IPC Validation Services - Qualified Manufacturing Companies (QML) J-STD-001S Space/Military Addendum
IPC J-STD-001S: Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies supplements or replaces specifically identified requirements of IPC J-STD-001H requirements for soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments of getting to and operating in space and military applications.
The IPC Validation Services QML (Qualified Manufacturers List) is used to qualify EMS and OEM providers’ assembly processes to IPC standards.
Green Circuits, Inc.
1130 Ringwood Court
San Jose, CA. 95131
Tel: 877-865-9600
J-STD-001 Space/Military Addendum
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 8/3/2023 | 8/3/2023 | 8/3/2026 |
Capabilities
- Cleaning Process Capable
- Gold (Au) Removal Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: 0201's and 01005's
- Unique Surface Mount Component Types: Ball Grid Array and QFN's
- Wavesolder and Selective Solder Capable
STI Electronics, Inc.
261 Palmer Rd
Madison AL 35758-1727
256-461-9191
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 1/21/2015 | 6/10/2024 | 6/10/2027 |
IPC-1791
| Type 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Assembler | 6/14/2021 | 6/11/2024 | 6/11/2027 |
J-STD-001 Space/Military Addendum
| Initial Certificate Date | Listing Date | Expiration Date |
| 1/21/2015 | 6/10/2024 | 6/10/2027 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Gold (Au) Removal Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Internal Failure Analysis Lab Capabilities
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Pin Staking Capable
- Plated Through Hole Component Assembly
- PoP (Package on Package) Process Capable
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
- Wavesolder and Selective Solder Capable
Zentech Dallas, LLC
1717 Firman Drive; Suite 200
Richardson, TX 75043 USA
TEL. +1 972-907-2727
J-STD-001 Space / Military Addendum
| Initial Certificate Date | Listing Date | Expiration Date |
| 2/19/2021 | 12/07/2023 | 12/07/2026 |
A wholly owned subsidiary of Zentech Manufacturing, Inc.
Zentech Manufacturing
6980 Tudsbury Road
Baltimore, MD 21244
USA
Tel: +1 443-348-4500
J-STD-001 Space/Military Addendum
| Initial Certificate Date | Listing Date | Expiration Date |
| 9/9/2014 | 9/22/2023 | 9/22/2026 |