IPC Standards Resource
There are several products, tools and documents provided by IPC in support of the electronics industry. The information includes the standards specification tree, IPC Checklist, Why Manufacturers Need IPC Standards, and supporting councils. On these pages you will find PCB Tools and Calculators, Coupon Generator, Digital Data Exchange and information supporting the standards developed for the electronics industry.
IPC Standards Specification Tree - provides all of the standards and IPC technical staff liaison responsibility
IPC Simplified Standards Specification Tree - suggested minimum standards companies should have in their standards libraries
Why Should Manufacturers Use IPC Standards - our lives depend on electronics, how do you know those electronics are manufactured with reliability, quality and consistency
IPC Checklist - a simple guide from start to finish of standards for producing rigid printed board assemblies
IPC Standardization Procedures - provides processes, structure and ANSI policy in the development of standards for the electronics industry
IPC/WHMA-A-620 Test Data Tables - provided in an electronic format that permits users to edit the tables to add user-specific criteria. These files are authorized for copying/reproduction
Supplier Industry Standardized PWB Roadmap(ISPR) Tool
The IPC PWB Suppliers Council Steering Committee Roadmap Subcommittee has created this Industry Standardized PWB Roadmap (ISPR) tool to provide gap analysis, identify technology needs, and highlight opportunities for enabling technology for the IPC PWB suppliers community. Note: Please choose 'NO', when prompted, "The workshop you opened contains automatic links to information in another workbook…".
PCB Benchmark Database (PCQR2)
Printed Board Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard Database
Ticer Technologies Embedded Resistor Calculator
This downloadable resistor calculator is a tool used by printed board designers to select sheet resistivity while considering resistor size, shape and power handling capability. The tool can help the designer select one or more of the available TCR ohms per square sheet resistance values to capture and eliminate more surface mounted resistors. It also has an input for etch factors, which allows designers and fabricators to better predict the final tolerance of the finished resistor. The calculator is available in both metric and imperial (inch) formats.
This downloadable program permits Gerber files to be imported and viewed.
IPC-2515A: 2000 Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description
This standard defines the sectional requirements for implementation of bare board product electrical testing data description. IPC-2511 is a mandatory part of this standard.
IPC-2516A: 2000 Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
This standard defines the sectional requirements for implementation assembled board product manufacturing data description. IPC-2511 is a mandatory part of this standard.
IPC-2517A: 2000 Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description
This standard defines the sectional requirements for implementation of assembled board product manufacturing data description. IPC-2511 is a mandatory part of this standard.
IPC-2518A: 2000 Sectional Requirements for Implementation of Part List Product Data Description
This standard defines the sectional requirements for implementation of part list product data description. IPC-2511 is a mandatory part of this standard.
IPC-2520 Quality Product Data
IPC-2524: 1999 PWB Fabrication Data Quality Rating System
This standard describes a PWB fabrication data quality rating system used by fabricators to evaluate the incoming data package integrity. Printed board designers can also use this system as an output quality check.
IPC-2530 SRFF Process Data
STANDARD RECIPE FILE FORMAT (SRFF) - IPC-253X
The purpose of IPC-2531 standard recipe file format is to outline the requirements that an SRFF file must meet. The specification describes the file format, outlines the file sections, and indicates how data should be represented through objects. Objects can either be vendor independent (generic objects defined in this document) or vendor specific objects (objects created by a vendor). This document also includes error codes that should be used to report specific information about improperly constructed files. General guidelines for producing an SRFF file and vendor specific objects are also included.
IPC-2531: 1999 SMEMA Standard Recipe File Format Specification
This standard outlines the requirements that an SRFF file must meet. It describes the file format, outlines the file sections, and indicates how data should be represented through objects. Objects can either be vendor independent (generic objects defined in this document) or vendor specific objects (objects created by a vendor). This standard also includes error codes that should be used to report specific information about improperly constructed files.
IPC-2540 Shop Floor Communication (CAMX)
SHOP FLOOR COMMUNICATION (CAMX) - IPC-254X
Factory Information Systems (FIS) form the nervous system of an enterprise, analysing data and delivering information to the machines and people who need to make information-based decisions. These systems provide a bi-directional flow of information between the factory floor and the rest of the enterprise. The National Electronics Manufacturing Initiative's (NEMI) Plug & Play Factory project addressed some critical problems involving factory information system deployment on the electronics manufacturing factory floor. The Plug & Play Factory project focused on the development of the standards necessary to achieve interoperability, or plug-and-play capability, on the factory floor. Activities were comprised of three areas:
IPC-2541: 2001 Generic Requirements for Electronics Manufacturing Shop-Floor Equipment Communication Messages (CAMX)
This standard establishes requirements and other considerations for the interchange of information between electronic manufacturing software equipment and factory information systems. Information may consist of attribute and parametric data, product data, process recipes, equipment monitoring and control, resource utilization and material consumption.
IPC-2546 w/Amend 1: 2003 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly
This standard establishes requirements and other considerations for the interchange of information between shop floor electronic assembly equipment and factory information systems. Information may consist of attribute and parametric data, product data, process recipes, equipment monitoring and control, resource utilization, and material consumption. Amendment 2: Dispensing Equipment, Reflow Equipment and Final Assembly and Packaging was published in 2005.
IPC-2547: 2002 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework
This standard establishes requirements and other considerations for the interchange of information between shop floor electronic inspection and test equipment and factory information systems. Information may consist of attribute and parametric data, product data, fixture files, test vectors, equipment monitoring and control, resource utilization, image data, test and inspection program sets, test event data.
IPC-2570 Supply Chain Communication (PDX)
SUPPLY CHAIN COMMUNICATIONS (PDX) - IPC-257X
PDX is the Product Data eXchange standard for the e-supply chain. Product Data eXchange is a multi-part standard, represented by the IPC 2570 series of specifications. The Product Data eXchange standardization effort is focused on the problem of communicating product content information between Original Equipment Manufacturers, Electronics Manufacturing Services providers and component suppliers. The standard is based on XML because this provides a simple yet powerful and flexible way to encode structured data into a format that is both human and machine-readable.
The Product Data eXchange standard provides a way to describe product content (Bill of Materials (BOM), Approved Manufacturer Lists (AML), Drawings, etc.), Engineering Change Requests (ECR), Engineering Change Orders (ECO) and Deviations in an eXtensible Markup Language (XML) format. This standard will enable dramatic efficiency improvements throughout the supply chain since partners will have a way to exchange product content and changes in a common language.
IPC-2571: 2001 Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)
This standard defines an XML encoding scheme that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The standard is designed to transfer technical information including bill of materials (BOM), approved manufacturer list (AML), as-built product configuration, and change (Engineering, Manufacturing, Product) information.
IPC-2576: 2001 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)
This sectional standard provides an XML encoding schema to allow electronics manufacturing supply chain partners to exchange as-built product configuration and manufacturing process information. The information represented by this standard may be used to continue to support products throughout their life cycles. The information represented in this standard includes: as-built product characteristics related to form, fit and function; serialization; batch/lot information; manufacturing site; manufacturing date; part number; component and sub-assembly data.
IPC-2578: 2001 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchange (PDX)
This sectional standard provides an XML encoding scheme to allow electronics manufacturing supply chain partners to exchange sufficient product data to enable distributed manufacturing. The information represented by this standard includes bills of material (BOM), approved manufacturer lists (AML), approved supplier lists (ASL), change history and engineering change orders, and a high-level description of the components listed on a bill of material.
IPC-2580 Application Specific Data
Several years ago, the National Electronic Manufacturing Initiative (NEMI) brought together the standards developers, tool developers, CAD users and CAM users. This group formed the foundation of the NEMI Convergence Project. Committees looked at the management and technical aspects of data transfer. Eventually, IPC undertook an ambitious project to provide the industry with a new layered neutral format.
The work continues through the effort of the IPC-2581 consortium. They have developed a complementary web page which may be reached through the following link: www.ipc2581.com
IPC-2581B: 2013 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
This standard continues to specify specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. The B revision enhances the methodology of specifying performance requirements as well as covering legal compliance with international environmental regulations. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.
IPC-2582: 2007 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description
This standard provides the information on administrative requirements used for the ordering, request for quote, or asking for changes to a particular printed board or printed board assembly. Since the requirements are important to every file in order to understand the file usage the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.
IPC-2583: 2007 Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description
This standard provides the information on design characteristic features intended to define the basic principles used for indicating how to document the manufacturing requirements and any special symbology needed in the data description hierarchy. Since the requirements are important to every file in order to understand the file usage, the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.
IPC-2584: 2007 Sectional Requirements for Implementation of Printed Board Fabrication Data Description
This standard (IPC-2584) provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard (IPC-2581) and some of the 2580 sectional standards that are required to accomplish the focused tasks. When other standards are invoked their requirements become a mandatory part of the fabrication details as defined in the IPC-2581.
IPC-2588: 2007 Sectional Requirements for Implementation of Part List Product Data Description
This standard (IPC-2588) provides the information on parts lists/ bill of materials for product data description and may be used for the ordering request for quote or asking for changes to a particular printed board or printed board assembly. Since the requirements are important to every file in order to understand the file usage, the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.
IPC-2221B Gerber Coupon Generator Subscription Service
THE CURE FOR YOUR TEST COUPON GENERATION HEADACHES IS HERE!!!
Getting a migraine from drafting and fabricating test coupon samples that are truly representative of the complex HDI and microvia structures that are prevalent throughout today’s printed board designs? IPC has the right prescription for you - take advantage of the IPC-2221B Gerber Coupon Generator that is exclusively available to IPC member companies! The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons. IPC compliant test coupons address blind, buried, stacked and staggered via structures. Don’t wait, purchase a subscription to the Gerber Coupon Generator now and start using and creating these new test coupons and get ahead of the competition.
A Little History:
IPC is focused on supporting the electronics industry and IPC member companies with the most current standards and products available today. To keep our member companies current with best practices in the electronics industry, IPC is offering a subscription service for generating Gerber files for the fabrication of updated test coupons necessary to meet current board design technologies.
The IPC-2221B, Generic Standard on Printed Board Designs, Appendix A test coupon designs were created to provide structural integrity verification when used for the acceptance of production lots of printed boards in accordance with IPC-6010 printed board performance series specifications. The most commonly used test coupons (AB, AB/R, and D) for product acceptance to these IPC specifications were initially released in 2016 and are updated periodically based on user feedback. We have now supplemented this tool with important additional features and new test coupons:
Additional coupon designs for surface mount solderability testing, moisture and insulation resistance (MIR) testing of laminated base materials and solder mask adhesion testing are slated for release later this year and will be incorporated into your subscription service free of additional charge.
IPC-2221B Appendix A Version 4.0 April 2022
Appendix A to IPC-2221B provides current test coupon designs as developed and maintained by the IPC 1-10c Test Coupon and Artwork Generation Task Group. These coupons are intended for qualification and conformance assessment to IPC-6010 printed board performance series specifications. This April 2022 version 4.0 file includes the new "D" coupon design for structural integrity assessment of plated holes, including through, blind, buried and staggered/stacked microvia structures. The file also includes an update to the “W” surface mount solderability test coupon.
Among the features of the IPC-2221B Gerber Coupon Generator subscription service is a simple, easy-to-use “Design Parameters/Input File,” that utilizes an auto quality check feature. This ensures design rules for the test designs established in IPC-2221B are automatically maintained before the Gerber Files are generated. What used to take hours to generate Gerber files from the CAD/CAM user will now only take minutes, thus freeing up the CAD/CAM user to work on other designs.
The IPC-2221B Gerber Coupon Generator is available to IPC Members at a discount, as an annual subscription service solution, meeting current printed board design parameters to generate Gerber Files of IPC-2221B test coupon designs at any time. This allows users to generate coupons when they want, and as often as they need them.
In the end, this cost-effective service provides an easy and straightforward way to obtain Gerber File Test Coupons that are compliant to industry approved IPC-2221B designs. It updates best practices for modern fabrication and automates testing for increased quality assurance.
If you have a subscription you can Log On to the Generator
Are you interested in the coupon generator you can purchase Here
Gerber Coupon Generator Questions
Queries on the usage of the IPC-2221B Gerber Coupon Generator program itself can be directed to JohnPerry@ipc.org.
IPC Printed Electronics Initiative
IPC Printed Electronics Initiative Mission Statement
Supporting the development of a true world market in printed electronics by facilitating international, consensus-based, industry standards.
IPC's Printed Electronics Initiative emphasizes collaborative efforts with other organizations to speed developments and create relevant standards and educational offerings. IPC's cooperative organizations include FlexTech, SEMI, Japan Printed Circuit Association (JPCA), International Electrotechnical Commission (IEC), NPES—The Association for Suppliers of Printing, Publishing and Converting Technologies and iNEMI.
IPC’s members are actively engaging in global printed electronics efforts through the development of industry standards. To date, the IPC Printed Electronics Committee has published:
Seeking Your Involvement in Draft Standards
The IPC Printed Electronics Committee seeks your company’s input into the following draft standards. These documents are all in the early stages of development.
To learn how you can participate in these standards or to join any of the working committees as a participant or observer, contact ChrisJorgensen@ipc.org.
There are several documents which provide information regarding Halogen Free:
IPC-J-STD-004B-WAM1, Requirements for Soldering Fluxes - includes Amendment 1 - this document provides information on classifying and characterizing of tin/lead and lead-free soldering flux materials, including details on halogen free.
IPC-J-STD-609B, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes - includes information on Halogen Free
IPC-1753-WAM1, Laboratory Report Standard - includes information on Halogen Free
IEC 61249-2-21, indicates the following conditions for Halogen Free - 900 ppm maximum chlorine, 900 ppm maximum bromine, 1500 ppm maximum total halogens
IPC maintains a listing of board fabricators that can provide test boards called out within the following IPC artwork files:
- B-24 boards referenced in IPC-A-24 Surface Insulation Resistance
- B-25 boards referenced in IPC-A-25 Multipurpose 1&2 Sided Test Pattern
- B-25A boards referenced in IPC-A-25A Multipurpose 1 Sided Test Pattern
- B-36 boards referenced in IPC-A-36 Cleaning Alternatives Artwork
- B-52 boards referenced in IPC-A-52 Cleanliness and Residue Evaluation Test Artwork
NOTE: The IPC-B-52 test board is intended to be a process qualification vehicle, with the materials of construction and source of test boards to be representative of the hardware being produced within the manufacturing process. As such, it is recommended that this test board be purchased as a commodity or stock item. It is recommended that this test board be fabricated by the manufacturer's chosen board supplier, using the chosen materials of construction for product assemblies.
IPC Test Boards Can Be Obtained From IPC Member Companies:
NTS Baltimore (formerly Trace Labs)
5 North Park Drive
Hunt Valley, MD 21030
NTS Anaheim (formerly Microtek)
1435 S. Allec Street
Anaheim CA 92805
Available Boards: IPC-B-24, IPC-B-25, IPC-B-25A, and IPC-B-36
Sunstone Circuits LLC.
13626 S. Freeman Road
Mulino, OR 97042
Available Boards: B-24, B-25, B-25A and B-36. B-25 and B-25A boards are normally not in stock so there are set minimums for ordering either of these two boards - Please contact us for availability.