IPC Conference Paper Archive

Description The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. .. read more

Description DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock performance. .. read more

Description Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circuits. .. read more

Description Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where many passives must be removed and replaced without damaging or de-soldering adjacent components. .. read more

Description This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehicles of 4 different thicknesses from .040 to .125 inch thick that are otherwise identical for IPC 9701 test .. read more

Description This Slide Show Utilizes the Cover Paper from the session.   .. read more

Description This slide show discusses inverters and power electronics for Heavy Machinery.  There is discussion of Wide Band Gap Powered Devices.  The purpose is increased efficiency gains.  A new material, silicone carbide, is discussed.  The capabilities of this material is presented.&n .. read more

Description This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics    .. read more

Description All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications they serve. .. read more

Description Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new technology isnow fully introduced to the market and will continue to rapidly expand due to very high demand. .. read more

Description The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. .. read more

Description In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but also offer additional features to address electrical and thermal requirements to improve device reliability .. read more

Description Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. .. read more

Description For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solution, especially for challenging applications. .. read more

Description Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. .. read more

Description The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is the nature of the gold plating step to include an immersion reaction. .. read more

Description Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provide greater functionality of the different I/O blocks in optimized FPGA devices. .. read more

Description Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC) and its impending impact on Supply Chain Security. .. read more

Description This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the United States Munitions List (USML) that are vulnerable to theft, tampering, and supply disruption. .. read more

Description This slide show discusses the cybersecurity risks associated with network integration.  The supply chain is the most vulnerable, especially sub suppliers.  A particular risk is when bad actor suppliers build in controlling components by changing the Gerber file.  This allows worms .. read more

Description Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual property and controlled unclassified information (CUI) is stolen very year by foreign adversaries. .. read more

Description Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks. .. read more

Description This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically help secure their Operational Technology (OT). .. read more

Description High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circuits. .. read more

Description This slide show discusses Automation of IST testing.  It utilizes Dielectric estimation laminate assessment method (DELAM).  The slides utilizes thermo-graphics to locate the failure in microvias.  The microvias are tested using IST standard X design and Reflow cycling.  &nbsp .. read more

Description The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly detrimental to system performance. .. read more

Description Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicker PCBs with higher part densities. .. read more

Description The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. .. read more

Description The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. .. read more

Description The reliability control in airborne electronics products is essential due to safety and business reasons. .. read more

Description Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work it has been found that around 25 percent of all case studies have been due to de-wetting issues. .. read more

Description Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. .. read more

Description In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing. .. read more

Description Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized for providing "greater transparency, enhanced security, improved traceability, increased efficiency and sp .. read more

Description Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a part meets its requirements or to troubleshoot failures if they occur. .. read more

Description Data is the New Oil .. read more

Description EMS factories have collected and used machine data for many decades. .. read more

Description Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important. .. read more

Description This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structures, including air-to-air thermal shock, convection reflow assembly simulation and current induced thermal .. read more

Description As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance. .. read more

Description The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners. .. read more

Description Why use robotics? Precision -> improved quality Consistency -> improved quality Traceability -> improved quality Dexterity -> to handle the parts Robust -> reliability for multi shift operations .. read more

Description This paper discusses the automation of inspection using Augmented Reality (AR).   Machine vision is used to find small components since it reduces the amount of time needed for inspection.  Augmented reality overlays the information from the design onto the PCB under the lens.&nbsp .. read more

Description This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structures, including air-to-air thermal shock, convection reflow assembly simulation and current induced thermal .. read more

Description IPC/IMEC/ESA Microvia TV CITC Outline  CITC Coupon and Test Plan Overview  CITC Test Introduction  Temperature Coefficient of Resistance (TCR) Test and Results  Relative Life of the 3 HDI microvia structures provided .. read more

Description The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive components have been soldered to the board. .. read more

Description The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on PWBs and coupons during reflow assembly revealed that thermal excursions fractured microvias. .. read more

Description Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface between the plated copper and the blind via the target pad. .. read more

Description The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well as simplified assembly. The benefits are especially suited for automotive interior use cases. .. read more

Description The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the automotive industry is also being linked to advanced electronics. .. read more