IPC-2515A: 2000 Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description

This standard defines the sectional requirements for implementation of bare board product electrical testing data description. IPC-2511 is a mandatory part of this standard.

IPC-2516A: 2000 Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description

This standard defines the sectional requirements for implementation assembled board product manufacturing data description. IPC-2511 is a mandatory part of this standard.

IPC-2517A: 2000 Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description

This standard defines the sectional requirements for implementation of assembled board product manufacturing data description. IPC-2511 is a mandatory part of this standard.

IPC-2518A: 2000 Sectional Requirements for Implementation of Part List Product Data Description

This standard defines the sectional requirements for implementation of part list product data description. IPC-2511 is a mandatory part of this standard.

IPC-2520 Quality Product Data

IPC-2524: 1999 PWB Fabrication Data Quality Rating System

This standard describes a PWB fabrication data quality rating system used by fabricators to evaluate the incoming data package integrity. Printed board designers can also use this system as an output quality check.

Download IPC-2524 here.

IPC-2530 SRFF Process Data

STANDARD RECIPE FILE FORMAT (SRFF) - IPC-253X

The purpose of IPC-2531 standard recipe file format is to outline the requirements that an SRFF file must meet. The specification describes the file format, outlines the file sections, and indicates how data should be represented through objects. Objects can either be vendor independent (generic objects defined in this document) or vendor specific objects (objects created by a vendor). This document also includes error codes that should be used to report specific information about improperly constructed files. General guidelines for producing an SRFF file and vendor specific objects are also included.

IPC-2531: 1999 SMEMA Standard Recipe File Format Specification

This standard outlines the requirements that an SRFF file must meet. It describes the file format, outlines the file sections, and indicates how data should be represented through objects. Objects can either be vendor independent (generic objects defined in this document) or vendor specific objects (objects created by a vendor). This standard also includes error codes that should be used to report specific information about improperly constructed files.

Download IPC-2531 

IPC-2540  Shop Floor  Communication (CAMX)

SHOP FLOOR COMMUNICATION (CAMX) - IPC-254X

Factory Information Systems (FIS) form the nervous system of an enterprise, analysing data and delivering information to the machines and people who need to make information-based decisions. These systems provide a bi-directional flow of information between the factory floor and the rest of the enterprise. The National Electronics Manufacturing Initiative's (NEMI) Plug & Play Factory project addressed some critical problems involving factory information system deployment on the electronics manufacturing factory floor. The Plug & Play Factory project focused on the development of the standards necessary to achieve interoperability, or plug-and-play capability, on the factory floor. Activities were comprised of three areas:

• Definition of standards for a software framework that will allow interoperability between equipment produced by different vendors.
• Development of process-specific, machine communication interface standards for surface mount equipment. These standards will leverage the Generic Equipment Model (GEM) specification developed for semiconductor equipment and web-based standards for data transmission.
• Establishment of a test-bed manufacturing line to prove out the concepts developed by the project.
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IPC-2541: 2001 Generic Requirements for Electronics Manufacturing Shop-Floor Equipment Communication Messages (CAMX)

This standard establishes requirements and other considerations for the interchange of information between electronic manufacturing software equipment and factory information systems. Information may consist of attribute and parametric data, product data, process recipes, equipment monitoring and control, resource utilization and material consumption.

DOWNLOAD IPC-2541

IPC-2546 w/Amend 1: 2003 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Assembly

This standard establishes requirements and other considerations for the interchange of information between shop floor electronic assembly equipment and factory information systems. Information may consist of attribute and parametric data, product data, process recipes, equipment monitoring and control, resource utilization, and material consumption. Amendment 2: Dispensing Equipment, Reflow Equipment and Final Assembly and Packaging was published in 2005.

IPC-2547: 2002 Sectional Requirements for Shop-Floor Equipment Communication Messages (CAMX) for Printed Circuit Board Test, Inspection and Rework

This standard establishes requirements and other considerations for the interchange of information between shop floor electronic inspection and test equipment and factory information systems. Information may consist of attribute and parametric data, product data, fixture files, test vectors, equipment monitoring and control, resource utilization, image data, test and inspection program sets, test event data.

IPC-2570 Supply Chain Communication (PDX)

SUPPLY CHAIN COMMUNICATIONS (PDX) - IPC-257X

PDX is the Product Data eXchange standard for the e-supply chain. Product Data eXchange is a multi-part standard, represented by the IPC 2570 series of specifications. The Product Data eXchange standardization effort is focused on the problem of communicating product content information between Original Equipment Manufacturers, Electronics Manufacturing Services providers and component suppliers. The standard is based on XML because this provides a simple yet powerful and flexible way to encode structured data into a format that is both human and machine-readable.

The Product Data eXchange standard provides a way to describe product content (Bill of Materials (BOM), Approved Manufacturer Lists (AML), Drawings, etc.), Engineering Change Requests (ECR), Engineering Change Orders (ECO) and Deviations in an eXtensible Markup Language (XML) format. This standard will enable dramatic efficiency improvements throughout the supply chain since partners will have a way to exchange product content and changes in a common language.

IPC-2571: 2001 Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)

This standard defines an XML encoding scheme that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions. The standard is designed to transfer technical information including bill of materials (BOM), approved manufacturer list (AML), as-built product configuration, and change (Engineering, Manufacturing, Product) information.

IPC-2576: 2001 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)

This sectional standard provides an XML encoding schema to allow electronics manufacturing supply chain partners to exchange as-built product configuration and manufacturing process information. The information represented by this standard may be used to continue to support products throughout their life cycles. The information represented in this standard includes: as-built product characteristics related to form, fit and function; serialization; batch/lot information; manufacturing site; manufacturing date; part number; component and sub-assembly data.

IPC-2578: 2001 Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchange (PDX)

This sectional standard provides an XML encoding scheme to allow electronics manufacturing supply chain partners to exchange sufficient product data to enable distributed manufacturing. The information represented by this standard includes bills of material (BOM), approved manufacturer lists (AML), approved supplier lists (ASL), change history and engineering change orders, and a high-level description of the components listed on a bill of material.

IPC-2580  Application Specific Data

IPC-2581

Several years ago, the National Electronic Manufacturing Initiative (NEMI) brought together the standards developers, tool developers, CAD users and CAM users. This group formed the foundation of the NEMI Convergence Project. Committees looked at the management and technical aspects of data transfer. Eventually, IPC undertook an ambitious project to provide the industry with a new layered neutral format.

The work continues through the effort of the IPC-2581 consortium. They have developed a complementary web page which may be reached through the following link:  www.ipc2581.com

IPC-2581B: 2013  Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

This standard continues to specify specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. The B revision enhances the methodology of specifying performance requirements as well as covering legal compliance with international environmental regulations. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.

IPC-2582: 2007 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description

This standard provides the information on administrative requirements used for the ordering, request for quote, or asking for changes to a particular printed board or printed board assembly. Since the requirements are important to every file in order to understand the file usage the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.

Download IPC-2582 here.

IPC-2583: 2007 Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description

This standard provides the information on design characteristic features intended to define the basic principles used for indicating how to document the manufacturing requirements and any special symbology needed in the data description hierarchy. Since the requirements are important to every file in order to understand the file usage, the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.

Download IPC-2583 here.

IPC-2584: 2007 Sectional Requirements for Implementation of Printed Board Fabrication Data Description

This standard (IPC-2584) provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard (IPC-2581) and some of the 2580 sectional standards that are required to accomplish the focused tasks. When other standards are invoked their requirements become a mandatory part of the fabrication details as defined in the IPC-2581.

Download IPC-2584 here.

IPC-2588: 2007 Sectional Requirements for Implementation of Part List Product Data Description

This standard (IPC-2588) provides the information on parts lists/ bill of materials for product data description and may be used for the ordering request for quote or asking for changes to a particular printed board or printed board assembly. Since the requirements are important to every file in order to understand the file usage, the XML schema is reused in every Business to Business transaction. This standard calls out the details defined in the generic standard (IPC-2581) that are required to accomplish these focused tasks.

Download IPC-2588 here. 

IPC-2221B Gerber Coupon Generator Subscription Service

THE CURE FOR YOUR TEST COUPON GENERATION HEADACHES IS HERE!!!

Getting a migraine from drafting and fabricating test coupon samples that are truly representative of the complex HDI and microvia structures that are prevalent throughout today’s printed board designs? IPC has the right prescription for you - take advantage of the IPC-2221B Gerber Coupon Generator that is exclusively available to IPC member companies! The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons. IPC compliant test coupons address blind, buried, stacked and staggered via structures. Don’t wait, purchase a subscription to the Gerber Coupon Generator now and start using and creating these new test coupons and get ahead of the competition.

A Little History:

IPC is focused on supporting the electronics industry and IPC member companies with the most current standards and products available today. To keep our member companies current with best practices in the electronics industry, IPC is offering a subscription service for generating Gerber files for the fabrication of updated test coupons necessary to meet current board design technologies.

The IPC-2221B, Generic Standard on Printed Board Designs, Appendix A test coupon designs were created to provide structural integrity verification when used for the acceptance of production lots of printed boards in accordance with IPC-6010 printed board performance series specifications. The most commonly used test coupons (AB, AB/R, and D) for product acceptance to these IPC specifications were initially released in 2016 and are updated periodically based on user feedback. We have now supplemented this tool with important additional features and new test coupons:

• Updated “B” and “D” Coupon designs that support not only through-hole but also stacked and staggered (a.k.a. “propagated”) structures featuring blind and buried vias
• Designated sections of the “B” coupon for both registration and structural integrity evaluations
• The new “H” Coupon design for evaluating Surface Insulation Resistance (SIR)
• The new “S” Coupon design for evaluating through-hole solderability
• The new “P” Coupon design for evaluating the peel strength of outer layer metallic foils
• The new “E” Coupon design for evaluating moisture and insulation resistance of laminated base materials
• The new “W” Coupon design for evaluating surface mount land/pad solderability
• The new “K” Coupon design for registration (internal spacing between plated holes and copper innerlayers)
• The new “G” Coupon design for evaluating solder mask adhesion
• The new "D" Coupon design AB daisy-chain via coupon for propagated structures 

Additional coupon designs for surface mount solderability testing, moisture and insulation resistance (MIR) testing of laminated base materials and solder mask adhesion testing are slated for release later this year and will be incorporated into your subscription service free of additional charge.

IPC-2221B Appendix A Version 4.0 April 2022

Appendix A to IPC-2221B provides current test coupon designs as developed and maintained by the IPC 1-10c Test Coupon and Artwork Generation Task Group. These coupons are intended for qualification and conformance assessment to IPC-6010 printed board performance series specifications. This April 2022 version 4.0 file includes the new "D" coupon design for structural integrity assessment of plated holes, including through, blind, buried and staggered/stacked microvia structures. The file also includes an update to the “W” surface mount solderability test coupon.
Download IPC-2221B Appendix A Version 4.0 April 2022

Features:

Among the features of the IPC-2221B Gerber Coupon Generator subscription service is a simple, easy-to-use “Design Parameters/Input File,” that utilizes an auto quality check feature. This ensures design rules for the test designs established in IPC-2221B are automatically maintained before the Gerber Files are generated.  What used to take hours to generate Gerber files from the CAD/CAM user will now only take minutes, thus freeing up the CAD/CAM user to work on other designs.

The IPC-2221B Gerber Coupon Generator is available to IPC Members at a discount, as an annual subscription service solution, meeting current printed board design parameters to generate Gerber Files of IPC-2221B test coupon designs at any time. This allows users to generate coupons when they want, and as often as they need them.

Bottom Line:

In the end, this cost-effective service provides an easy and straightforward way to obtain Gerber File Test Coupons that are compliant to industry approved IPC-2221B designs. It updates best practices for modern fabrication and automates testing for increased quality assurance.

Subscription:

If you have a subscription you can Log On to the Generator

Are you interested in the coupon generator you can purchase Here

Gerber Coupon Generator Questions

Queries on the usage of the IPC-2221B Gerber Coupon Generator program itself can be directed to JohnPerry@ipc.org.

IPC Printed Electronics Initiative

IPC Printed Electronics Initiative Mission Statement

Supporting the development of a true world market in printed electronics by facilitating international, consensus-based, industry standards.

IPC's Printed Electronics Initiative emphasizes collaborative efforts with other organizations to speed developments and create relevant standards and educational offerings. IPC's cooperative organizations include FlexTech, SEMI, Japan Printed Circuit Association (JPCA), International Electrotechnical Commission (IEC), NPES—The Association for Suppliers of Printing, Publishing and Converting Technologies and iNEMI.

IPC’s members are actively engaging in global printed electronics efforts through the development of industry standards. To date, the IPC Printed Electronics Committee has published:

• IPC/JPCA-2291, Design Guideline for Printed Electronics (2013)
• IPC-4591A, Requirements for Printed Electronics Functional Conductive Materials (2018)
• IPC-4921A, Requirements for Printed Electronics Base Materials (2017)
• IPC/JPCA-6901, Application Categories for Printed Electronics (2015)
• IPC-6903, Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry) (2018)

Seeking Your Involvement in Draft Standards

The IPC Printed Electronics Committee seeks your company’s input into the following draft standards. These documents are all in the early stages of development.

• IPC-2292, Design Standard for Printed Electronics on Flexible Substrates
• IPC-6902, Qualification and Performance Specifications for Printed Electronics

To learn how you can participate in these standards or to join any of the working committees as a participant or observer, contact ChrisJorgensen@ipc.org.