2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future
The 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off today with a grand opening ceremony in Shang
IPC Recommends Greater Focus on Electronics Needed for US-based AI Data Centers
New white paper serves as a blueprint for strengthening PCB assembly capabilities in the United States
A new white paper from IPC, “AI-based Data Centers for the United States: Technologies, Supply Chains, and Resiliency Gaps,” explores the actions needed to
North American PCB Industry Sales Up 35 Percent in August
IPC releases PCB industry results for August 2024
IPC announced today the August 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.
IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board.
North American PCB Industry Sales Down 21.2 Percent in July
IPC Releases PCB industry results for July 2024
IPC announced today the July 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.99.
Latest Advancements in High-Reliability Electronics Focus of 2024 IPC High Reliability Forum
Forum co-located with IPC Builds, IPC standards development committee meetings
Ensuring reliability in high-voltage electronics, a new standardized test method for abrasion resistance of e-textiles, and assembly and solder joint X-ray challenges are just a few of technical conference topics offered at IPC’s