We’re excited to launch Industry Intelligence Insights, your new go-to resource for the latest research, trends, and expert analysis shaping the global electronics manufacturing industry.
On July 17, IPC and iNEMI (the International Electronics Manufacturing Initiative, a not-for-profit R&D consortium focused on future technology requirements) hosted a webinar to recap a four-hour in-person workshop held in June at the Electronics Goes Green conference in Berlin.
The core of IPC’s strategy lies in an industry-driven talent pipeline. A talent pipeline is a systematic and strategic approach to identifying, attracting, developing, and retaining skilled individuals to ensure a steady supply of qualified candidates. It includes proactive measures such as offering training programs, building relationships with educational institutions, raising awareness among potential candidates, and implementing apprenticeship programs
In mid-July, IPC’s Vice President of Education David Hernandez and Director of Workforce Partnerships Cory Blaylock, traveled to Washington, D.C. to tackle one of the most pressing issues in the electronics manufacturing industry: workforce development.
IPC's Global Insight editorial team would like to thank the 186 Global Insight readers who took the time to respond to our readership survey.
By John Perry, Director of Printed Board Standards & Technology
It has been well known that for many years IPC has provided a trio of performance classifications in its suite of standards and specifications for the design, fabrication, assembly and acceptance of printed boards and printed board assemblies.
John Mitchell, IPC president and CEO, extends a special invitation to IPC APEX EXPO 2018.
https://www.youtube.com/watch?v=r-xcKwdz9iU&feature=youtu.be
IPC President and CEO John Mitchell and IPC Vice President of Global Government Relations Chris Mitchell talk to PCB Chat host and Circuits Assembly and Printed Circuit Design & Fab Editor-in-Chief Mike Buetow about key government programs and initiatives and why it’s important for members to participate in lobbying efforts.
Listen to podcast:
https://upmg.podbean.com/e/pcb-chat-episode-12-john-mitchell-and-chris-mitchell/
IPC-7621 offers cost-effect alternative to potting
IPC announces a new standard, IPC-7621, Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics, a guidance document that offers instruction on using Low Pressure Molding (LPM) in place of potting for circuitry encapsulation.
Unlike potting, where the potting vessel becomes the outer “shell” of the encapsulated part, LPM utilizes mold tooling which is removable and re-usea
https://youtu.be/AMcZMMdMxEk
IPC president and CEO John Mitchell discusses the skills gap in the manufacturing industry and IPC’s efforts to address the issue.