Technology (OT).
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Event
IPC APEX EXPO 2021
Microvia Process Guidelines
Description
High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circuits.
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Event
IPC APEX EXPO 2021
IPC/IMEC/ESA Microvia TV IST Test Results
Description
This slide show discusses Automation of IST testing. It utilizes Dielectric estimation laminate assessment method (DELAM). The slides utilizes thermo-graphics to locate the failure in microvias. The microvias are tested using IST standard X design and Reflow cycling. &nbsp
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Event
IPC APEX EXPO 2021
Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction
Description
The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly detrimental to system performance.
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Event
IPC APEX EXPO 2021
Solve BGA VIPPO Failures with Advanced Materials
Description
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicker PCBs with higher part densities.
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Event
IPC APEX EXPO 2021
Semi-AdditivePCBProcessing: Process, Reliability Testing andApplications
Description
The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators.
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Event
IPC APEX EXPO 2021
Thermal Improvement in 3D Embedded Modules Using Copper Bar Vias
Description
The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution.
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Event
IPC APEX EXPO 2021
FIDES, Reliability Assessment of Electronics: A New Approach to the LeadFree Process Factor
Description
The reliability control in airborne electronics products is essential due to safety and business reasons.
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Event
IPC APEX EXPO 2021
Failure Analysis Cases Studies on Solder De-Wetting For Electronics Products
Description
Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work it has been found that around 25 percent of all case studies have been due to de-wetting issues.
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Event
IPC APEX EXPO 2021
Analyzing Printed Circuit Board Voiding and other Anomalies when Requirements Covering the Anomalies are Vague
Description
Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period.
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Event
IPC APEX EXPO 2021
A Framework for Large-Scale AI-Assisted Quality Inspection Implementation in Manufacturing Using Edge Computing
Description
In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing.
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Event
IPC APEX EXPO 2021
The Case for an Electronics Supply Chain Blockchain
Description
Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized for providing "greater transparency, enhanced security, improved traceability, increased efficiency and sp
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Event
IPC APEX EXPO 2021
Enriching Test Equipment Analytics with Structured Logging
Description
Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a part meets its requirements or to troubleshoot failures if they occur.
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Event
IPC APEX EXPO 2021
A Guide to Manufacturing Data Analytics
Description
Data is the New Oil
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Event
IPC APEX EXPO 2021
Advanced, Non-Real-Time Uses of Machine Data for Factory Operational Improvement
Description
EMS factories have collected and used machine data for many decades.
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Event
IPC APEX EXPO 2021
A Structured Approach for Providing well-formed Maintenance Data for SMT Machines
Description
Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important.
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Event
IPC APEX EXPO 2021
IPC/IMEC/ESA Microvia TV Introduction
Description
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structures, including air-to-air thermal shock, convection reflow assembly simulation and current induced thermal
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Event
IPC APEX EXPO 2021
Implementing a Global Machine Data Collection System Across Many EMS Factories
Description
As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance.
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Event
IPC APEX EXPO 2021
Implementation of IPC CFX Using Surface Mount Legacy Equipment
Description
The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners.
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Event
IPC APEX EXPO 2021
The Role for Automation and Robotics in Electronics Manufacturing
Description
Why use robotics?
Precision -> improved quality
Consistency -> improved quality
Traceability -> improved quality
Dexterity -> to handle the parts
Robust -> reliability for multi shift operations
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Event
IPC APEX EXPO 2021
Working with Augmented Realityin Electronics Manufacturing
Description
This paper discusses the automation of inspection using Augmented Reality (AR). Machine vision is used to find small components since it reduces the amount of time needed for inspection. Augmented reality overlays the information from the design onto the PCB under the lens.&nbsp
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Event
IPC APEX EXPO 2021
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
Description
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structures, including air-to-air thermal shock, convection reflow assembly simulation and current induced thermal
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Event
IPC APEX EXPO 2021
IPC/IMEC/ESA Microvia TV CITC Test Results
Description
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Results
Relative Life of the 3 HDI microvia structures provided
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Event
IPC APEX EXPO 2021
Process Improvement Strategies for Weak Microvia Interfaces
Description
The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive components have been soldered to the board.
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Event
IPC APEX EXPO 2021
The Complete Path to Least Resistance
Description
The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on PWBs and coupons during reflow assembly revealed that thermal excursions fractured microvias.
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Event
IPC APEX EXPO 2021
Microvia Weak Interfacial Fracture of Microvia Designs-Comparing the Reliability of Graphite-based Direct Metallization and Conventional Electroless Copper-Phase 1
Description
Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface between the plated copper and the blind via the target pad.
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Event
IPC APEX EXPO 2021
Technology Verification for Reliable Smart Surfaces
Description
The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well as simplified assembly. The benefits are especially suited for automotive interior use cases.
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Event
IPC APEX EXPO 2021
Addressing the Changing Landscape of Automotive Electronic Designs: Improving Performance and Robustness Through Proper Material Choice
Description
The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the automotive industry is also being linked to advanced electronics.
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Event
IPC APEX EXPO 2021