Oxidation Resistant Nano-Cu Sintering Paste for Die Attach Applications
Description
A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance.
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Event
IPC APEX EXPO 2019
Fluxes Suppressing Non-Wet-Open at BGA Assembly
Description
With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs.
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Event
IPC APEX EXPO 2019
Size Matters - The Effects of Solder Powder Size on Solder Paste Performance
Description
Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics.
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Event
IPC APEX EXPO 2014
Interconnect Reliability Correlation with System Design and Transportation Stress
Description
Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment.
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Event
IPC APEX EXPO 2019
Multiphysics Design for Thermal Management to Increase Radar Capabilities
Description
Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high power components but restrictions on size, weight, and power have restricted their effectiveness.
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Event
IPC APEX EXPO 2019
Realization of a New Concept for Power Chip Embedding
Description
Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top side are mounted in hand held devices.
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Event
IPC APEX EXPO 2019
Stretchable Hybrid Electronics (S.H.E.) Constructions Based on a Novel Thermosetting Polymer System
Description
This presentation covers Stretchable hybrid electronics. Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices. Thermosetting resins are used in the layers of the flexible electronics. A new thermosetting resin is
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Event
IPC APEX EXPO 2019
Next-Generation Additive Electronics -Precise Multi-Material Deposition for Circuits, Electro-Mechanical Parts and Antennas
Description
This presentation covers additive manufacturing and the direct deposit of multiple metals. This additive capability is best utilized for the production of complicated circuits such as Radar and antennas. There are a lot of potential uses for additive manufacturing including prototypin
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Event
IPC APEX EXPO 2019
Additive Manufacturing of a Heat Exchanger for a Radar System
Description
The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead times.
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Event
IPC APEX EXPO 2019
The Effects of Filler Morphology on The Fracture Toughness of Thermally Conductive Adhesives
Description
Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into one product.
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Event
IPC APEX EXPO 2019
Silicone Thermally Conductive Grease: Improving Thermal Management of Electronic Assemblies
Description
The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one problem: heat dissipation.
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Event
IPC APEX EXPO 2019
High and Matched Refractive Index Liquid Adhesives for Optical Device Assembly
Description
There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other smart devices.
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Event
IPC APEX EXPO 2019
Optimising Solder Paste Volume for Low Temperature Reflow of BGA Packages
Description
The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower process temperatures.
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Event
IPC APEX EXPO 2019
Low Temperature SMT Solder Evaluation
Description
The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional Sn3Ag0.5Cu (SAC305)solder. The many possible advantages and some disadvantages / challenges are discussed.
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Event
IPC APEX EXPO 2019
Developments in Electroless Copper Processes to Improve Performance in am SAPMobile Applications
Description
With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnect (HDI)products migrating away from the current subtractive processes towards a more technically adept tech
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Event
IPC APEX EXPO 2019
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
Description
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor technology and applications roadmaps.
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Event
IPC APEX EXPO 2019
Approaches to Overcome Nodules and Scratches on Wire Bondable Plating on PCBs
Description
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when inspected under 20X magnification.
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Event
IPC APEX EXPO 2019
Development and Classification of Conductive Circuitry for E-textiles
Description
This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologies deployed to develop a robust and commercial solution.
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Event
IPC APEX EXPO 2019
Bladder Inflation Method for Mechanical Testing of Stretchable Electronics and Wearable Devices
Description
The advent of electronic materials with the potential to undergo extreme deformation while maintaining conductivity has led to the development of advanced stretchable electronic systems. These systems have applications in vital industries ranging from consumer products to medicine and defense.
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Event
IPC APEX EXPO 2019
Additive Manufacturing for Next Generation Microwave Electronics and Antennas
Description
The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications.
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Event
IPC APEX EXPO 2019
Insertion Loss Performance Differences Due to Plated Finish and Different Circuit Structures
Description
Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upon frequency, circuit thickness, and design configuration.
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Event
IPC APEX EXPO 2019
A Novel Electroless Nickel Immersion Gold (ENIG) Surface Finish for Robust Solder Joints and Better Reliability of Electronic Assemblies
Description
Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures.
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Event
IPC APEX EXPO 2019
Surface Treatment Enabling Low Temperature Soldering to Aluminum
Description
The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates.
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Event
IPC APEX EXPO 2019
Approaching FCT with Low-Cost Modular and Fully Integrated Test Fixtures
Description
Constant increases in feature density of printed circuit board assemblies (PCBA) has highlighted the importance of functional circuit test (FCT) systems in a manufacturing process.
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Event
IPC APEX EXPO 2019
The Next RF Probing Challenge: IoT and 5G
Description
IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).In this paperwe would like to demonstrate how to successfully use passive coaxial probes for power level and
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Event
IPC APEX EXPO 2019
Creating Reusable Manufacturing Tests for High-Speed I/O with Synthetic Instruments
Description
There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps.
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Event
IPC APEX EXPO 2019
Copper Filled Microvias - The New Hidden Threat Links of Faith Are Not Created Equally
Description
Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch adjacent copper layers with paths that meander on the layers between the microvias.
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Event
IPC APEX EXPO 2019
Impact of Assembly Cycles on Copper Wrap Plating
Description
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because
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Event
IPC APEX EXPO 2019
Smart Molded Structures Bring Surfaces to Life
Description
This paper introduces structural electronics technology enabling smart molded structures.
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Event
IPC APEX EXPO 2019
Development of Flexible Hybrid Electronics
Description
Flexible hybrid electronics (FHE) refer to a category of flexible electronics that are made through a combination of traditional assembly process of electronic components with the high-precision ink printing technologies. By integrating silicon components with printed inks and flexible subs
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Event
IPC APEX EXPO 2019
Additive Manufacturing-Enabled Wireless Flexible Hybrid Electronics for Brain-Machine Interfaces
Description
Inherent variation among human brains causes difficulty in the design of electroencephalography (EEG)-enabled universal brain-machine interfaces (BMI). Existing EEG systems suffer from inconsistent signal quality, while requiring many rigid wires and metal electrodes on a hair cap.
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Event
IPC APEX EXPO 2019
Low Temperature Soldering: Thermal Cycling Reliability Performance
Description
The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering.
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Event
IPC APEX EXPO 2019
New-Generation, Low-TemperatureLead-Free Solder for SMT Assembly
Description
Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temperature increases.
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Event
IPC APEX EXPO 2019
PCB Manufacturing for Electronics Megatrends
Description
The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life.
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Event
IPC APEX EXPO 2019
Assembly Challenges of Die and Die-Size BGAs
Description
This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level Land Grid Array (eWLP-LGA), and Copper-Pillar Flip-Chip (CP-FC) die—all with daisy-chain patterns to enable
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Event
IPC APEX EXPO 2022
Board Level Reliability Testing of RF Packages
Description
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a supplier, this must be accompanied with board level reliability data to ensure assembly and field reliability.
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Event
IPC APEX EXPO 2022
High Temperature Thermal Cycling Reliability Testing of a High Reliability Lead-free Solder Alloy
Description
In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working environments. Traditional thermal cycling tests have used 40°C to +125°C for automotive type applications.
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Event
IPC APEX EXPO 2022
Sputtered Seed Layer on Substrates with High Organic Load to enable Advanced L/S Densities and more Precise Feature Geometries
Description
Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps.
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Event
IPC APEX EXPO 2022
Qualification Protocols for A Sustainable and Innovative Release Aid Within the PCB & CCL Laminating Press Process.
Description
PCB (Printed Circuit Board) and CCL (Copper Clad Laminates) industries are facing environmental issues and cost reduction challenges. Consumable release sheets are an important aid for many demanding lamination processes of those industries.
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Event
IPC APEX EXPO 2022
Manufacturing of Low-Cost Wearable Vital Sign Monitoring Devices
Description
Wireless wearable devices can continuously assess and communicate the condition of patients and are crucial components of digital mobile health platforms.
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Event
IPC APEX EXPO 2022
Design, Fabrication and Testing of an RFID Tag with Security Features for Authentication and Tamper Resistance
Description
To demonstrate the benefits of flexible hybrid technology (FHE) and printed electronics the team of Lockheed Martin Rotary Missions Systems Owego (LMO), Lockheed Martin Space Systems Billerica (LMB) and SUNY Binghamton University (BU) have designed and demonstrated a security RFID tag that utiliz
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Event
IPC APEX EXPO 2022
Designing and Manufacturing Flexible Hybrid Electronic Wearable Chemical Sensors
Description
Real-time and in-situ monitoring of the air-quality of confined spaces is a life-saving technology for commercial and government maintenance workers and is conspicuously absent from the commercial market.
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Event
IPC APEX EXPO 2022
CFX Performance Mapping – Methods to Qualify, Validate and Control Acceptable Levels of Flux and Other Residues
Description
The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware.
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Event
IPC APEX EXPO 2016
The Gap Dilemma in the Technical Cleanliness of Electronic Assemblies – Why Foreign Object Debris on Electronic Assemblies is not bringing the Modern World to a Halt
Description
Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electronic assemblies, FOD can cause deleterious effects related to manufacturing (e.g.
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Event
IPC APEX EXPO 2022
A Critical Evaluation of ROSE Testing as Compared to SIR for Monitoring PCB Cleanliness
Description
Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into the industry's concept of electrochemical reliability.
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Event
IPC APEX EXPO 2022
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
Description
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation due to surface roughness of copper has become a dominant factor.
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Event
IPC APEX EXPO 2022
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
Description
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OEMs to adopt this technology to keep up with the competition, but also shaped new requirements regarding the
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Event
IPC APEX EXPO 2022
Influence of Process Parameters on Inkjet Printing of Silver Conductive Traces for Digital Additive Manufacturing of Flexible Electronics
Description
The results of a NextFlex project addressing barriers that are preventing inkjet printing from being adopted for prototyping and volume manufacturing of printed circuits, are presented. These barriers include resolution, thickness, reliability and endurance.
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Event
IPC APEX EXPO 2022
Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding Dynamic Twisting and Battery Lamination
Description
The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources.
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Event
IPC APEX EXPO 2022
Electromechanical Testing of Flexible Hybrid Electronics
Description
Printed conductors and interconnects on compatible flexible or stretchable substrates are the foundation of flexible hybrid electronic systems that may include conventional silicon-based devices, discrete components, and printed radio frequency components such as microstrip lines, coplanar wavegu
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Event
IPC APEX EXPO 2022