IPC Validation Services - Qualified Manufacturing Companies (QML) J-STD-001/610

IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001 standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.

IPC-A-610: Acceptability of Electronic Assemblies is the most widely used electronics assembly acceptance standard in the electronics industry. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry.

J-STD-001 is developed in synergy with IPC-A-610.

The IPC Validation Services QML (Qualified Manufacturers List) is used to qualify EMS and OEM providers’ assembly processes to IPC standards. 

The following companies have Qualified to J-001/610 QML
Advantech Japan co., Ltd. Nogata Board Factory, Nogata City, Fukuoka, Japan

Advantech Japan Co., Ltd. Nogata board Factory 
2770 Kamizakai Tobikuma
Nogata City, Fukuoka, Japan 822006
Tel: +81 949 22 2811

J-STD-001/IPC-A-610

SMT Line A, PTH/Wavesolder Line A

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 1/10/2024 1/10/2024 1/10/2027

Capabilities:

  • Conformal Coating Process Capable 
  • DFM (Design for Manufacturability) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wavesolder and Selective Solder Capable 
Alternative Manufacturing Inc. (AMI)

Alternative Manufacturing Inc. (AMI)
30B Summer St.
Winthrop, ME, 04364-1253 USA
207-377-9377

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 4/8/2015 4/15/2024 4/15/2027

Capabilities:

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays, Micro BGA (0.30-mm pitch), 0201’s
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
  • Wavesolder and Selective Solder Capable
  • Wire and Terminal Connection Process Capable
Askey Technology (Jiangsu) Ltd., Suzhou, P.R.C., Factory 2

Askey Technology (Jiangsu) Ltd.
Building #2
No. 1388 Jiaotong Road
Wujiang Economic Technological Development Area
Suzhou, Jiangsu, P.R.C. 215200
Tel: +86-512-63487188

IPC J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 9/7/2020 6/6/2023 6/6/2026

Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Unique Surface Mount Component Types: 0201’s and 01005’s
  • Wavesolder and Selective Solder Capable
Askey Technology (Jiangsu) Ltd., Suzhou, P.R.C., Factory 3

Askey Technology (Jiangsu) Ltd.
Building # 3 (SC01/DC01)
No.1388 Jiaotong Road
Wu Jiang Economic Technology Development Area
Jiangsu Province215200, P.R.C
Tel: +86-512-6348-7188

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 6/18/2015 7/15/2021 7/15/2024

Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Staking (Adhesive) and Encapsulation Capable
  • Wavesolder Capable
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Unique Surface Mount Component Types:  0201’s and 01005’s
AVIC XINXIANG AVIATION INDUSTRY (GROUP) Co., Ltd. Electronic Control Institute

AVIC XINXIANG AVIATION INDUSTRY (GROUP) Co., Ltd. Electronic Control Institute
No.168 Jianshe Road, Muye
Xinxiang, Henan Province, 453049
China

TEL: +0373-3862405

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 11/2/2022 11/2/2022 11/2/2025

Capabilities:

  • Conformal Coating Process Capable
  • Gold (Au) Removal Process Capable
  • Rework and Repair Process Capable
  • Standard Leaded (63/37) Assembly Process Capable
BCS Automotive Interface Solutions (Suzhou) Co., Ltd.

BCS Automotive Interface Solutions (Suzhou) Co., Ltd.
No. 2052, Taidong Road
Xiangcheng Economic Development District
Suzhou, Jiangsu Province
215143 China

IPC J-STD-001 / IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 1/25/2017 4/25/2023 4/25/2026

Capabilities

  • Conformal Coating Process Capable
  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Surface Mount Component Assembly
  • Plated Through Hole Component Assembly
  • Wavesolder and Selective Solder Capable
  • Process Validation
  • Statistical Process Control (SPC)
  • Unique Surface Mount Component Types: 0201's
  • Unique Surface Mount Component Types: Ball Grid Arrays
Canon Inc., Taiwan

Canon Inc.
NO.46, NO.48, 2F., NO.48, Dapumeiyuanqu 1ST RD. 
Dalin Township
Chiayi County, 622
Taiwan

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/08/2023 12/08/2023 12/08/2026

Capabilities

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable
Changzhou Bokang Electronics Co., Ltd., Changzhou, Jiangsu, China

Changzhou Bokang Electronics Co., Ltd.
65-15# Xinggang Road,
Zhonglou Zone

Changzhou, Jiangsu, China 213023
TEL. +1 3915080590

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/15/2020 12/12/2023 12/12/2026

Capabilities:

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: BGA
  • Wavesolder Capable
Chongqing Haier Intelligent Electronics Co., Ltd.

Chongqing Haier Intelligent Electronics Co., Ltd.
4F, Block A05
Haier Port City Industrial Park
Jiangbei District, Chongqing, 400026
China

www.haier.com

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 9/26/2022 9/26/2022 9/26/2025

Capabilities:

  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wave Solder Capable
Cincon Electronics Co., Ltd., Changhua County, Taiwan (R.O.C.)

Cincon Electronics Co., Ltd.
No. 8-1 Fugong Rd.,
Fuxing Township
Changhua, 50662
Taiwan
Tel: +88647690261
https://www.cincon.com

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/25/2021 8/25/2021 8/25/2024

Capabilities:

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable
DFI, Inc., Taoyuan City, Taiwan (R.O.C.)

DFI, Inc.
3F., No. 157, Shanying Road
Guishan District
Taoyuan City, 333424 Taiwan (R.O.C.)
Tel: +886 (3) 216-5058

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/22/2016 12/28/2021 12/28/2024

Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable
DongGuan Cincon Electronic Limited

DongGuan Cincon Electronic Limited
No. 1, Jing Xiang Road,
DongCheng Foreign Trade Industrial Park,
Zhushan, DongCheng District,
Dongguan, Guangdong, P.R.C. 523128
Telephone: +86-769-22258876

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/28/2021 5/28/2021 5/28/2024

Capabilities

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wire and Terminal Connection Process Capable
Elitegroup Technology (Thailand) Co., Ltd. Amata City, Chonburi, Thailand

Elitegroup Technology (Thailand) Co., Ltd.
Amata City Chonburi Industrial Estate 700/50,52,54 Moo 6 Tambol
Nongmaidang, Amphur Muang Chonburi, Thailand
Tel: 038-459493

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/10/2023 5/10/2023 5/10/2026

Capabilities

  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wavesolder Capable
EMMT Systems Corporation, Taichung City, Taiwan (R.O.C.)

EMMT Systems Corporation
No.16-1, S. 2nd Rd., T
Taichung City, Tanzi District, 427
Taiwan

IPC J-STD-001 / IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/18/2022 5/18/2022 5/18/2025

Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
Eskilstuna Elektronik Partner AB (EEPAB)

Eskilstuna Elektronik Partner AB (EEPAB)
Montörgatan 1
Eskilstuna SE, 632 29
Sweden
Tel: +0046 1615 9800

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 11/8/2019 1/12/2023 1/12/2026

Capabilities

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
  • Unique Surface Mount Component Types: 0201’s
  • Wavesolder and Selective Solder Capable
  • Wire and Terminal Connection Process Capable
Excel Electronics, Inc., Elkhart, IN, USA

Excel Electronics, Inc.
2600 Marina Dr.
Elkhart, IN 46514
Phone: 574-206-2627
Fax: 574-264-7052

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 6/9/2017 6/7/2023 6/7/2026

Capabilities:

  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Hot Bar Soldering for Rigid Flex Assembly
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Pin Staking Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
  • Wavesolder and Selective Solder Capable
Fabrication Technologies, Inc. / IGM Solutions, Inc., Libertyville, IL, USA

Fabrication Technologies, Inc. / IGM Solutions, Inc.
1925 Enterprise Ct
Libertyville, IL, 60048-9764
United States
Tel: 847-362-9800
Fax: 847-362 5531

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 1/9/2020 1/9/2023 1/9/2026

Capabilities:

  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
  • Wavesolder and Selective Solder Capable
Flextronics Computing (Suzhou) Co., Ltd., Suzhou, P.R.C.

Flextronics Computing (Suzhou) Co., Ltd.
No.1, Wusongjiang Ave.
Guoxiang St., Wuzhong District
Suzhou, Jiangsu, China
Tel: +86 512 6340 8800

J-STD-001/IPC-A-610

For Automotive Lines B13, C0, C1, C2, C3, C5, C6, C9, C10, C11, C12, C15, C16, & C17

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 6/20/2016 8/5/2022 8/5/2025

Capabilities:

  • Lead-Free Assembly Process Capable
  • Surface Mount Component Assembly
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Staking (Adhesive) and Encapsulation Capable
Foshan City Shunde Haier Intelligent Electronics Co., Ltd.

Foshan City Shunde Haier Intelligent Electronics Co., Ltd.
NO.16, Huantianbei 1 Road, Shunde Hi-tech Zone
Foshan City, Guangdong, 528300
China
www.haier.com

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 10/8/2022 10/8/2022 10/8/2025

Capabilities:

  • Conformal Coating Process Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder and Selective Solder Capable
Fujikon Industrial Co., Ltd. Guangdong Province, P.R.C.

Fujikon Industrial Co., Ltd.
No. 2 Qilin East Road, Dabandi Industrial Zone, Daning Village, Humen Town
Dongguan City, Guangdong Province, China 523930

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 5/8/2023 5/8/2023 5/8/2026

Capabilities:

  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: 0201’s and 01005’s
  • Unique Surface Mount Component Types: Ball Grid Arrays
Golden Elite Technology (Shenzhen) Ltd. Shenzhen City, Guangdong, China

Golden Elite Technology (Shenzhen) Ltd.
Shenzhen City, Guangdong, China

No. 1, Nan-Huan Rd.., ShaJing, BaoAN
Shenzhen, Guangdong, China 518104
Telephone:
+86 755 33855888

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 4/9/2022 4/9/2022 4/9/2025

Capabilities

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
GPV Lanka (Private), Ltd., Daluwakotuwa, Kochchikade, Sri Lanka

GPV Lanka (private), Ltd., Daluwakotuwa, Kochchikade, Sri Lanka

GPV Lanka (Private), Ltd.
Baseline Road
Daluwakotuwa
Kochchikade, Sri Lanka 11540
Tel: +94 31 487 15 00

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 10/19/2023 10/19/2023 10/19/2026

 

Capabilities

  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: 0201's and 01005's
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN's
  • Wavesolder and Selective Solder Capable
  • Wire and Terminal Connection Process Capable 
Green Circuits, Inc. San Jose, CA. USA

Green Circuits, Inc.
1130 Ringwood Court 
San Jose, CA. 95131

Tel: 877-865-9600

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/3/2023 8/3/2023 8/3/2026

Capabilities

  • Cleaning Process Capable
  • Gold (Au) Removal Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: 0201's and 01005's
  • Unique Surface Mount Component Types: Ball Grid Array and QFN's
  • Wavesolder and Selective Solder Capable
Hefei Lingzhi IoT Technology Co., Ltd.

Hefei Lingzhi IoT Technology Co., Ltd.
Building E01, No. 127 Zishi Road, Economic and Technology Development Zone
Hefei City, Anhui, 230093
China
Tel: + 0532-88935253

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 10/20/2022 10/20/2022 10/20/2025

Capabilities:
Conformal Coating Process Capable
Lead-Free Assembly Process Capable
Plated Through Hole Component Assembly
Process Validation
Rework and Repair Process Capable
Staking (Adhesive) and Encapsulation Capable
Statistical Process Control (SPC)
Surface Mount Component Assembly
Wave Solder Capable

Honor Tone Ltd, HuiZhou, GuangDong Province, P.R.C.

Honor Tone Ltd.
Building One
No.61, LongShan 2nd Road
Western District of Science and Technology Park,
Da Ya Wan Economy and Technology Development District
HuiZhou, GuangDong Province, P.R.China  516081
Telephone +86-752-5378079

IPC J-STD-001 / IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 1/12/2017 4/08/2023 4/08/2026

 

Capabilities

  • Intrusive Soldering(Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays, Column Grid Arrays, 0201’s
  • Wire and Terminal Connection Process Capable

 

Jiangsu Jiuzheng Powertip Technology Corporation, JiangSu Province, P.R.C.

Jiangsu Jiuzheng Powertip Technology Corporation, JiangSu Province, P.R.C.
No. 6, Fudi East Road
Ju Rong City 
JiangSu Province, China  212400
Tel: +86-0511-87285858

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 12/12/2017 1/5/2024 1/5/2027

Capabilities:

  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
John Deere Electronic Solutions, Fargo, ND, USA

John Deere Electronic Solutions
1441 44th Street North
Fargo ND 58102 USA
701-282-9364

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 11/6/2014 09/23/2023 09/23/2026

Capabilities:

  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Internal Failure Analysis Lab Capabilities
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Pin Staking Capable
  • Plated Through Hole Component Assembly
  • PoP (Package on Package) Process Capable
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays, Column Grid Arrays, 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable
KO-M TECH Co., Ltd. Gyeonggi-do, Republic of Korea

KO-MTECH Co., Ltd.
SMT Lines D and E; PTH/Wavesolder Lines B and C
19, Dongsan-ro 27beon-gil Danwon-gu
Ansan-si, Gyeonggi-do, 15433
Republic of Korea

IPC J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/5/2023 5/5/2023 5/5/2026

Capabilities

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable
Lockheed Martin Rotary and Mission Systems, Liverpool, NY, USA

Lockheed Martin Rotary and Mission Systems
497 Electronics Pkwy, Bldg. 5 and Bldg. 6
Liverpool, NY 13088-6062
Tel: + 315-456-3304

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 2/28/2018 3/31/2021 3/31/2024

Capabilities:

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Gold (Au) Removal Process Capable
  • Process Validation
  • Rework & Repair Process Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Wire and Terminal Connection Process Capable
Magna Electronics (Zhangjiagang) Co., Ltd, Zhangjiagang City, China

Magna Electronics (Zhangjiagang) Co., Ltd
No.11, Zhenxing Road, Zhangjiagang Electronic Development Zone  –
Zhangjiagang City, Jiangsu Province China 215600

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/1/2016 11/16/2022 11/16/2025

Capabilities:

  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wavesolder and Selective Solder Capable
  • Internal Failure Analysis Lab Capabilities
  • Plated Through Hole Component Assembly
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s
Mercury Systems, Inc. – USMO, Phoenix, AZ, USA

Mercury Systems, Inc. – USMO
3601 E University Dr
Phoenix, AZ, 85034-7217

Tel: 602-437-1520
Fax: 602-437-1731

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 2/24/2023 2/24/2023 2/24/2026

Capabilities

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.30-mm pitch), 0201’s
  • Wavesolder and Selective Solder Capable
Mirgor S.A., Rio Grande, Tierra del Fuego, Argentina

Mirgor S.A.
Albert Einstein 1111
Rio Grande, Tierra del Fuego CP 9420
Argentina
Tel: +54 (2964) 436-400

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 7/28/2017 3/9/2022 3/9/2025

 

Capabilities:

  • Internal Failure Analysis Lab Capabilities
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable
Pasgao Electronics Technology Co., Ltd., Enping City, Guangdong, China

Pasgao Electronics Technology Co., Ltd. Enping City, Guangdong, China
V1 2nd District, Industrial Transfer Park
Enping City
Guangdong, China  529400
Tel: +86-750-7182229

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 1/8/2024 1/8/2024 1/8/2027

Capabilities:

  • Lead-Free Assembly Process Capable
  • Intrusive Soldering (Paste-in-Hole) Capable 
  • Plated through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
Qingdao Dingxin Electronic Technology Co., Ltd

Qingdao Dingxin Electronic Technology Co., Ltd.
No.11 plant, Haier Xinxing Industrial Park
Qingdao Economic and Technological Development Zone
Shandong, 266510
China
www.haier.com

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 9/20/2022 9/20/2022 9/20/2025

 

Capabilities:

  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable
Qingdao Lingzhi Electronic Technology Co., Ltd.

Qingdao Lingzhi Electronic Technology Co., Ltd.
Haier Industrial Park, Haier Rd,
Jiulong district, Jiaozhou City
Qingdao, Shandong Province, 266300
China

IPC J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 11/30/2022 11/30/2022 11/30/2025

Capabilities

  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Wavesolder Capable
SFO Technologies Private Limited

SFO Technologies Private Limited
Plot No. 37, CSEZ, Kakkanad
Cochin-37
Kochi, Kerala, 682037
India
Tel: +91 0484 6614000

IPC J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 11/30/2022 11/30/2022 11/30/2025

Capabilities

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • Gold (Au) Removal Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • PoP (Package on Package) Process Capable
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Flip-Chip, Micro BGA (0.25-mm pitch), 0201’s
  • Wavesolder and Selective Solder Capable
SGS Tekniks Manufacturing Pvt. Ltd., Gurgaon, Haryana, India

SGS Tekniks Manufacturing Pvt. Ltd. (A Syrma SGS Group Company)

SGS Tekniks Manufacturing Pvt. Ltd.
Plat No. 174 Sector - 4 IMT Manesar
Gurgaon
Haryana, India, 122050
Tel: +91 124 476 0970

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 10/20/2023 10/20/2023 10/20/2026

 

Capabilities

  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Pin Staking Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Column Grid Arrays, 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable
  • Wire and Terminal Connection Process Capable 
Shanghai Austor Technology Co., Ltd., Shanghai, China

Shanghai Austor Technology Co., Ltd 
3rd Floor, Building No. 2
898 Zhenchen Road, Baoshan District
Shanghai, P.R. China, 200444
Tel: + 86-21-66986866

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 7/31/2017 11/6/2023 11/6/2026

Capabilities:

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
Shanghai Juchuan Electronics

Shanghai Juchuan Electronics
Building 2, NO.2328, Chunshen Road, Minhang District
Shanghai, 201100
China
Tel: 021-54996782

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 3/10/2022 3/10/2022 3/10/2025

 

Capabilities are as follows:

  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wavesolder Capable
Shanghai Railway Communication Co., Ltd., Shanghai, P.R.C.

Shanghai Railway Communication Co., Ltd.
No. 489 Xizang North Road,
Jing’an District, Shanghai, 200071 P.R.C.

No. 179 Jiangchang West Road,
Jing’an District, Shanghai, 200071 P.R.C.

Tel:  (021) 51002158
http://shtx.crsc.cn/

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 10/8/2021 10/8/2021 10/8/2024

Capabilities:

  • Internal Failure Analysis Lab Capabilities
  • Standard Leaded (63/37) Assembly Process Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Staking (Adhesive) and Encapsulation Capable
  • Wave Solder Capable
  • Press Fit (Compliant Pin) Process Capable
  • Wire and Terminal Connection Process Capable
  • Gold (Au) Removal Process Capable
  • Cleaning Process Capable
  • Conformal Coating Process Capable
Shenzhen Hello Tech Energy Co., Ltd. Shenzhen, Guangdong, China

Shenzhen Hello Tech Energy Co., Ltd.

Shenzhen Hello Tech Energy Co., Ltd.
2-3/F, Building 7, Jiaanda Industrial Park, Huafan Road
Tongsheng Community, Dalang Street, Longhua New District
Shenzhen, Guangdong, 518109
China

Tel:  + 0755-29106556

IPC J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 11/1/2023 11/1/2023 11/1/2026

Capabilities

  • Conformal Coating Process Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
Shenzhen Top-Tek Electronics Co., LTD., Bao An District Shenzhen, P.R.C.

Shenzhen Top-Tek Electronics Co., LTD.
2F-6F, No.3 Liaokeng 3rd Industrial Zone,
Baoyuan Community, Shiyan Street,
Bao An District Shenzhen, P.R.C. 518108
Tel: + 86-755-27830356

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/17/2017 10/16/2023 10/16/2026

Capabilities:

  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assemblies
  • Unique Surface Mount Component Types: Ball Grid Arrays
Siemens Limited – SI EA O PA IN, Goa

Siemens Limited – SI EA O PA IN, Goa
Energy Management, GOA Works, L-6 Verna Industrial Estate
Verna, Goa, India 403707
(989) 043-8609

J-STD-001/IPC-A-610

Class 1 Class 2 Initial Certificate Date Listing Date Expiration Date
Yes Yes 12/20/2022 12/20/2022 12/20/2025

Capabilities:

  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro
  • BGA (0.25-mm pitch), 0201’s
  • Wavesolder and Selective Solder Capable
STI Electronics, Inc. Madison, AL. USA

STI Electronics, Inc.
261 Palmer Rd Madison AL 35758-1727
256-461-9191

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 1/21/2015 6/10/2021 6/10/2024

 

Capabilities

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Gold (Au) Removal Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Internal Failure Analysis Lab Capabilities
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Pin Staking Capable
  • Plated Through Hole Component Assembly
  • PoP (Package on Package) Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable
Suzhou Etron Technologies Co., Ltd.

Suzhou Etron Technologies Co., Ltd.
50 Chunxing Rd.
Xiangcheng Economic Development Zone
Suzhou, Jiangsu, 214200
Tel: + 86-512-65466838

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 7/20/2023 7/20/2023 7/20/2026

Capabilities:

  • Conformal Coating Process Capable
  • Inspection - Automated Optical and X-Ray Capable
  • Lead-Free Assembly process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wavesolder and Selective Solder Capable
Tempo Automation, San Francisco, CA. USA

Tempo Automation
2460 Alameda
San Francisco CA 94103
Tel: +1-415-320-1261

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 4/15/2019 4/1/2022 4/1/2025

 

Capabilities

  • Cleaning Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
  • Wavesolder and Selective Solder Capable

 

 

Terma A/S, Lystrup, Denmark

Terma A/S
Hovmarken 4
Lystrup, 8520
Denmark
TEL: +45 8743 6000

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 3/10/2023 3/10/2023 3/10/2026

Capabilities

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Internal Failure Analysis Lab Capabilities
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Capable (Including Area Array and Leadless Devices)
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
  • Wavesolder and Selective Solder Capable
  • Wire and Terminal Connection Process Capable
Universal Global Technology (Kunshan) Co., Ltd.

Universal Global Technology (Kunshan) Co., Ltd.
Automotive Lines: S21/S27/S46/S55
No. 497, Huangpujiang Road, Qiandeng,
Kunshan, Jiangsu Province, P.R.C. 215341
Telephone # 86-512-55280000

IPC J-STD-001 / IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/17/2021 5/17/2021 5/17/2024

Capabilities

  • Internal Failure Analysis Lab Capabilities
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: 0201’s
  • Wavesolder and Selective Solder Capable
Valuetronics Vietnam Ltd.

Valuetronics Vietnam ltd.
Plot No. 14-15-16-17
Thang Long Industrial Park (Vinh Phuc), Thien Ke Commune
Vinh Phuc, Binh Xuyen, 15800, Vietnam
Tel: + 84-098-1895848

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 7/20/2023 7/20/2023 7/20/2026

Capabilities:

  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: 0201's
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wire and Terminal Connection Process Capable 
Weibel Scientific A/S, Allerod, Denmark

Weibel Scientific A/S
Solvang 30
3450 Allerod, Denmark
TEL: +45 7010 8511

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 4/19/2023 4/19/2023 4/19/2026

Capabilities

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wire and Terminal Connection Process Capable
Xuancheng Luxshare Precision Industry Co., Ltd

Xuancheng Luxshare Precision Industry Co., Ltd
No. 5 Baishou Road, Xuancheng High-Tech Industry Development Zone
Xuancheng, ANHUI, 242074
China
Tel: 0563-2115888

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 8/31/2022 8/31/2022 8/31/2025

Capabilities

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
Zentech Dallas, LLC, Richardson, TX, USA

Zentech Dallas, LLC
1717 Firman Drive; Suite 200
Richardson, TX 75043 USA
TEL. +1 972-907-2727

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/10/2020 12/07/2023 12/07/2026

Capabilities:

  • Cleaning Process Capable
  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Standard Leaded (63/37) Assembly Process Capable
  • Surface Mount Component Assembly
  • Surface Mount Technology on Flex and Rigid Flex Assemblies
  • Unique Surface Mount Component Types: Ball Grid Arrays, Micro BGA down to 0.25-mm pitch, 0201’s

A wholly owned subsidiary of Zentech Manufacturing, Inc.

Zentech Manufacturing, Inc. Baltimore, MD. USA

Zentech Manufacturing
6980 Tudsbury Road
Baltimore, MD 21244
USA
Tel: +1 443-348-4500

IPC J-STD-001/610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 5/30/2014 9/22/2023 9/22/2026

Capabilities

  • Conformal Coating Process Capable
  • Gold (Au) Removal Process Capable
  • Cleaning Process Capable
  • Hot Bar Soldering for Rigid Flex Assembly
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Press Fit (Compliant Pin) Process Capable
  • Process Validation
  • Rework and Repair Process Capable
  • Staking (Adhesive) and Encapsulation Capable
  • Standard Leaded (63/37) Assembly Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
  • Unique Surface Mount Component Types: Ball Grid Array, Flip-Chip, Micro BGA (0.25-mm pitch), 0201’s
ZongMu Technology (Huzhou) Co., Ltd.

ZongMu Technology (Huzhou) Co., Ltd.
3rd & 4th Floor of Building B; No.2195, Hongfeng Road
Huzhou City, Zhejiang Province, 313099
China

IPC J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/12/2022 12/12/2022 12/12/2025

Capabilities

  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Inspection – Automated Optical and X-Ray Capable
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wavesolder and Selective Solder Capable
ZongMu Technology (Xiamen) Co., Ltd.

ZongMu Technology (Xiamen) Co., Ltd.
3rd Floor, Factory Building No. 6
Songlin Road, Guankou Town, Jimei District,
Xiamen, Fujian, 361021 P.R.C.
Tel: 0592-6363312

J-STD-001/IPC-A-610

Class 1 Class 2 Class 3 Initial Certificate Date Listing Date Expiration Date
Yes Yes Yes 12/12/2021 12/12/2021 12/12/2024

Capabilities:

  • Conformal Coating Process Capable
  • DFM (Design for Manufacturability) Capable
  • Internal Failure Analysis Lab Capabilities
  • Intrusive Soldering (Paste-in-Hole) Capable
  • Lead-Free Assembly Process Capable
  • Plated Through Hole Component Assembly
  • Process Validation
  • Rework and Repair Process Capable
  • Statistical Process Control (SPC)
  • Surface Mount Component Assembly
  • Unique Surface Mount Component Types: Ball Grid Arrays
  • Wave Solder Capable