IPC Standards Resource 

There are several products, tools and documents provided by IPC in support of the electronics industry. The information includes the standards specification tree, IPC Checklist, Why Manufacturers Need IPC Standards, and supporting councils. On these pages you will find PCB Tools and Calculators, Coupon Generator, Digital Data Exchange and information supporting the standards developed for the electronics industry.   

IPC Standards Specification Tree - provides all of the standards and IPC technical staff liaison responsibility

IPC Simplified Standards Specification Tree - suggested minimum standards companies should have in their standards libraries

Why Should Manufacturers Use IPC Standards - our lives depend on electronics, how do you know those electronics are manufactured with reliability, quality and consistency

IPC Checklist - a simple guide from start to finish of standards for producing rigid printed board assemblies

IPC Standardization Procedures - provides processes, structure and ANSI policy in the development of standards for the electronics industry 

Supplier Industry Standardized PWB Roadmap(ISPR) Tool
The IPC PWB Suppliers Council Steering Committee Roadmap Subcommittee has created this Industry Standardized PWB Roadmap (ISPR) tool to provide gap analysis, identify technology needs, and highlight opportunities for enabling technology for the IPC PWB suppliers community. Note: Please choose 'NO', when prompted, "The workshop you opened contains automatic links to information in another workbook…".

PCB Benchmark Database (PCQR2)
Printed Board Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard Database

Ticer Technologies Embedded Resistor Calculator
This downloadable resistor calculator is a tool used by printed board designers to select sheet resistivity while considering resistor size, shape and power handling capability. The tool can help the designer select one or more of the available TCR ohms per square sheet resistance values to capture and eliminate more surface mounted resistors. It also has an input for etch factors, which allows designers and fabricators to better predict the final tolerance of the finished resistor.  The calculator is available in both metric and imperial (inch) formats.

PentaLogix Viewmate
This downloadable program permits Gerber files to be imported and viewed.

IPC 25XX Standards

IPC-2500 CAMX Framework

CAMX Frameworks (IPC-250X)

Information flow is essential to efficient electronics manufacturing and standards are essential to information flow. One area of commerce that has lacked its own communication standards is the electronics manufacturing factory floor.

Information exchange between a system of electronic assembly equipment and higher-level applications has, in the past, used proprietary or borrowed standards.

The IPC-254X and IPC-255X series of standards address this issue by defining the messages needed for this information exchange. Just as “snail mail” and e-mail information exchanging requires standards for the envelope and transportation mechanisms – or messaging interface – so also do factory floor communications.

This standard describes a messaging interface that is based upon an architecture whereby a single logical middleware server (the Message Broker) exchanges messages among Clients in a Domain.

Clients may be electronics manufacturing equipment or software applications present in the domain. The Message Broker acts as an intelligent message router between these Clients, accomplishing both Point-to-Point and Publish/Subscribe communications.

IPC-2501: 2003 Definition for Web-Based Exchange of XML Data

This standard establishes the governing semantics and an XML based syntax for shop floor communication between electronic assembly equipment and associated software applications. IPC-2501 outlines the communication architecture and supporting XML messages. The standard also describes a messaging interface that is based upon an architecture whereby a single logical middleware server (the Message Broker) exchanges messages among Clients in a Domain.

Download IPC-2501 

IPC-2510  GenCAM Product Data

GENCAM Product Data - IPC-2511

GenCAM, simply put, is an ASCII format, driven by domain experts that represent printed board fabrication and test; list of materials, assembly, inspection and in-circuit test; as well as, documentation, administration, and configuration control management issues. These experts have worked for two years to make the GenCAM standard the most robust data description format of its time. GenCAM is: 

  • User friendly, easy to understand by manufacturing personnel
  • Segmented into twenty linked sections to eliminate the need for redundancy
  • A single file, able to completely describe a printed board, a printed board assembly, an assembly array, multiple assemblies on a sub-panel, a board fabrication panel, quality assessment coupons, and assembly/test fixtures.
  • Easy to implement into any design or manufacturing computer system.
  • Keyword driven, using terminology familiar to industry experts.
  • Manufacturing processes oriented, to enable future "plug & play technology."

IPC-2511B: 2002 (GenCAM 2.0) - XML Schema

In this version of GenCAM, the BNF code has been replaced by XML schema to facilitate web-based data transfer. In addition, new features have been added to the already robust description of the GenCAM data model.

Download IPC-2511B 

IPC-2511A: 2000 (GenCAM 1.0) - BNF code

This standard identifies the generic requirements for implementation of product manufacturing description data and transfer. The code reference is BNF.

IPC-2512A: 2000 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description

This standard is the sectional requirements for implementation of administration information related to ordering and specifying printed boards, printed board assemblies, fixtures, and components. IPC-2511 is a mandatory part of this standard.

IPC-2513A: 2000 Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description

This standard defines the sectional requirements for implementation of drawing methods for manufacturing data description. The IPC-2511 is a mandatory part of this standard.

IPC-2514A: 2000 Sectional Requirements for Implementation of Printed Board Fabrication Data Description

This standard defines the sectional requirements for implementation of printed board fabrication data description. IPC-2511 is a mandatory part of this standard.

IPC-2515A: 2000 Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description

This standard defines the sectional requirements for implementation of bare board product electrical testing data description. IPC-2511 is a mandatory part of this standard.

IPC-2516A: 2000 Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description

This standard defines the sectional requirements for implementation assembled board product manufacturing data description. IPC-2511 is a mandatory part of this standard.

IPC-2517A: 2000 Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description

This standard defines the sectional requirements for implementation of assembled board product manufacturing data description. IPC-2511 is a mandatory part of this standard.

IPC-2518A: 2000 Sectional Requirements for Implementation of Part List Product Data Description

This standard defines the sectional requirements for implementation of part list product data description. IPC-2511 is a mandatory part of this standard.

IPC-2520 Quality Product Data

IPC-2524: 1999 PWB Fabrication Data Quality Rating System

This standard describes a PWB fabrication data quality rating system used by fabricators to evaluate the incoming data package integrity. Printed board designers can also use this system as an output quality check.

Download IPC-2524 

IPC-2530 SRFF Process Data

STANDARD RECIPE FILE FORMAT (SRFF) - IPC-253X

The purpose of IPC-2531 standard recipe file format is to outline the requirements that an SRFF file must meet. The specification describes the file format, outlines the file sections, and indicates how data should be represented through objects. Objects can either be vendor independent (generic objects defined in this document) or vendor specific objects (objects created by a vendor). This document also includes error codes that should be used to report specific information about improperly constructed files. General guidelines for producing an SRFF file and vendor specific objects are also included.

IPC-2531: 1999 SMEMA Standard Recipe File Format Specification

This standard outlines the requirements that an SRFF file must meet. It describes the file format, outlines the file sections, and indicates how data should be represented through objects. Objects can either be vendor independent (generic objects defined in this document) or vendor specific objects (objects created by a vendor). This standard also includes error codes that should be used to report specific information about improperly constructed files.

Download IPC-2531 

IPC-2540  Shop Floor  Communication (CAMX)

SHOP FLOOR COMMUNICATION (CAMX) - IPC-254X

Factory Information Systems (FIS) form the nervous system of an enterprise, analysing data and delivering information to the machines and people who need to make information-based decisions. These systems provide a bi-directional flow of information between the factory floor and the rest of the enterprise. The National Electronics Manufacturing Initiative's (NEMI) Plug & Play Factory project addressed some critical problems involving factory information system deployment on the electronics manufacturing factory floor. The Plug & Play Factory project focused on the development of the standards necessary to achieve interoperability, or plug-and-play capability, on the factory floor. Activities were comprised of three areas:

  • Definition of standards for a software framework that will allow interoperability between equipment produced by different vendors.
  • Development of process-specific, machine communication interface standards for surface mount equipment. These standards will leverage the Generic Equipment Model (GEM) specification developed for semiconductor equipment and web-based standards for data transmission.
  • Establishment of a test-bed manufacturing line to prove out the concepts developed by the project.

IPC-2541: 2001 Generic Requirements for Electronics Manufacturing Shop-Floor Equipment Communication Messages (CAMX)

This standard establishes requirements and other considerations for the interchange of information between electronic manufacturing software equipment and factory information systems. Information may consist of attribute and parametric data, product data, process recipes, equipment monitoring and control, resource utilization and material consumption.

IPC-2546 w/Amend 1: 2003 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly

This standard establishes requirements and other considerations for the interchange of information between shop floor electronic assembly equipment and factory information systems. Information may consist of attribute and parametric data, product data, process recipes, equipment monitoring and control, resource utilization, and material consumption. . The download file also includes Amendment 2 Dispensing Equipment, Reflow Equipment and Final Assembly and Packaging, published in 2005

IPC-2547: 2002 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework

This standard establishes requirements and other considerations for the interchange of information between shop floor electronic inspection and test equipment and factory information systems. Information may consist of attribute and parametric data, product data, fixture files, test vectors, equipment monitoring and control, resource utilization, image data, test and inspection program sets, test event data.

IPC-2570 Supply Chain Communication (PDX)

SUPPLY CHAIN COMMUNICATIONS (PDX) - IPC-257X

PDX is the Product Data eXchange standard for the e-supply chain. Product Data eXchange is a multi-part standard, represented by the IPC 2570 series of specifications. The Product Data eXchange standardization effort is focused on the problem of communicating product content information between Original Equipment Manufacturers, Electronics Manufacturing Services providers and component suppliers. The standard is based on XML because this provides a simple yet powerful and flexible way to encode structured data into a format that is both human and machine-readable.

The Product Data eXchange standard provides a way to describe product content (Bill of Materials (BOM), Approved Manufacturer Lists (AML), Drawings, etc.), Engineering Change Requests (ECR), Engineering Change Orders (ECO) and Deviations in an eXtensible Markup Language (XML) format. This standard will enable dramatic efficiency improvements throughout the supply chain since partners will have a way to exchange product content and changes in a common language.

IPC-2571: 2001 Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)

This standard defines an XML encoding scheme that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The standard is designed to transfer technical information including bill of materials (BOM), approved manufacturer list (AML), as-built product configuration, and change (Engineering, Manufacturing, Product) information.

IPC-2576: 2001 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)

This sectional standard provides an XML encoding schema to allow electronics manufacturing supply chain partners to exchange as-built product configuration and manufacturing process information. The information represented by this standard may be used to continue to support products throughout their life cycles. The information represented in this standard includes: as-built product characteristics related to form, fit and function; serialization; batch/lot information; manufacturing site; manufacturing date; part number; component and sub-assembly data.

IPC-2578: 2001 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchange (PDX)

This sectional standard provides an XML encoding scheme to allow electronics manufacturing supply chain partners to exchange sufficient product data to enable distributed manufacturing. The information represented by this standard includes bills of material (BOM), approved manufacturer lists (AML), approved supplier lists (ASL), change history and engineering change orders, and a high-level description of the components listed on a bill of material.

IPC-2580  Application Specific Data

IPC-2581

Several years ago, the National Electronic Manufacturing Initiative (NEMI) brought together the standards developers, tool developers, CAD users and CAM users. This group formed the foundation of the NEMI Convergence Project. Committees looked at the management and technical aspects of data transfer. Eventually, IPC undertook an ambitious project to provide the industry with a new layered neutral format.

The work continues through the effort of the IPC-2581 consortium. They have developed a complementary web page which may be reached through the following link:  www.ipc2581.com

IPC-2581B: 2013  Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

This standard continues to specify specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. The B revision enhances the methodology of specifying performance requirements as well as covering legal compliance with international environmental regulations. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

IPC-2582: 2007 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description

This standard provides the information on administrative requirements used for the ordering, request for quote, or asking for changes to a particular printed board or printed board assembly. Since the requirements are important to every file in order to understand the file usage the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.

Download IPC-2582 

IPC-2583: 2007 Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description

This standard provides the information on design characteristic features intended to define the basic principles used for indicating how to document the manufacturing requirements and any special symbology needed in the data description hierarchy. Since the requirements are important to every file in order to understand the file usage, the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.

Download IPC-2583 

IPC-2584: 2007 Sectional Requirements for Implementation of Printed Board Fabrication Data Description

This standard (IPC-2584) provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard (IPC-2581) and some of the 2580 sectional standards that are required to accomplish the focused tasks. When other standards are invoked their requirements become a mandatory part of the fabrication details as defined in the IPC-2581.

Download IPC-2584 

IPC-2588: 2007 Sectional Requirements for Implementation of Part List Product Data Description

This standard (IPC-2588) provides the information on parts lists/ bill of materials for product data description and may be used for the ordering request for quote or asking for changes to a particular printed board or printed board assembly. Since the requirements are important to every file in order to understand the file usage, the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.

Download IPC-2588 

IPC-2221B Gerber Coupon Generator Subscription Service

THE CURE FOR YOUR TEST COUPON GENERATION HEADACHES IS HERE!!!

Getting a migraine from drafting and fabricating test coupon samples that are truly representative of the complex HDI and microvia structures that are prevalent throughout today’s printed board designs? IPC has the right prescription for you - take advantage of the IPC-2221B Gerber Coupon Generator that is exclusively available to IPC member companies! The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons. IPC compliant test coupons address blind, buried, stacked and staggered via structures. Don’t wait, purchase a subscription to the Gerber Coupon Generator now and start using and creating these new test coupons and get ahead of the competition.

A Little History:

IPC is focused on supporting the electronics industry and IPC member companies with the most current standards and products available today. To keep our member companies current with best practices in the electronics industry, IPC is offering a subscription service for generating Gerber files for the fabrication of updated test coupons necessary to meet current board design technologies.

The IPC-2221B, Generic Standard on Printed Board Designs, Appendix A test coupon designs were created to provide structural integrity verification when used for the acceptance of production lots of printed boards in accordance with IPC-6010 printed board performance series specifications. The most commonly used test coupons (AB, AB/R, and D) for product acceptance to these IPC specifications were initially released in 2016 and are updated periodically based on user feedback. We have now supplemented this tool with important additional features and new test coupons:

  • Updated “B” and “D” Coupon designs that support not only through-hole but also stacked and staggered (a.k.a. “propagated”) structures featuring blind and buried vias
  • Designated sections of the “B” coupon for both registration and structural integrity evaluations
  • The new “H” Coupon design for evaluating Surface Insulation Resistance (SIR)
  • The new “S” Coupon design for evaluating through-hole solderability
  • The new “P” Coupon design for evaluating the peel strength of outer layer metallic foils
  • The new “E” Coupon design for evaluating moisture and insulation resistance of laminated base materials
  • The new “W” Coupon design for evaluating surface mount land/pad solderability
  • The new “K” Coupon design for registration (internal spacing between plated holes and copper innerlayers)
  • The new “G” Coupon design for evaluating solder mask adhesion

Additional coupon designs for surface mount solderability testing, moisture and insulation resistance (MIR) testing of laminated base materials and solder mask adhesion testing are slated for release later this year, and will be incorporated into your subscription service free of additional charge.

IPC-2221B Appendix A Version 3.0 August 2019

Appendix A to IPC-2221B provides current test coupon designs as developed and maintained by the IPC 1-10c Test Coupon and Artwork Generation Task Group. These coupons are intended for qualification and conformance assessment to IPC-6010 printed board performance series specifications. This August 2019 version 3.0 file includes the new K coupon design for verification of internal spacing between plated holes and copper on internal layers (registration). The file also includes an update to the “W” surface mount solderability test coupon.
Download IPC-2221B Appendix A Version 3.0 August 2019

Features:

Among the features of the IPC-2221B Gerber Coupon Generator subscription service is a simple, easy-to-use “Design Parameters/Input File,” that utilizes an auto quality check feature. This ensures design rules for the test designs established in IPC-2221B are automatically maintained before the Gerber Files are generated.  What used to take hours to generate Gerber files from the CAD/CAM user will now only take minutes, thus freeing up the CAD/CAM user to work on other designs.

The IPC-2221B Gerber Coupon Generator is available to IPC Members only, as an annual subscription service solution, meeting current printed board design parameters to generate Gerber Files of IPC-2221B test coupon designs at any time. This allows users to generate coupons when they want, and as often as they need them.

Bottom Line:

In the end, this cost-effective service provides an easy and straightforward way to obtain Gerber File Test Coupons that are compliant to industry approved IPC-2221B designs. It updates best practices for modern fabrication and automates testing for increased quality assurance.

Subscription:

If you have a subscription you can Log On to the Generator

Are you interested in the coupon generator you can purchase Here

Gerber Coupon Generator Questions

Queries on the usage of the IPC-2221B Gerber Coupon Generator program itself can be directed to JohnPerry@ipc.org.

 

IPC Printed Electronics Initiative

IPC Printed Electronics Initiative Mission Statement

Supporting the development of a true world market in printed electronics by facilitating international, consensus-based, industry standards.

IPC's Printed Electronics Initiative emphasizes collaborative efforts with other organizations to speed developments and create relevant standards and educational offerings. IPC's cooperative organizations include FlexTech, SEMI, Japan Printed Circuit Association (JPCA), International Electrotechnical Commission (IEC), NPES—The Association for Suppliers of Printing, Publishing and Converting Technologies and iNEMI.

IPC’s members are actively engaging in global printed electronics efforts through the development of industry standards. To date, the IPC Printed Electronics Committee has published:

  • IPC/JPCA-2291, Design Guideline for Printed Electronics (2013)
  • IPC-4591A, Requirements for Printed Electronics Functional Conductive Materials (2018)
  • IPC-4921A, Requirements for Printed Electronics Base Materials (2017)
  • IPC/JPCA-6901, Application Categories for Printed Electronics (2015)
  • IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) (2018)

Seeking Your Involvement in Draft Standards

The IPC Printed Electronics Committee seeks your company’s input into the following draft standards. These documents are all in the early stages of development.

  • IPC-2292, Design Standard for Printed Electronics on Flexible Substrates
  • IPC-6902, Qualification and Performance Specifications for Printed Electronics

To learn how you can participate in these standards or to join any of the working committees as a participant or observer, contact ChrisJorgensen@ipc.org.