IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board.
IPC Relaunches New Website to Better Serve the Electronics Manufacturing Industry in Mexico and for Spanish Speakers Worldwide
IPC announces the relaunch of its IPC Mexico website, designed to better serve the needs of the electronics manufacturing industry in Mexico and for Spanish-speaking professionals worldwide.
IPC Announces New Board Members at IPC APEX EXPO 2024
At the 67th IPC Annual Meeting on April 9, held in conjunction with IPC APEX EXPO 2024, the IPC Board of Directors announced new officers and new and second-term members.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
Today’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors.
Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC
Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced pack
European EMS Market Grew to a Record Level in 2023 But May Experience Challenges in 2024
As revealed this week by an annual survey conducted by in4ma and sponsored by IPC Electronics Europe GmbH, the European electronics manufacturing services (EMS) industry experienced a robust 11 percent growth last year.