The latest revisions of these top-selling internationally recognized IPC standards address key processes and requirements to build electronics better.
IPC-A-610H, Acceptability of Electronic Assemblies, is the premier assemblies standard for the global electronics industry. Inspectors universally embrace its acceptance criteria and rely on IPC-A-610H’s “picture book-like” visual representation of requirements defined in this standard. Latest revision includes new component types and target criteria has been removed per industry requests. PURCHASE NOW
IPC-A-610H should be used in conjunction with IPC-J-STD-001H as both documents reference the other for assembly and soldering.
The standard is a collection of visual quality acceptability requirements for electronic assemblies. IPC-A-610H does not provide criteria for cross-section evaluation.
IPC-A-610H presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820 and J-STD-001.
The criteria in this standard are not intended to define processes to accomplish assembly operations nor is it intended to authorize repair/modification or change of the product. For instance, the presence of criteria for adhesive bonding of components does not imply/authorize/require the use of adhesive bonding and the depiction of a lead wrapped clockwise around a terminal does not imply/authorize/require that all leads/wires be wrapped in the clockwise direction.
Users of this standard should be knowledgeable of the applicable requirements of the document and how to apply them. IPC-A-610 has criteria outside the scope of J-STD-001 defining mechanical and other workmanship requirements.
Addendums to IPC-A-610 include Automotive and Telecom
IPC J-STD-001H, Requirements for Soldered Electrical and Electronic Assemblies, is the standard for process requirements on soldering electronic assemblies around the globe. IPC J-STD-001H is a must-have for those in the electronics industry with an interest in the process and acceptance criteria for electrical and electronic assemblies. Latest revision includes new component types and information on the use of x-ray. PURCHASE NOW
IPC J-STD-001H describes materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies. The intent of this document is to rely on process control methodology to ensure consistent quality levels during the manufacture of products. It is not the intent of this standard to exclude any procedure, such as for component placement or for applying flux and solder used to make the electrical connection.
The soldering operations, equipment, and conditions described in IPC J-STD-001H are based on electrical/electronic circuits designed and fabricated in accordance with the specifications.
IPC J-STD-001H prescribes material requirements, process requirements, and acceptability requirements for the manufacture of soldered electrical and electronic assemblies. For a more complete understanding of this document’s recommendations and requirements, one may use this document in conjunction with IPC-HDBK-001, IPC-AJ-820 and IPC-A-610. Standards may be updated at any time, including with the addition of amendments. The use of an amendment or a newer revision is not automatically required.
Addendums to IPC J-STD-001 include Space, Military, and Automotive
IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies, provides universally accepted process and acceptance requirements for cable and harness assemblies. It is the only industry-consensus standard on cable and wire harness and was developed by IPC and the Wire Harness Manufacturers Association (WHMA) (An affiliate of IPC). The latest version has removed target conditions, per industry requests. PURCHASE NOW
IPC/WHMA-A-620 prescribes practices and requirements for the manufacture of cable, wire, and harness assemblies. This standard does not provide criteria for cross-section or X-ray evaluation.
The illustrations in this document portray specific points noted in the title of each section. A brief description follows each illustration.
The development committee recognizes that different parts of the industry have different definitions for some terms used herein. For the purposes of this document, the terms cable and wire harness are used interchangeably.
IPC/WHMA-A-620 can be used as a stand-alone document for purchasing products, however it does not specify frequency of in-process inspection or frequency of product inspection. No limit is placed on the number of process indicators or the number of allowable repair/rework of defects.
IPC/WHMA-A-620 describes materials, methods, tests, and acceptability criteria for producing crimped, mechanically secured, or soldered interconnections and the related assembly activities associated with cable and harness assemblies.
The intent of IPC/WHMA-A-620 is to rely on process control methodology to ensure consistent quality levels during the manufacture of products.
Addendums t this standard include Space, Military
IPC-A-600K, Acceptability of Printed Boards, is the electronics industry’s global standard for acceptability requirements for printed boards. The illustrated guidance of IPC-A-600K provides requirements used by inspectors around the world. IPC-A-600K works well with IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards. IPC-A-600K, the latest version is updated to cover microvia target landing contact dimension and copper-filled vias. PURCHASE NOW
IPC-A-600 describes the target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set forth in various printed board specifications.
The visual illustrations in IPC-A-600 portray specific criteria of the requirements of current IPC specifications. In order to, properly apply and use the content of this document, the printed board should comply with the design requirements of the applicable IPC-2220 series document and the performance requirements of the applicable IPC-6010 series document. In the event the printed board does not comply with these or equivalent requirements, then the acceptance criteria should be as agreed between user and supplier.
IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards, provides the process requirements that engineers in all electronics manufacturing sectors call out to produce acceptable printed boards. IPC-6012E works well with IPC-A-600K, Acceptability of Printed Boards. IPC-6012E is updated to cover microvia target landing contact dimension and copper-filled vias. PURCHASE NOW
IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards.
The purpose of IPC-6012E is to provide requirements for qualification and performance of rigid printed boards based on the following constructions and/or technologies. These requirements apply to the finished product unless otherwise specified:
- Single-sided, double-sided printed boards with or without plated-through holes (PTHs).
- Multilayer printed boards with PTHs with or without buried/blind vias/microvias.
- Active/passive embedded circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components.
- Metal core printed boards with or without an external metal heat frame, which may be active or non-active.
Addendums for IPC-6012 include Space, Military, and Medical
IPC-4101E-WAM1, Specification for Base Materials for Rigid and Multilayer Printed Boards, are adopted by engineers worldwide to ensure the materials used in their products will meet the performance needs for their products. Additional slash sheets have been added to the latest version for new material types. PURCHASE NOW
IPC-4101E-WAM1 covers the requirements for base materials, herein referred to as laminate or prepreg, to be used primarily for rigid or multilayer printed boards for electrical and electronic circuits.
IPC-7711/21C, Rework, Modification and Repair of Electronic Assemblies, provides procedures for rework, repair and modification of boards and electronic assemblies. IPC-7711/21C features industry-approved guidelines that help engineers avoid costly scrap work. New cost-saving rework, repair and modification procedures have been added to the latest versions. PURCHASE NOW This document has an amendment make sure you have the base document IPC-7711/21C before purchasing the Amendment IPC-7711/21C-Am1
IPC-7711/21 covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated, and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of IPC. This includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria.
IPC-7711/21 does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.
IPC-7711/21 prescribes the procedural requirements, tools, materials, and methods to be used in the rework, repair, modification, overhaul, or restoration of electronic products. Although this document is based on the Product Class definitions used in IPC documents such as J-STD-001 or IPC-A-610, this document should be considered applicable to any type of electronic equipment.
IPC has identified the most common equipment and process to perform a specific repair or rework. It is possible that alternate equipment and processes can be used to make the same repair/rework. If alternate equipment or processes are used, it is up to the user to ensure the equipment/processes do not damage the assembly and meet the intent for the alternate equipment/processes utilized.