U.S. export control rules have changed significantly in the last decade, and more change is expected over the next few years as policymakers tackle the treatment of emerging and foundational technologies and respond to geopolitical developments.
IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together. IPC offers a new technical education course, Process and Acceptability Requirements: Utilizing J-STD-001 and IPC-A-610 Together, to provide instruction on how best to use these documents jointly.
Employment in the European electronics sector is expected to grow according to a new study by Oxford Economics released today by IPC—Association Connecting Electronics Industries®. Such a trend would exacerbate issues created by an existing shortage of skilled workers according to our members.
Registration is now open for the 2025 WHMA Annual Global Leadership Summit, the industry’s only annual executive networking event for the cable and wire harness manufacturing industry including manufacturers, their suppliers, and customers.
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis.
IPC announces a pivotal opportunity for California employers under the Employment Training Panel (ETP) program. This initiative provides significant financial support for customized job skills training, reducing costs and enhancing the competencies of the workforce in today's challenging market.
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
IPC’s statistical programs for the global electronics manufacturing services (EMS), assembly equipment and solder industries are now open to new participants for 2019. The deadline for IPC members to sign up is April 1. Participating companies receive quarterly market data at no cost. Participation is free to IPC-member companies as a benefit of membership.
In conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
IPC announced today the August 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.27.