IPC Releases “J” Revisions to Two Leading Standards for Electronics Assembly

IPC J-STD-001 and IPC-A-610 cover printed board assembly process controls, materials, and post-assembly acceptance criteria for the electronics industry

IPC announces the release of revisions for two leading standards for the electronics assembly industry. IPC J-STD-001J, Requirements for Soldered Electrical and Electronic Assemblies is recognized as the sole industry-consensus standard for soldering processes and materials. IPC-A-610J, Acceptability of Electronic Assemblies, is a post-assembly acceptance standard used to ensure electronic assemblies meet acceptance requirements for the electronics industry. These two documents are often used together for the manufacture of electronic assemblies.

Revisions to these standards are completed every three years, with significant changes made to each one. Clear guidance on the use of the standard can be found in the first chapter of each document. Committee leaders addressed more than 1,350 comments for revision “J.” Some of the significant changes found in the standards are as follows:

Global changes implemented in both documents:

  • Removed redundant minimum electrical clearance references – covered in Chapter 1 of documents
  • Clarified the use and definition of wire, lead and conductor

Changes to IPC J-STD-001J (Representatives from 27 countries worked on the standard):

  • Added hardware installation requirements
  • Added graphics to address bubbles in X-ray images

Changes to IPC-A-610J (Representatives from 29 countries worked on the standard):

  • Chapter 10 has new images
  • Conformal coating – clarified voiding/bubbles

In addition to the new revisions for IPC J-STD-001J and IPC-A-610J, redline documents are also available. A white paper is available IPC-WP-028, Guidance on Objective Evidence for Validating the Acceptability of Bubbles in Conformal Coatings.