IPC Validation Services - Qualified Manufacturing Companies (QML) J-STD-001/610
IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies is recognized globally for its criteria on soldering processes and materials. Updated with participants from 27 countries providing input and expertise, the IPC-J-STD-001 standard brings the latest criteria to the industry including guidance on the use of x-ray to inspect through-hole solder conditions that are not visible by any other means.
IPC-A-610: Acceptability of Electronic Assemblies is the most widely used electronics assembly acceptance standard in the electronics industry. Participants from 29 countries provided their input and expertise to bring this document to the electronics industry.
J-STD-001 is developed in synergy with IPC-A-610.
The IPC Validation Services QML (Qualified Manufacturers List) is used to qualify EMS and OEM providers’ assembly processes to IPC standards.
Access Device Integrated Communications Corp.
3F NO.16, Ke-Yuan 2nd Rd.,
Situn District, Taichung City, 407 Taiwan
Tel: +88-6-4-24638176
IPC J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 9/9/2024 | 9/9/2024 | 9/9/2027 |
Capabilities
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wavesolder and Selective Solder Capable
Advantech Japan Co., Ltd. Nogata board Factory
2770 Kamizakai Tobikuma
Nogata City, Fukuoka, Japan 822006
Tel: +81 949 22 2811
J-STD-001/IPC-A-610
SMT Line A, PTH/Wavesolder Line A
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 1/10/2024 | 1/10/2024 | 1/10/2027 |
Capabilities:
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wavesolder and Selective Solder Capable
Alternative Manufacturing Inc. (AMI)
30B Summer St.
Winthrop, ME, 04364-1253 USA
207-377-9377
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | 4/8/2015 | 4/15/2024 | 4/15/2027 |
Capabilities:
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays, Micro BGA (0.30-mm pitch), 0201’s
- Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
- Wavesolder and Selective Solder Capable
- Wire and Terminal Connection Process Capable
Askey Technology (Jiangsu) Ltd.
Building #2
No. 1388 Jiaotong Road
Wujiang Economic Technological Development Area
Suzhou, Jiangsu, China 215200
Tel: +86-512-63487188
IPC J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 9/7/2020 | 6/6/2023 | 6/6/2026 |
Capabilities
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Unique Surface Mount Component Types: 0201’s and 01005’s
- Wavesolder and Selective Solder Capable
Askey Technology (Jiangsu) Ltd.
Building # 3 (SC01/DC01)
No.1388 Jiaotong Road
Wu Jiang Economic Technology Development Area
Jiangsu Province 15200, China
Tel: +86-512-6348-7188
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | 6/18/2015 | 6/28/2024 | 6/28/2027 |
Capabilities
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Staking (Adhesive) and Encapsulation Capable
- Wavesolder Capable
- Unique Surface Mount Component Types: Ball Grid Arrays
- Unique Surface Mount Component Types: 0201’s, 01005’s
AVIC XINXIANG AVIATION INDUSTRY (GROUP) Co., Ltd. Electronic Control Institute
No.168 Jianshe Road, Muye
Xinxiang, Henan Province, 453049
China
TEL: +0373-3862405
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 11/2/2022 | 11/2/2022 | 11/2/2025 |
Capabilities:
- Conformal Coating Process Capable
- Gold (Au) Removal Process Capable
- Rework and Repair Process Capable
- Standard Leaded (63/37) Assembly Process Capable
Beijing Ralway Signal Co., Ltd
No. 456 Sicun langfa Huangcun
Daxing District
Beijing, China 102613
Tel: +010-5121-4022
IPC J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 10/30/2024 | 10/30/2024 | 10/30/2027 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- Gold (Au) Removal Process Capable
- Internal Failure Analysis Lab Capabilities
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wavesolder Solder Capable
BCS Automotive Interface Solutions (Suzhou) Co., Ltd.
No. 2052, Taidong Road
Xiangcheng Economic Development District
Suzhou, Jiangsu Province
215143 China
IPC J-STD-001 / IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 1/25/2017 | 4/25/2023 | 4/25/2026 |
Capabilities
- Conformal Coating Process Capable
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Surface Mount Component Assembly
- Plated Through Hole Component Assembly
- Wavesolder and Selective Solder Capable
- Process Validation
- Statistical Process Control (SPC)
- Unique Surface Mount Component Types: 0201's
- Unique Surface Mount Component Types: Ball Grid Arrays
Canon Inc.
NO.46, NO.48, 2F., NO.48, Dapumeiyuanqu 1ST RD.
Dalin Township
Chiayi County, 622
Taiwan
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 12/08/2023 | 12/08/2023 | 12/08/2026 |
Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wavesolder Capable
Changzhou Bokang Electronics Co., Ltd.
65-15# Xinggang Road,
Zhonglou Zone
Changzhou, Jiangsu, China 213023
TEL. +1 3915080590
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 12/15/2020 | 12/12/2023 | 12/12/2026 |
Capabilities:
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: BGA
- Wavesolder Capable
Cincon Electronics Co., Ltd.
No. 8-1 Fugong Rd.,
Fuxing Township
Changhua, 506027
Taiwan
Tel: +88647690261
https://www.cincon.com
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 8/25/2021 | 10/11/2024 | 10/11/2027 |
Capabilities:
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wavesolder Capable
COSMO AIoT (Foshan) Co., Ltd.
NO.16, Huantianbei 1 Road, Shunde Hi-tech Zone
Foshan City, Guangdong, 528300
China
www.haier.com
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 10/8/2022 | 10/8/2022 | 10/8/2025 |
Capabilities:
- Conformal Coating Process Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wavesolder and Selective Solder Capable
COSMO AIoT Technology (Chongqing) Co., Ltd.
4F, Block A05
Haier Port City Industrial Park
Jiangbei District, Chongqing, 400026
China
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 9/26/2022 | 9/26/2022 | 9/26/2025 |
Capabilities:
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wave Solder Capable
DFI, Inc.
3F., No. 157, Shanying Road
Guishan District
Taoyuan City, 333424 Taiwan
Tel: +886 (3) 216-5058
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 8/22/2016 | 12/28/2021 | 12/28/2024 |
Capabilities
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wavesolder Capable
DongGuan Cincon Electronic Limited
No. 66, Yuanying Road,
Liaobu Town,
Dongguan, Guangdong, China 523412
Telephone: +86-769-22663801
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 5/28/2021 | 6/20/2024 | 6/20/2027 |
Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wire and Terminal Connection Process Capable
Elitegroup Technology (Thailand) Co., Ltd.
Amata City Chonburi Industrial Estate 700/50,52,54 Moo 6 Tambol
Nongmaidang, Amphur Muang Chonburi, Thailand
Tel: 038-459493
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 5/10/2023 | 5/10/2023 | 5/10/2026 |
Capabilities
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wavesolder Capable
EMMT Systems Corporation
No.16-1, S. 2nd Rd., T
Taichung City, Tanzi District, 427
Taiwan
IPC J-STD-001 / IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 5/18/2022 | 5/18/2022 | 5/18/2025 |
Capabilities
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
Eskilstuna Elektronik Partner AB (EEPAB)
Montörgatan 1
Eskilstuna SE, 632 29
Sweden
Tel: +0046 1615 9800
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 11/8/2019 | 1/12/2023 | 1/12/2026 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
- Unique Surface Mount Component Types: 0201’s
- Wavesolder and Selective Solder Capable
- Wire and Terminal Connection Process Capable
Excel Electronics, Inc.
2600 Marina Dr.
Elkhart, IN 46514
Phone: 574-206-2627
Fax: 574-264-7052
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | 6/9/2017 | 6/7/2023 | 6/7/2026 |
Capabilities:
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Hot Bar Soldering for Rigid Flex Assembly
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Pin Staking Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Inspection – Automated Optical and X-Ray Capable
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
- Wavesolder and Selective Solder Capable
Fabrication Technologies, Inc. / IGM Solutions, Inc.
1925 Enterprise Ct
Libertyville, IL, 60048-9764
United States
Tel: 847-362-9800
Fax: 847-362 5531
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | 1/9/2020 | 1/9/2023 | 1/9/2026 |
Capabilities:
- DFM (Design for Manufacturability) Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
- Wavesolder and Selective Solder Capable
Flextronics Computing (Suzhou) Co., Ltd.
No.1, Wusongjiang Ave.
Guoxiang St., Wuzhong District
Suzhou, Jiangsu, China
Tel: +86 512 6340 8800
J-STD-001/IPC-A-610
Automotive Lines B13, C0, C1, C2, C3, C5, C6, C9, C10, C11, C12, C15, C16, & C17
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 6/20/2016 | 8/5/2022 | 8/5/2025 |
Capabilities:
- Lead-Free Assembly Process Capable
- Surface Mount Component Assembly
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Unique Surface Mount Component Types: Ball Grid Arrays
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Staking (Adhesive) and Encapsulation Capable
Fujikon Industrial Co., Ltd.
No. 2 Qilin East Road, Dabandi Industrial Zone, Daning Village, Humen Town
Dongguan City, Guangdong Province, China 523930
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | 5/8/2023 | 5/8/2023 | 5/8/2026 |
Capabilities:
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: 0201’s and 01005’s
- Unique Surface Mount Component Types: Ball Grid Arrays
Golden Elite Technology (Shenzhen) Ltd.
Shenzhen City, Guangdong, China
No. 1, Nan-Huan Rd.., ShaJing, BaoAN
Shenzhen, Guangdong, China 518104
Telephone:
+86 755 33855888
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 4/9/2022 | 4/9/2022 | 4/9/2025 |
Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
GPV Lanka (private), Ltd., Daluwakotuwa, Kochchikade, Sri Lanka
GPV Lanka (Private), Ltd.
Baseline Road
Daluwakotuwa
Kochchikade, Sri Lanka 11540
Tel: +94 31 487 15 00
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 10/19/2023 | 10/19/2023 | 10/19/2026 |
Capabilities
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: 0201's and 01005's
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
- Unique Surface Mount Component Types: Ball Grid Arrays and QFN's
- Wavesolder and Selective Solder Capable
- Wire and Terminal Connection Process Capable
Green Circuits, Inc.
1130 Ringwood Court
San Jose, CA. 95131
Tel: 877-865-9600
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 8/3/2023 | 8/3/2023 | 8/3/2026 |
Capabilities
- Cleaning Process Capable
- Gold (Au) Removal Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: 0201's and 01005's
- Unique Surface Mount Component Types: Ball Grid Array and QFN's
- Wavesolder and Selective Solder Capable
Hefei Lingzhi IoT Technology Co., Ltd.
Building E01, No. 127 Zishi Road, Economic and Technology Development Zone
Hefei City, Anhui, 230093
China
Tel: + 0532-88935253
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 10/20/2022 | 10/20/2022 | 10/20/2025 |
Capabilities:
Conformal Coating Process Capable
Lead-Free Assembly Process Capable
Plated Through Hole Component Assembly
Process Validation
Rework and Repair Process Capable
Staking (Adhesive) and Encapsulation Capable
Statistical Process Control (SPC)
Surface Mount Component Assembly
Wave Solder Capable
Honor Tone Ltd.
Building One
No.61, LongShan 2nd Road
Western District of Science and Technology Park,
Da Ya Wan Economy and Technology Development District
HuiZhou, GuangDong Province, China 516081
Telephone +86-752-5378079
IPC J-STD-001 / IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 1/12/2017 | 4/08/2023 | 4/08/2026 |
Capabilities
- Intrusive Soldering(Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays, Column Grid Arrays, 0201’s
- Wire and Terminal Connection Process Capable
Jiangsu Jiuzheng Powertip Technology Corporation, JiangSu Province, China
No. 6, Fudi East Road
Ju Rong City
JiangSu Province, China 212400
Tel: +86-0511-87285858
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | 12/12/2017 | 1/5/2024 | 1/5/2027 |
Capabilities:
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
John Deere Electronic Solutions
1441 44th Street North
Fargo ND 58102 USA
701-282-9364
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 11/6/2014 | 09/23/2023 | 09/23/2026 |
Capabilities:
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Internal Failure Analysis Lab Capabilities
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Pin Staking Capable
- Plated Through Hole Component Assembly
- PoP (Package on Package) Process Capable
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays, Column Grid Arrays, 0201’s, 01005’s
- Wavesolder and Selective Solder Capable
KO-MTECH Co., Ltd.
SMT Lines D and E; PTH/Wavesolder Lines B and C
19, Dongsan-ro 27beon-gil Danwon-gu
Ansan-si, Gyeonggi-do, 15433
Republic of Korea
IPC J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 5/5/2023 | 5/5/2023 | 5/5/2026 |
Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wavesolder Capable
Lockheed Martin Rotary and Mission Systems
497 Electronics Pkwy, Bldg. 5, Bldg. 6 and Bldg. 7
Liverpool, NY 13088-6062
Tel: + 315-456-3304
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 2/28/2018 | 3/28/2024 | 3/28/2027 |
Capabilities:
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Gold (Au) Removal Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework & Repair Process Capable
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Wire and Terminal Connection Process Capable
Magna Electronics (Zhangjiagang) Co., Ltd
No.11, Zhenxing Road, Zhangjiagang Electronic Development Zone –
Zhangjiagang City, Jiangsu Province China 215600
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 12/1/2016 | 11/16/2022 | 11/16/2025 |
Capabilities:
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wavesolder and Selective Solder Capable
- Internal Failure Analysis Lab Capabilities
- Plated Through Hole Component Assembly
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s
Mercury Systems, Inc. – USMO
3601 E University Dr
Phoenix, AZ, 85034-7217
Tel: 602-437-1520
Fax: 602-437-1731
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 2/24/2023 | 2/24/2023 | 2/24/2026 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.30-mm pitch), 0201’s
- Wavesolder and Selective Solder Capable
Mirgor S.A.
Albert Einstein 1111
Rio Grande, Tierra del Fuego CP 9420
Argentina
Tel: +54 (2964) 436-400
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 7/28/2017 | 3/9/2022 | 3/9/2025 |
Capabilities:
- Internal Failure Analysis Lab Capabilities
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
- Wavesolder and Selective Solder Capable
Pasgao Electronics Technology Co., Ltd. Enping City, Guangdong, China
V1 2nd District, Industrial Transfer Park
Enping City
Guangdong, China 529400
Tel: +86-750-7182229
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | 1/8/2024 | 1/8/2024 | 1/8/2027 |
Capabilities:
- Lead-Free Assembly Process Capable
- Intrusive Soldering (Paste-in-Hole) Capable
- Plated through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
PATEO CONNECT + (Xiamen) Co., Ltd.
No. 8, East Longku Road
Torch (Xiang'an) District,
Xiamen, 361100 China
Tel: 0592-7615163
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 08/26/2024 | 08/26/2024 | 08/26/2027 |
Capabilities:
- Internal Failure Analysis Lab Capabilities
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wavesolder Capable
Qingdao Dingxin Electronic Technology Co., Ltd.
No.11 plant, Haier Xinxing Industrial Park
Qingdao Economic and Technological Development Zone
Shandong, 266510
China
www.haier.com
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 9/20/2022 | 9/20/2022 | 9/20/2025 |
Capabilities:
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wavesolder Capable
Qingdao Lingzhi Electronic Technology Co., Ltd.
Haier Industrial Park, Haier Rd,
Jiulong district, Jiaozhou City
Qingdao, Shandong Province, 266300
China
IPC J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 11/30/2022 | 11/30/2022 | 11/30/2025 |
Capabilities
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Wavesolder Capable
Sartorius Lab Instruments GmbH & Co. KG
Otto-Brenner-Strasse 20
Gottingen, Niedersachsen, Germany 37079
Tel: +49 551-308-3103
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 11/19/2024 | 11/19/2024 | 11/19/2027 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Gold (Au) Removal Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Staking (Adhesive) and Encapsulation Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Array and QFN's
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201's
- Wavesolder and Selective Solder Capable
- Wire and Terminal Connection Process Capable
SFO Technologies Private Limited
Plot No. 37, CSEZ, Kakkanad
Cochin-37
Kochi, Kerala, 682037
India
Tel: +91 0484 6614000
IPC J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 11/30/2022 | 11/30/2022 | 11/30/2025 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- Gold (Au) Removal Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- PoP (Package on Package) Process Capable
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Flip-Chip, Micro BGA (0.25-mm pitch), 0201’s
- Wavesolder and Selective Solder Capable
SGS Tekniks Manufacturing Pvt. Ltd. (A Syrma SGS Group Company)
SGS Tekniks Manufacturing Pvt. Ltd.
Plat No. 174 Sector - 4 IMT Manesar
Gurgaon
Haryana, India, 122050
Tel: +91 124 476 0970
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 10/20/2023 | 10/20/2023 | 10/20/2026 |
Capabilities
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Pin Staking Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Column Grid Arrays, 0201’s, 01005’s
- Wavesolder and Selective Solder Capable
- Wire and Terminal Connection Process Capable
Shanghai Austor Technology Co., Ltd
3rd Floor, Building No. 2
898 Zhenchen Road, Baoshan District
Shanghai, China, 200444
Tel: + 86-21-66986866
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 7/31/2017 | 11/6/2023 | 11/6/2026 |
Capabilities:
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
Shanghai Juchuan Electronics
Building 2, NO.2328, Chunshen Road, Minhang District
Shanghai, 201100
China
Tel: 021-54996782
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 3/10/2022 | 3/10/2022 | 3/10/2025 |
Capabilities are as follows:
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wavesolder Capable
Shanghai Railway Communication Co., Ltd.
No. 489 Xizang North Road,
Jing’an District, Shanghai, 200071 China
No. 179 Jiangchang West Road,
Jing’an District, Shanghai, 200071 China
Tel: (021) 51002158
http://shtx.crsc.cn/
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 10/8/2021 | 10/7/2024 | 10/7/2027 |
Capabilities:
- Cleaning Process Capable
- Conformal Coating Process Capable
- Gold (Au) Removal Process Capable
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wave Solder Capable
- Wire and Terminal Connection Process Capable
Shenzhen Hello Tech Energy Co., Ltd.
Shenzhen Hello Tech Energy Co., Ltd.
2-3/F, Building 7, Jiaanda Industrial Park, Huafan Road
Tongsheng Community, Dalang Street, Longhua New District
Shenzhen, Guangdong, 518109
China
Tel: + 0755-29106556
IPC J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 11/1/2023 | 11/1/2023 | 11/1/2026 |
Capabilities
- Conformal Coating Process Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
Shenzhen Top-Tek Technology Co., LTD.
2F-6F, No.3 Liaokeng 3rd Industrial Zone,
Baoyuan Community, Shiyan Street,
Bao An District Shenzhen, China 518108
Tel: + 86-755-27830356
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 8/17/2017 | 10/16/2023 | 10/16/2026 |
Capabilities:
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assemblies
- Unique Surface Mount Component Types: Ball Grid Arrays
Siemens Limited – SI EA O PA IN, Goa
Energy Management, GOA Works, L-6 Verna Industrial Estate
Verna, Goa, India 403707
(989) 043-8609
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | 12/20/2022 | 12/20/2022 | 12/20/2025 |
Capabilities:
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Inspection – Automated Optical and X-Ray Capable
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro
- BGA (0.25-mm pitch), 0201’s
- Wavesolder and Selective Solder Capable
STI Electronics, Inc.
261 Palmer Rd Madison AL 35758-1727
256-461-9191
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 1/21/2015 | 6/10/2024 | 6/10/2027 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Gold (Au) Removal Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Internal Failure Analysis Lab Capabilities
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Pin Staking Capable
- Plated Through Hole Component Assembly
- PoP (Package on Package) Process Capable
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Micro BGA (0.25-mm pitch), 0201’s, 01005’s
- Wavesolder and Selective Solder Capable
Suzhou Etron Technologies Co., Ltd.
50 Chunxing Rd.
Xiangcheng Economic Development Zone
Suzhou, Jiangsu, 214200
Tel: + 86-512-65466838
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 7/20/2023 | 7/20/2023 | 7/20/2026 |
Capabilities:
- Conformal Coating Process Capable
- Inspection - Automated Optical and X-Ray Capable
- Lead-Free Assembly process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wavesolder and Selective Solder Capable
Terma A/S
Hovmarken 4
Lystrup, 8520
Denmark
TEL: +45 8743 6000
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 3/10/2023 | 3/10/2023 | 3/10/2026 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Inspection – Automated Optical and X-Ray Capable
- Internal Failure Analysis Lab Capabilities
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Capable (Including Area Array and Leadless Devices)
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays and QFN’s
- Wavesolder and Selective Solder Capable
- Wire and Terminal Connection Process Capable
Universal Global Technology (Kunshan) Co., Ltd.
Automotive Lines: S21/S27/S46/S55
No. 497, Huangpujiang Road, Qiandeng,
Kunshan, Jiangsu Province, China 215341
Telephone # 86-512-55280000
IPC J-STD-001 / IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 5/17/2021 | 5/20/2024 | 5/20/2027 |
Capabilities
- Conformal Coating Process Capable
- Internal Failure Analysis Lab Capabilities
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: 0201’s
- Wavesolder and Selective Solder Capable
Valuetronics Vietnam ltd.
Plot No. 14-15-16-17
Thang Long Industrial Park (Vinh Phuc), Thien Ke Commune
Vinh Phuc, Binh Xuyen, 15800, Vietnam
Tel: + 84-098-1895848
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 7/20/2023 | 7/20/2023 | 7/20/2026 |
Capabilities:
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: 0201's
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wire and Terminal Connection Process Capable
Weibel Scientific A/S
Solvang 30
3450 Allerod, Denmark
TEL: +45 7010 8511
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 4/19/2023 | 4/19/2023 | 4/19/2026 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wire and Terminal Connection Process Capable
Xuancheng Luxshare Precision Industry Co., Ltd
No. 5 Baishou Road, Xuancheng High-Tech Industry Development Zone
Xuancheng, ANHUI, 242074
China
Tel: 0563-2115888
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 8/31/2022 | 8/31/2022 | 8/31/2025 |
Capabilities
- Cleaning Process Capable
- Conformal Coating Process Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
Zentech Dallas, LLC
1717 Firman Drive; Suite 200
Richardson, TX 75043 USA
TEL. +1 972-907-2727
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 12/10/2020 | 12/07/2023 | 12/07/2026 |
Capabilities:
- Cleaning Process Capable
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Inspection – Automated Optical and X-Ray Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Standard Leaded (63/37) Assembly Process Capable
- Surface Mount Component Assembly
- Surface Mount Technology on Flex and Rigid Flex Assemblies
- Unique Surface Mount Component Types: Ball Grid Arrays, Micro BGA down to 0.25-mm pitch, 0201’s
A wholly owned subsidiary of Zentech Manufacturing, Inc.
Zentech Manufacturing
6980 Tudsbury Road
Baltimore, MD 21244
USA
Tel: +1 443-348-4500
IPC J-STD-001/610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 5/30/2014 | 9/22/2023 | 9/22/2026 |
Capabilities
- Conformal Coating Process Capable
- Gold (Au) Removal Process Capable
- Cleaning Process Capable
- Hot Bar Soldering for Rigid Flex Assembly
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Press Fit (Compliant Pin) Process Capable
- Process Validation
- Rework and Repair Process Capable
- Staking (Adhesive) and Encapsulation Capable
- Standard Leaded (63/37) Assembly Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Surface Mount Technology on Rigid Flex, Hybrid, Metal Core, and Metal Backed Assembly
- Unique Surface Mount Component Types: Ball Grid Array, Flip-Chip, Micro BGA (0.25-mm pitch), 0201’s
ZongMu Technology (Huzhou) Co., Ltd.
3rd & 4th Floor of Building B; No.2195, Hongfeng Road
Huzhou City, Zhejiang Province, 313099
China
IPC J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 12/12/2022 | 12/12/2022 | 12/12/2025 |
Capabilities
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Inspection – Automated Optical and X-Ray Capable
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wavesolder and Selective Solder Capable
ZongMu Technology (Xiamen) Co., Ltd.
3rd Floor, Factory Building No. 6
Songlin Road, Guankou Town, Jimei District,
Xiamen, Fujian, 361021 China
Tel: 0592-6363312
J-STD-001/IPC-A-610
| Class 1 | Class 2 | Class 3 | Initial Certificate Date | Listing Date | Expiration Date |
| Yes | Yes | Yes | 12/12/2021 | 12/12/2021 | 12/12/2024 |
Capabilities:
- Conformal Coating Process Capable
- DFM (Design for Manufacturability) Capable
- Internal Failure Analysis Lab Capabilities
- Intrusive Soldering (Paste-in-Hole) Capable
- Lead-Free Assembly Process Capable
- Plated Through Hole Component Assembly
- Process Validation
- Rework and Repair Process Capable
- Statistical Process Control (SPC)
- Surface Mount Component Assembly
- Unique Surface Mount Component Types: Ball Grid Arrays
- Wave Solder Capable