Join us for FREE e-textiles presentations and virtual demonstrations from around the world! Visit the event website for complete details.
Join us for FREE e-textiles presentations and virtual demonstrations from around the world! Visit the event website for complete details.
John Mike Carano, RBP Chemical Technolgy, for a webinar hosted by IPC’s Thought Leaders Program, “Defect Resolution in Manufacturing,” for an interactive discussion.
Matt Kelly, IPC's chief technologist, along with other industry experts, will present at "Heading Towards Industry 4.0" virtual conference panel on Friday, October 15 at 8:00 am to 9:00 CT. Matt will cover Industry 4.0 implementation and overcoming barriers and challenges to implementation.
IPC HAND SOLDERING COMPETITION 2021
At productronica, Messe Muenchen, Munich, Germany,
16-19 November 2021
Hall #A2 – Stand# A2.300
Join IPC President and CEO John Mitchell and alliantgroup’s Jenn Groff for an informative session and discussion on the latest updates to powerful tax credits and incentives for IPC members, manufacturers, and suppliers.
Over the past 29 years, the WHMA Annual Wire Harness Conference has become one of few investments that give an opportunity to learn, grow, share, and discover new approaches to many aspects of the wire harness industry. The conference features a number of timely presentations on topics important to wire harness manufacturers, OEMs and suppliers. It also includes peer-to-peer networking, best-practices roundtables and a tradeshow with industry leading suppliers. It’s a conference you do not want to miss!
Join us for FREE e-textiles presentations and virtual demonstrations from around the world! Visit the event website for complete details.
Join us for FREE e-textiles presentations and virtual demonstrations from around the world! Visit the event website for complete details.
USPAE and IPC would like to invite you to participate in an IC substrate workshop planned for May 16, 2024, in Washington, D.C. The workshop will further IPC’s work on a U.S. Department of Defense-funded project to study and recommend approaches to addressing the country’s lack of IC substrate manufacturing capabilities.