Transmission Line Basics,Why Use 'Em At All
Description
It is not often understood that when electrical signals travel along a wire or trace --- they reflect. Always! We intuitively understand that when we send audio waves across a room,a field or a canyon,they reflect.
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Event
IPC Printed Circuits Expo 2002
Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias
Description
If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias.
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Event
IPC Printed Circuits Expo 2002
Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?
Description
Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly.
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Event
IPC Printed Circuits Expo 2002
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Description
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published test requirements for products at high humidity at elevated temperatures.
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Event
IPC Printed Circuits Expo 2002
TDR and VNA Techniques for PCB Characterization
Description
A uniform transmission line is described electrically by a characteristic impedance and a time delay. From the length of the line and the time delay,the effective dielectric constant can be extracted.
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Event
IPC Printed Circuits Expo 2002
Tapping the Hidden Potential for Quality Improvement and Cost Reduction in PCB Manufacturing
Description
Automation,change and complexity have become the normal working environment in the PCB market.
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Event
IPC Printed Circuits Expo 2002
Strategy for Deriving Maximum Profits by Inventory Minimization
Description
Inventory has been a hotly debated topic in many organizations. Since inventory is directly visible in company financials,there is a high degree of sensitivity to excessive inventory levels in the management ranks.
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Event
IPC Printed Circuits Expo 2002
Solid Solder Deposit (SSDs),For Advanced Packaging Applications
Description
Solid Solder Deposit (SSD) technology was developed in the early and mid-1990's to improve first pass yields in the manufacture of electronic devices.
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Event
IPC Printed Circuits Expo 2002
Reengineered Conductive Polymers - The PTH Alternative to Electroless Copper for HDI Mass Production
Description
In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu.
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Event
IPC Printed Circuits Expo 2002
Processing Thin Core Capacitor Materials
Description
Processing thin core capacitor materials can be challenging,particularly those with non-reinforced dielectric less than 0.001” thick. Several processing steps require special attention to ensure the material is not damaged during manufacturing.
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Event
IPC Printed Circuits Expo 2002
PCB Laser Technology for Rigid and Flex HDI - Via Formation,Structuring,Routing
Description
A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vector data software. This system can be used for drilling,cutting and structuring.
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Event
IPC Printed Circuits Expo 2002
PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting
Description
Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting.
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Event
IPC Printed Circuits Expo 2002
Optical Packaging and Interconnection - A New Wave?
Description
The market for optical communication equipment and components has grown significantly since the early 1980s with growth rates exceeding 50% annually in the late 1990s. Although demand has dropped significantly since 2000,the underlying drivers for demand are still operating.
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Event
IPC Printed Circuits Expo 2002
Optical Interconnection Technology on the Printed Circuit Board Level
Description
An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time a significant improvement on the electromagnetic compatibility (EMC) can be achieved.
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Event
IPC Printed Circuits Expo 2002
Novel Base Material for Microvias in PWBs by Using Unique Glass Fiber
Description
The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight.
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Event
IPC Printed Circuits Expo 2002
Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering
Description
The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are part of the OEMs’ specification given to the board manufacturer.
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Event
IPC Printed Circuits Expo 2002
New State-of-Art Dry Film Technology for Fine Lines in High Yield
Description
Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding
fine line requirements.
Advantages for volume production of fine features below 50?m with high yield are now available with newly
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Event
IPC Printed Circuits Expo 2002
New Positive Working Dry Film Resist
Description
We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen functionality,and a
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Event
IPC Printed Circuits Expo 2002
A New Lamination Method: Heating the Laminates Through Metal Separators Equipped with Electrical Heating Medium
Description
Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain
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Event
IPC Printed Circuits Expo 2002
SI - A Multifunctional Polyimide for Use in Flex Circuitry
Description
Polyimides have proven their performance in electronic applications demanding high strength,increased durability,
broader temperature ranges and exceptional chemical resistance. They serve as the material of choice for fabricating
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Event
IPC Printed Circuits Expo 2002
Fully Automated,Clean Manufacturing Environment for High Yield Ultra Fine Line (UFL) Production
Description
??Machine Technology designed for the manufacture of Ultra Fine Line product
??Machine design provides clean production environment
??Latest State of the Art,Horizontal Wet Processing Equipment
??Intelligent Machines with high levels of automation,self cleaning
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Event
IPC Printed Circuits Expo 2002
Making Better Decisions on the Plant Floor using SCADA Systems
Description
With the printed circuit board becoming increasingly complex,there is an ever-growing need to implement
manufacturing standards that ensure high productivity at even higher yields. Factors such as operator error and
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Event
IPC Printed Circuits Expo 2002
Low Transmission Loss Cyanate Ester Materials with Loose Cross-Linked Structure
Description
A new thermosetting resin system with modified cyanate ester resins having a loose cross-linked structure and
alloyed with polymers was developed to provide low dielectric constant (Dk) and low dissipation factor (Df)
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Event
IPC Printed Circuits Expo 2002
Latest Developments in Integrated Polymer Photonic Waveguides in PWB's
Description
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities for very high speed applications. The challenge of opto-electronics and integration of photonics down onto the printed circuit
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Event
IPC Printed Circuits Expo 2002
Laser Drilling MicroVias
Description
There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integrity,PCB reliability,quality,and meet the overall thickness constraints of the application.
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Event
IPC Printed Circuits Expo 2002
Laser Drillable Prepreg Alternative to Coated Copper for HDI Applications
Description
There is a contingent in the industry that feels reinforced substrates are needed to meet the performance
requirements of HDI microvia technology. Concerns that non-reinforced resin coated foils,or non-woven substrates,
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Event
IPC Printed Circuits Expo 2002
Laser Direct Structuring as an Innovative Alternative for Traditional Lithography
Description
The combination of high speed and accuracy laser beam deflection,the know-how on wet chemical processes for
Printed Circuit Boards (PCB’s),as well as CAD/CAM implementation for Laser direct Structuring (LS) of PCB’s
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Event
IPC Printed Circuits Expo 2002
Laser Direct Imaging A Solution for Fine Line Imaging
Description
The electronics market demands for smaller,faster,more reliable and less costly products continues to fuel major
changes in printed wiring board designs. Higher layer counts,increasing circuit densities and HDI technologies have
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Event
IPC Printed Circuits Expo 2002
Laminate Materials with Low Dielectric Properties
Description
Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with
improved dielectric properties. This paper focuses on new laminate materials with potential uses in multilayer
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Event
IPC Printed Circuits Expo 2002
The Influence of Fluid Dynamics on Plating Electrolyte for the Successful Production of Blind Micro-Vias: Laboratory Investigations Leading to Optimized Production Equipment
Description
Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper
ions into the vias. This mass transport limitation is demonstrated by a rough or even in extreme cases at high aspect
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Event
IPC Printed Circuits Expo 2002
Improving Yield and Profitability with Laser Drilled Blind Microvias
Description
Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1
currently dominating over photo defined,plasma etched and mechanically drilled methods. Processing speeds are
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Event
IPC Printed Circuits Expo 2002
Implementation of Embedded Resistor Trimming for PWB Manufacturing
Description
In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be
contained in smaller circuit areas requires that some of the passive components (resistors,capacitors,etc) are now
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Event
IPC Printed Circuits Expo 2002
HID's Technology Influence on Signal Integrity
Description
Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings
some interesting new solutions to age-old signal integrity (SI) concerns,and concerns that will grow as rise-times
continue to drop.
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Event
IPC Printed Circuits Expo 2002
Full-Wave Electromagnetic Simulation of PWB Structures
Description
Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis
and PWB simulation become nowadays very pressing and key issues. Taking into account these aspects,the
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Event
IPC Printed Circuits Expo 2002
An FEA Study of Image Transfer in Printed Wiring Boards
Description
A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the
board. This can lead to difficulties in forming the external circuitry. Typically,a number of identical boards are
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Event
IPC Printed Circuits Expo 2002
Experimental and Numerical Assessment of Plated Via Reliability
Description
This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing
or observed during manufacturing. Finite element models have been developed to help understand the effect of the
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Event
IPC Printed Circuits Expo 2002
Embedded Passives Technology Implementation in RF Applications
Description
Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed
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Event
IPC Printed Circuits Expo 2002
Embedded Optical Fiber
Description
The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical
fiber into PCBs.
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Event
IPC Printed Circuits Expo 2002
Embedded Mezzanine Capacitor Technology for Printed Wiring Boards
Description
A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and
implemented by Motorola in partnership with its PWB supply chain. The technology is based on the use of a
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Event
IPC Printed Circuits Expo 2002
Embedded Ceramic Resistors and Capacitors in PWB-Process and Design
Description
Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit
boards are presented and discussed. Evolution of design guidelines and processing for embedded ceramics is
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Event
IPC Printed Circuits Expo 2002
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Description
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out 1.4mm for voltages up to
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Event
IPC Printed Circuits Expo 2002
Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers
Description
This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional
chemical mediation of plating processes,this process is electrically mediated and does not rely on difficult to control
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Event
IPC Printed Circuits Expo 2002
The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance
Description
Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be several reasons for these differences:
???accuracy of the software used
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Event
IPC Printed Circuits Expo 2002
Dry Film Resist Stripping from Overplated Lines
Description
The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern
plating,because the plated metal height depends on the current density,which varies across the board,based on the
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Event
IPC Printed Circuits Expo 2002
Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture
Description
The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. The demand is for smaller,thinner,lighter,more reliable and,of course,cheaper devices.
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Event
IPC Printed Circuits Expo 2002
Digital Printing Systems for Printed Circuit Board Legends
Description
The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter
screening) is a major technological leap. Legend marking on printed circuit boards (PCB) is presently being
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Event
IPC Printed Circuits Expo 2002
Developmental Halogen-Free High Performance Dielectric Substrates (with Different Reinforcement Supports) for the PCB/HDI and High-Frequency Applications
Description
This paper presents a comparison of several resin systems on different support reinforcements including on
Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems compared in this paper
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Event
IPC Printed Circuits Expo 2002
Design Considerations Affecting the Measured Capacitance of Embedded Singulated Capacitors
Description
The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors.
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Event
IPC Printed Circuits Expo 2002
Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach
Description
Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for
a particular product. Many programs simply default to a standard test without much quantitative analysis. With
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Event
IPC Printed Circuits Expo 2002
Cost-Effective Laminate Materials Made by Continuous Lamination Using Thermosetting Polymer Alloys (TPA) for Microwave and High Speed Applications
Description
Utilizing continuous lamination techniques,new materials are being developed to meet demanding market
requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effective products that
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Event
IPC Printed Circuits Expo 2002