Welcome to IPC's collection of technical papers presented at conferences since 2002. You can search by author, title and keyword. You can also search for keywords and topics in the Tag field. Access to the papers is reserved for IPC members.

Transmission Line Basics,Why Use 'Em At All

Description It is not often understood that when electrical signals travel along a wire or trace --- they reflect. Always! We intuitively understand that when we send audio waves across a room,a field or a canyon,they reflect. .. read more
Author(s)
Douglas Brooks
Event
IPC Printed Circuits Expo 2002

Three Reasons Why You Should Design Your Next Product With Laser Drilled Micro-Vias

Description If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. .. read more
Author(s)
Wallace Doeling
Event
IPC Printed Circuits Expo 2002

Thermal Reliability of Printed Wiring Boards: What's Coming From the OEM?

Description Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. .. read more
Author(s)
Dave Coppens
Event
IPC Printed Circuits Expo 2002

Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing

Description Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published test requirements for products at high humidity at elevated temperatures. .. read more
Author(s)
Bob Neves
Event
IPC Printed Circuits Expo 2002

TDR and VNA Techniques for PCB Characterization

Description A uniform transmission line is described electrically by a characteristic impedance and a time delay. From the length of the line and the time delay,the effective dielectric constant can be extracted. .. read more
Author(s)
Eric Bogatin Ph.D.
Event
IPC Printed Circuits Expo 2002

Tapping the Hidden Potential for Quality Improvement and Cost Reduction in PCB Manufacturing

Description Automation,change and complexity have become the normal working environment in the PCB market. .. read more
Author(s)
Ingrid Gudenas
Event
IPC Printed Circuits Expo 2002

Strategy for Deriving Maximum Profits by Inventory Minimization

Description Inventory has been a hotly debated topic in many organizations. Since inventory is directly visible in company financials,there is a high degree of sensitivity to excessive inventory levels in the management ranks. .. read more
Author(s)
Marjorie Green,Mischa Dick
Event
IPC Printed Circuits Expo 2002

Solid Solder Deposit (SSDs),For Advanced Packaging Applications

Description Solid Solder Deposit (SSD) technology was developed in the early and mid-1990's to improve first pass yields in the manufacture of electronic devices. .. read more
Author(s)
JoAnne DeBlis
Event
IPC Printed Circuits Expo 2002

Reengineered Conductive Polymers - The PTH Alternative to Electroless Copper for HDI Mass Production

Description In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. .. read more
Author(s)
Tom Thieme
Event
IPC Printed Circuits Expo 2002

Processing Thin Core Capacitor Materials

Description Processing thin core capacitor materials can be challenging,particularly those with non-reinforced dielectric less than 0.001” thick. Several processing steps require special attention to ensure the material is not damaged during manufacturing. .. read more
Author(s)
Bob Greenlee
Event
IPC Printed Circuits Expo 2002

PCB Laser Technology for Rigid and Flex HDI - Via Formation,Structuring,Routing

Description A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vector data software. This system can be used for drilling,cutting and structuring. .. read more
Author(s)
Dr. Dieter J. Meier,Stephan H. Schmidt
Event
IPC Printed Circuits Expo 2002

PWB Final Surface Treatment Process and Film Characteristics that Satisfy Lead-free Solder Mounting

Description Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. .. read more
Author(s)
M. Kubo,S. Hashimoto,Donald Gudeczauskas
Event
IPC Printed Circuits Expo 2002

Optical Packaging and Interconnection - A New Wave?

Description The market for optical communication equipment and components has grown significantly since the early 1980s with growth rates exceeding 50% annually in the late 1990s. Although demand has dropped significantly since 2000,the underlying drivers for demand are still operating. .. read more
Author(s)
Mike Campbell,Mark Hutton,Mike Warren
Event
IPC Printed Circuits Expo 2002

Optical Interconnection Technology on the Printed Circuit Board Level

Description An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time a significant improvement on the electromagnetic compatibility (EMC) can be achieved. .. read more
Author(s)
Elmar Griese
Event
IPC Printed Circuits Expo 2002

Novel Base Material for Microvias in PWBs by Using Unique Glass Fiber

Description The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight. .. read more
Author(s)
Wataru Ueno,Mikiya Fujii,Yoshiharu Suzuki,Shin Kasai
Event
IPC Printed Circuits Expo 2002

Next Generation Pb-free Immersion Finishes,Methodologies used to Determine Coating Thickness and the Impact of Thickness Variations and Rework on Soldering

Description The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are part of the OEMs’ specification given to the board manufacturer. .. read more
Author(s)
Kuldip Johal,Sven Lamprecht
Event
IPC Printed Circuits Expo 2002

New State-of-Art Dry Film Technology for Fine Lines in High Yield

Description Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding fine line requirements. Advantages for volume production of fine features below 50?m with high yield are now available with newly .. read more
Author(s)
Toru Takahashi
Event
IPC Printed Circuits Expo 2002

New Positive Working Dry Film Resist

Description We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen functionality,and a .. read more
Author(s)
Chiaki Iwashima,Takeya Hasegawa,Genji Imai
Event
IPC Printed Circuits Expo 2002

A New Lamination Method: Heating the Laminates Through Metal Separators Equipped with Electrical Heating Medium

Description Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain .. read more
Author(s)
Young Guin Seo,Myung C. Chu
Event
IPC Printed Circuits Expo 2002

SI - A Multifunctional Polyimide for Use in Flex Circuitry

Description Polyimides have proven their performance in electronic applications demanding high strength,increased durability, broader temperature ranges and exceptional chemical resistance. They serve as the material of choice for fabricating .. read more
Author(s)
Lisa A. Scott,Nancy Holloway
Event
IPC Printed Circuits Expo 2002

Fully Automated,Clean Manufacturing Environment for High Yield Ultra Fine Line (UFL) Production

Description ??Machine Technology designed for the manufacture of Ultra Fine Line product ??Machine design provides clean production environment ??Latest State of the Art,Horizontal Wet Processing Equipment ??Intelligent Machines with high levels of automation,self cleaning .. read more
Author(s)
Gerold Muller-Ensslin
Event
IPC Printed Circuits Expo 2002

Making Better Decisions on the Plant Floor using SCADA Systems

Description With the printed circuit board becoming increasingly complex,there is an ever-growing need to implement manufacturing standards that ensure high productivity at even higher yields. Factors such as operator error and .. read more
Author(s)
John L. Holm
Event
IPC Printed Circuits Expo 2002

Low Transmission Loss Cyanate Ester Materials with Loose Cross-Linked Structure

Description A new thermosetting resin system with modified cyanate ester resins having a loose cross-linked structure and alloyed with polymers was developed to provide low dielectric constant (Dk) and low dissipation factor (Df) .. read more
Author(s)
Shigeo Sase,Yasuyuki Mizuno,Daisuke Fujimoto,Nozomu Takano,Toshiyuki Iijima,Harumi Negishi,Takeshi Sugimura
Event
IPC Printed Circuits Expo 2002

Latest Developments in Integrated Polymer Photonic Waveguides in PWB's

Description Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities for very high speed applications. The challenge of opto-electronics and integration of photonics down onto the printed circuit .. read more
Author(s)
Happy Holden
Event
IPC Printed Circuits Expo 2002

Laser Drilling MicroVias

Description There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integrity,PCB reliability,quality,and meet the overall thickness constraints of the application. .. read more
Author(s)
Gil White,Rajesh Kumar,Simon Contreras,Ken Philips,Ron Weddell
Event
IPC Printed Circuits Expo 2002

Laser Drillable Prepreg Alternative to Coated Copper for HDI Applications

Description There is a contingent in the industry that feels reinforced substrates are needed to meet the performance requirements of HDI microvia technology. Concerns that non-reinforced resin coated foils,or non-woven substrates, .. read more
Author(s)
John Huckaba
Event
IPC Printed Circuits Expo 2002

Laser Direct Structuring as an Innovative Alternative for Traditional Lithography

Description The combination of high speed and accuracy laser beam deflection,the know-how on wet chemical processes for Printed Circuit Boards (PCB’s),as well as CAD/CAM implementation for Laser direct Structuring (LS) of PCB’s .. read more
Author(s)
Eddy Roelants
Event
IPC Printed Circuits Expo 2002

Laser Direct Imaging A Solution for Fine Line Imaging

Description The electronics market demands for smaller,faster,more reliable and less costly products continues to fuel major changes in printed wiring board designs. Higher layer counts,increasing circuit densities and HDI technologies have .. read more
Author(s)
Joseph A. Wheeler
Event
IPC Printed Circuits Expo 2002

Laminate Materials with Low Dielectric Properties

Description Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with improved dielectric properties. This paper focuses on new laminate materials with potential uses in multilayer .. read more
Author(s)
Jyoti Sharma,Marty Choate,Steve Peters
Event
IPC Printed Circuits Expo 2002

The Influence of Fluid Dynamics on Plating Electrolyte for the Successful Production of Blind Micro-Vias: Laboratory Investigations Leading to Optimized Production Equipment

Description Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper ions into the vias. This mass transport limitation is demonstrated by a rough or even in extreme cases at high aspect .. read more
Author(s)
Bert Reents,Stephen Kenny
Event
IPC Printed Circuits Expo 2002

Improving Yield and Profitability with Laser Drilled Blind Microvias

Description Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1 currently dominating over photo defined,plasma etched and mechanically drilled methods. Processing speeds are .. read more
Author(s)
Larry W. Burgess,William G. Langley
Event
IPC Printed Circuits Expo 2002

Implementation of Embedded Resistor Trimming for PWB Manufacturing

Description In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be contained in smaller circuit areas requires that some of the passive components (resistors,capacitors,etc) are now .. read more
Author(s)
Andrei Naumov,Anton Kitai,Phil Tibbles
Event
IPC Printed Circuits Expo 2002

HID's Technology Influence on Signal Integrity

Description Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings some interesting new solutions to age-old signal integrity (SI) concerns,and concerns that will grow as rise-times continue to drop. .. read more
Author(s)
Happy Holden
Event
IPC Printed Circuits Expo 2002

Full-Wave Electromagnetic Simulation of PWB Structures

Description Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis and PWB simulation become nowadays very pressing and key issues. Taking into account these aspects,the .. read more
Author(s)
Paul Svasta,Norocel-Dragos Codreanu,Ciprian Ionescu,Virgil Golumbeanu
Event
IPC Printed Circuits Expo 2002

An FEA Study of Image Transfer in Printed Wiring Boards

Description A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the board. This can lead to difficulties in forming the external circuitry. Typically,a number of identical boards are .. read more
Author(s)
Phil Greenfield,John Andresakis,Bahgat Sammakia
Event
IPC Printed Circuits Expo 2002

Experimental and Numerical Assessment of Plated Via Reliability

Description This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing or observed during manufacturing. Finite element models have been developed to help understand the effect of the .. read more
Author(s)
Mudasir Ahmad,Sue Teng,Mason Hu,Mark Brillhart
Event
IPC Printed Circuits Expo 2002

Embedded Passives Technology Implementation in RF Applications

Description Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed .. read more
Author(s)
John Savic,Robert T. Croswell,Aroon Tungare,Greg Dunn,Tom Tang,Robert Lempkowski,Max Zhang,Tien Lee
Event
IPC Printed Circuits Expo 2002

Embedded Optical Fiber

Description The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical fiber into PCBs. .. read more
Author(s)
Yutaka Doi
Event
IPC Printed Circuits Expo 2002

Embedded Mezzanine Capacitor Technology for Printed Wiring Boards

Description A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and implemented by Motorola in partnership with its PWB supply chain. The technology is based on the use of a .. read more
Author(s)
Robert Croswell,John Savic,Max Zhang,Aroon Tungare,Juergen Herbert,Kota Noda,Wolfgang Bauer,Peter Tan
Event
IPC Printed Circuits Expo 2002

Embedded Ceramic Resistors and Capacitors in PWB-Process and Design

Description Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit boards are presented and discussed. Evolution of design guidelines and processing for embedded ceramics is .. read more
Author(s)
John J. Felten,Saul Ferguson
Event
IPC Printed Circuits Expo 2002

Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance

Description Various requirements have developed for printed wiring boards regarding the minimum spacing between features. Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out 1.4mm for voltages up to .. read more
Author(s)
Karl Sauter
Event
IPC Printed Circuits Expo 2002

Electrically Mediated Pulse Reverse Copper Plating of Electronic Interconnects without Brighteners/Levelers

Description This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional chemical mediation of plating processes,this process is electrically mediated and does not rely on difficult to control .. read more
Author(s)
E. J. Taylor,J. Sun,L. Gebhart,B. Hammack,C. Davidson,M. Brown
Event
IPC Printed Circuits Expo 2002

The Effect of Etch Taper,Prepreg and Resin Flow of the Value of the Differential Impedance

Description Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be several reasons for these differences: ???accuracy of the software used .. read more
Author(s)
Alan Staniforth,Martyn Gaudion
Event
IPC Printed Circuits Expo 2002

Dry Film Resist Stripping from Overplated Lines

Description The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern plating,because the plated metal height depends on the current density,which varies across the board,based on the .. read more
Author(s)
Martin Hill
Event
IPC Printed Circuits Expo 2002

Direct Laser Drillable Ultra Thin Copper Foils for Advanced PCB Manufacture

Description The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. The demand is for smaller,thinner,lighter,more reliable and,of course,cheaper devices. .. read more
Author(s)
Mike Hacker
Event
IPC Printed Circuits Expo 2002

Digital Printing Systems for Printed Circuit Board Legends

Description The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter screening) is a major technological leap. Legend marking on printed circuit boards (PCB) is presently being .. read more
Author(s)
Scott A. Cote
Event
IPC Printed Circuits Expo 2002

Developmental Halogen-Free High Performance Dielectric Substrates (with Different Reinforcement Supports) for the PCB/HDI and High-Frequency Applications

Description This paper presents a comparison of several resin systems on different support reinforcements including on Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems compared in this paper .. read more
Author(s)
David K. Luttrull,Fred E. Hickman III,Joseph Bauler
Event
IPC Printed Circuits Expo 2002

Design Considerations Affecting the Measured Capacitance of Embedded Singulated Capacitors

Description The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. .. read more
Author(s)
David R. McGregor
Event
IPC Printed Circuits Expo 2002

Defining Accelerated Test Requirements for PWBs: A Physics-Based Approach

Description Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for a particular product. Many programs simply default to a standard test without much quantitative analysis. With .. read more
Author(s)
Kevin D. Cluff,Michael Osterman
Event
IPC Printed Circuits Expo 2002

Cost-Effective Laminate Materials Made by Continuous Lamination Using Thermosetting Polymer Alloys (TPA) for Microwave and High Speed Applications

Description Utilizing continuous lamination techniques,new materials are being developed to meet demanding market requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effective products that .. read more
Author(s)
Robert Konsowitz
Event
IPC Printed Circuits Expo 2002